Patents by Inventor Hisanori Takiguchi

Hisanori Takiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper plating bath formulation
    Patent number: 7857961
    Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: December 28, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi
  • Copper plating process
    Patent number: 7857960
    Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: December 28, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi
  • Copper plating process
    Publication number: 20090038949
    Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 12, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi
  • Copper plating bath formulation
    Publication number: 20090038951
    Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 12, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi