Abstract: A high-frequency module (1) includes a mounting substrate (90), a transmission filter (6MT) arranged on the mounting substrate (90), a reception filter (6MR) arranged on the mounting substrate (90), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the reception filter (6MR) of the transmission filter (6MT) and the reception filter (6MR).

Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

Abstract: A coupler module includes a coupler component formed with a main line and a sub-line that configure a directional coupler, and a module substrate on which the coupler component is mounted and on which a wiring conductor coupled in series with the main line is formed. At least a part of the wiring conductor is along the main line in plan view of the module substrate, and a direction of a main signal flowing through the main line and a direction of the main signal flowing through the part of the wiring conductor are opposite to each other.

Abstract: To provide a radio-frequency module and a communication apparatus capable of achieving more excellent impedance characteristics. A radio-frequency module includes a first acoustic-wave filter (a first reception filter), a second acoustic-wave filter (a second reception filter), a switch (an antenna switch), a first inductor, and a second inductor. The first acoustic-wave filter transmits a signal in a first communication band. The second acoustic-wave filter transmits a signal in a second communication band. The first inductor is provided between ground and a node on a signal path (a second reception path) with which the switch is connected to the second acoustic-wave filter. The second inductor is connected in series between the switch and the first inductor on the signal path.

Abstract: A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

Abstract: A filter module includes a first ground terminal, a second ground terminal, a low pass filter, and a second inductor. The low pass filter includes a first inductor provided in an input/output path of signal, a first capacitor provided in a first path connecting a first node and the first ground terminal, and a second capacitor provided in a second path connecting a second node and the second ground terminal. The second inductor is connected in series to the second capacitor in a path connecting the second capacitor and the second ground terminal. The first path and the second path are not connected to each other by any path except the one between the first node and the second node.

Abstract: A directional coupler includes: a main line; a sub line; a first switch, a first end of which is directly connected to one end of the sub line and a second end of which is connected to a first signal path that extends to an isolation port (ISO), which is a first port; and a second switch, a first end of which is directly connected to another end of the sub line and a second end of which is connected to a second signal path that extends to a coupling port (CPL), which is a second port.

Abstract: A high-frequency module (1) includes a mounting substrate (90), a duplexer (60L) arranged on the mounting substrate (90), a duplexer (60H) arranged on the mounting substrate (90) and having a pass band with a higher frequency than a pass band of the duplexer (60L), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the duplexer (60L) of the duplexers (60L and 60H).

Abstract: A high-frequency module (1) includes a mounting substrate (90), a transmission filter (6MT) arranged on the mounting substrate (90), a reception filter (6MR) arranged on the mounting substrate (90), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the reception filter (6MR) of the transmission filter (6MT) and the reception filter (6MR).

Abstract: A coupler module (1) includes a coupler component (10) formed with a main line (11) and a sub-line (12) that configure a directional coupler, and a module substrate (20) on which the coupler component (10) is mounted and on which a wiring conductor coupled in series with the main line (11) is formed. At least a part of the wiring conductor is along the main line (11) in plan view of the module substrate (20), and a direction of a main signal flowing through the main line (11) and a direction of the main signal flowing through the part of the wiring conductor are opposite to each other.

Abstract: A coupler module (1) includes a first component (11) and a second component (21) that are mounted on a substrate. The first component (11) includes a coupler (100) having a main line and an auxiliary line, and the second component (21) includes an external circuit for processing a signal that flows into the main line or the auxiliary line and a plurality of first signal terminals (P5, P6) that are input and output terminals of the external circuit for the signal. The plurality of first signal terminals (P5, P6) are arranged in a first portion (A1) that is one of two portions (A1, A2) obtained by dividing the second component (21) and that is farther from the first component (11).

Abstract: A directional coupler includes: a main line; a sub line; a first switch, a first end of which is directly connected to one end of the sub line and a second end of which is connected to a first signal path that extends to an isolation port (ISO), which is a first port; and a second switch, a first end of which is directly connected to another end of the sub line and a second end of which is connected to a second signal path that extends to a coupling port (CPL), which is a second port.

Abstract: A filter module includes a first ground terminal, a second ground terminal, a low pass filter, and a second inductor. The low pass filter includes a first inductor provided in an input/output path of signal, a first capacitor provided in a first path connecting a first node and the first ground terminal, and a second capacitor provided in a second path connecting a second node and the second ground terminal. The second inductor is connected in series to the second capacitor in a path connecting the second capacitor and the second ground terminal. The first path and the second path are not connected to each other by any path except the one between the first node and the second node.

Abstract: A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

Abstract: A high-frequency module includes port electrodes defining external connection terminals provided on a multilayer body including dielectric layers. A first port electrode is connected to an antenna. A plurality of port electrodes other than the first port electrode are respectively connected to communication systems supporting respective frequency bands. The first port electrode is connected to the plurality of other port electrodes through a plurality of switch elements. A first group of the plurality of switch elements and a second group of the plurality of switch elements are not connected to each other within a switch circuit and are connectable to each other through a common terminal outside of the switch circuit. As a result, a high-frequency module that allows a design change to be made using the same switch circuit without changing the switch circuit is provided.

Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.

Abstract: A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.

Abstract: A high frequency module includes RF terminal lands at a first layer that is a surface layer of a multilayer substrate on which RF terminal electrodes of a switch IC are mounted that are arranged in a line. Each of the RF terminal lands is electrically connected to one end of a lead electrode at a second layer via a via hole. Some of the lead electrodes extend from corresponding ones of the RF terminal lands in an outward direction away from a side of the switch IC. The remaining ones of the lead electrodes extend from corresponding ones of the RF terminal lands in an inward direction that is opposite to the outward direction.

Abstract: A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.

Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.