Abstract: The disclosure provides a compound of formula (I) for treating cerebral infarction, a pharmaceutical composition comprising the compound, a method of manufacturing a pharmaceutical composition for treating cerebral infarction comprising use of the compound, use of the compound for manufacturing a pharmaceutical composition for treating cerebral infarction, or a method for treating cerebral infarction comprising administering the compound or the pharmaceutical composition. The cerebral infarction includes, for example, lacunar infarction, atherothrombotic cerebral infarction, and cardiogenic embolism.

Abstract: A method for opening resist in raised areas of a semiconductor device, in accordance with the present invention, includes forming a conductive layer over a channel insulator layer to form a raised portion which includes a height above a substantially planar surrounding area. The channel insulator layer is aligned to a gate electrode. A photoresist layer is formed over the raised portion and the surrounding area and the photoresist is patterned by employing a gray scale light mask to reduce exposure light on the photoresist on the conductive layer over the raised portion such that after developing the photoresist, the photoresist is removed over a top surface of the raised portion but remains in the surrounding area. The conductive layer is etched in accordance with the photoresist to form source and drain electrodes which are self aligned to the channel insulator layer.

Abstract: A method for opening resist in raised areas of a semiconductor device. In one aspect, a conductive layer is formed over a channel insulator layer to form a raised portion including a height above a substantially planar surrounding area, the channel insulator layer being aligned to a gate electrode. A photoresist layer is formed over the raised portion and the surrounding area, and patterned by employing a gray scale light mask to reduce exposure light on the photoresist over the raised portion. Then, the photoresist is etched to thin it such that a gap is formed in the photoresist down to the conductive layer over the raised portion, but the photoresist remains everywhere else, and the conductive layer is etched in accordance with the photoresist to form source and drain electrodes which are self aligned to the channel insulator layer.