Patents by Inventor Hisanori Matsuo

Hisanori Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190126428
    Abstract: A heat exchanger capable of preventing sticking of slurry is disclosed. The heat exchanger includes: a flow passage structure having a heating flow passage and a cooling flow passage formed therein; and a water-repellent material covering a side surface of the flow passage structure. A side surface of the heat exchanger is constituted by the water-repellent material.
    Type: Application
    Filed: October 29, 2018
    Publication date: May 2, 2019
    Inventors: Toru MARUYAMA, Yasuyuki MOTOSHIMA, Hisanori MATSUO, Masashi KABASAWA
  • Publication number: 20190118334
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA
  • Patent number: 10259098
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: April 16, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
  • Patent number: 10195712
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: February 5, 2019
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Publication number: 20180222007
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 9, 2018
    Inventors: Yasuyuki MOTOSHIMA, Toru MARUYAMA, Hisanori MATSUO
  • Patent number: 10035238
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 31, 2018
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Patent number: 9969046
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: May 15, 2018
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
  • Publication number: 20180021917
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Application
    Filed: September 6, 2017
    Publication date: January 25, 2018
    Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA
  • Publication number: 20180015590
    Abstract: The present invention relates to a CMP apparatus having a polishing pad surface property measuring device for measuring surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer.
    Type: Application
    Filed: January 7, 2016
    Publication date: January 18, 2018
    Inventor: Hisanori MATSUO
  • Publication number: 20170361420
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Application
    Filed: September 6, 2017
    Publication date: December 21, 2017
    Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA
  • Patent number: 9782870
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Publication number: 20170239778
    Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.
    Type: Application
    Filed: February 17, 2017
    Publication date: August 24, 2017
    Applicant: Ebara Corporation
    Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA, Yohei ETO, Mitsunori KOMATSU
  • Patent number: 9669515
    Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 6, 2017
    Assignees: Ebara Corporation, Kyushu Institute of Technology
    Inventors: Hisanori Matsuo, Yoshihiro Mochizuki, Keisuke Suzuki, Takahiro Tajiri, Souichirou Ichioka
  • Patent number: 9579768
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: February 28, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
  • Patent number: 9393670
    Abstract: There is disclosed a measuring method of a surface roughness of a polishing pad which can measure a surface roughness index of the polishing pad showing a strong relationship with polishing performance. A method for measuring a surface roughness of a polishing pad includes acquiring an image of a surface of a polishing pad by using a laser microscope, selecting only a region which has a height larger than an average height from the acquired image, and calculating a surface roughness from only the selected region.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: July 19, 2016
    Assignee: EBARA CORPORATION
    Inventor: Hisanori Matsuo
  • Publication number: 20160184960
    Abstract: A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 30, 2016
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Keisuke SUZUKI, Takahiro TAJIRI, Panart KHAJORNRUNGRUANG
  • Patent number: 9242339
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 26, 2016
    Assignee: Ebara Corporation
    Inventors: Hisanori Matsuo, Yoshihiro Mochizuki, Chikako Takatoh, Tadashi Obo
  • Publication number: 20150346088
    Abstract: A method for judging polishing performance of a polishing liquid, which can judge freshness of a slurry by measuring a component concentration or a physical quantity corresponding to the component concentration of the slurry after polishing and by evaluating an accelerator component and an inhibitor component of the slurry is disclosed. The polishing performance judging method of a polishing liquid judges polishing performance of a polishing liquid containing an accelerator for promoting dissolution of an object to be polished and an inhibitor for inhibiting dissolution of the object to be polished. The method includes analyzing a polishing waste liquid by spectroscopy, selecting a plurality of wavelengths from wavelengths which can distinguish the accelerator, the inhibitor, and a complex compound of the accelerator and a metal to be polished, and measuring absorbance at the selected plurality of wavelengths to thereby judge the polishing performance of the polishing liquid.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 3, 2015
    Inventors: Chikako TAKATOH, Yumiko NAKAMURA, Tadashi OBO, Hisanori MATSUO
  • Patent number: 9156130
    Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: October 13, 2015
    Assignee: Ebara Corporation
    Inventors: Takahiro Shimano, Mutsumi Tanikawa, Hisanori Matsuo, Kuniaki Yamaguchi, Katsuhide Watanabe
  • Publication number: 20150283669
    Abstract: A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed.
    Type: Application
    Filed: March 11, 2015
    Publication date: October 8, 2015
    Inventors: Hisanori MATSUO, Yoshihiro MOCHIZUKI, Keisuke SUZUKI, Takahiro TAJIRI, Souichirou ICHIOKA