Patents by Inventor Hisanori Terui

Hisanori Terui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10023941
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: July 17, 2018
    Assignee: KITZ CORPORATION
    Inventors: Hidenobu Tameda, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
  • Patent number: 10006106
    Abstract: Provided is a brass alloy excellent in recyclability and corrosion resistance while avoiding the addition of Bi and Si, and with which machinability is ensured and processing is facilitated with preventing inclusion of lead. The present invention includes at least 58.0 to 63.0 mass % of Cu, 1.0 to 2.0 mass % of Sn and 0.05 to 0.29 mass % of Sb and the remainder composed of Zn and unavoidable impurities. With the present invention, stress corrosion crack resistance and machinability are improved. 0.05 to 1.5 mass % of Ni is included in a copper alloy to improve stress corrosion crack resistance as a result of the interaction between Ni and Sb. Furthermore, 0.05 to 0.2 mass % of P is included to improve anti-dezincification properties.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: June 26, 2018
    Assignees: KITZ CORPORATION, KITZ METALWORKS CORPORATION
    Inventors: Hidenobu Tameda, Hisanori Terui, Kei Ito, Tomoyuki Ozasa
  • Publication number: 20150275333
    Abstract: Provided is a brass alloy excellent in recyclability and corrosion resistance while avoiding the addition of Bi and Si, and with which machinability is ensured and processing is facilitated with preventing inclusion of lead. The present invention includes at least 58.0 to 63.0 mass % of Cu, 1.0 to 2.0 mass % of Sn and 0.05 to 0.29 mass % of Sb and the remainder composed of Zn and unavoidable impurities. With the present invention, stress corrosion crack resistance and machinability are improved. 0.05 to 1.5 mass % of Ni is included in a copper alloy to improve stress corrosion crack resistance as a result of the interaction between Ni and Sb. Furthermore, 0.05 to 0.2 mass % of P is included to improve anti-dezincification properties.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 1, 2015
    Inventors: Hidenobu Tameda, Hisanori Terui, Kei Ito, Tomoyuki Ozasa
  • Patent number: 8366840
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: February 5, 2013
    Assignee: Kitz Corporation
    Inventors: Hidenobu Tameda, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
  • Patent number: 7806996
    Abstract: A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0<Se?0.35 wt %, 0<P?0.5, one of 0<Sb?2.2 wt % and 0<Ni?4.8 wt %, and a balance of Cu and unavoidable impurities. It may essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0?Se?0.35 wt %, 0<P<0.5 wt %, one of 0<Sb?2.2 wt % and 0<Ni?4.8 wt %, 1.20 to 4.90 Vol. % of at least one selected from the group consisting of a non-solid solution substance secured with Bi and a non-solid solution secured with Bi and Se, and a balance of Cu and unavoidable impurities.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: October 5, 2010
    Assignee: Kitz Corporation
    Inventors: Kazuhito Kurose, Yukihiro Hirata, Tomoyuki Ozasa, Hisanori Terui
  • Publication number: 20090297390
    Abstract: By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with ? phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an ?+? structure or ?+?+? structure and having ? phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.
    Type: Application
    Filed: December 28, 2007
    Publication date: December 3, 2009
    Inventors: Tameda Hidenobu, Kazuhito Kurose, Teruhiko Horigome, Tomoyuki Ozasa, Hisanori Terui, Masaru Yamazaki, Hideki Kotsuji
  • Publication number: 20090220375
    Abstract: The object of the present invention is to provide a bronze-based alloy of low lead content, first improved in tensile strength at high temperatures, secondly contributing to the promotion of the environmental conservation including recycling, while avoiding the adverse effect of lead on human bodies by means of reduction of a lead content, and excellent from the standpoints of mass-productivity and manufacturing cost. The alloy includes 2.0 to 6.0 mass % of Sn, 3.0 to 10.0 mass % of Zn, 0.1 to 3.0 mass % of Bi, 0.1 mass %<P?0.6 mass % and the remainder of Cu and unavoidable impurities to improve the tensile strength thereof at high temperatures.
    Type: Application
    Filed: August 30, 2006
    Publication date: September 3, 2009
    Inventors: Tomoyuki Ozasa, Hisanori Terui, Hidenobu Tameda, Teruhiko Horigome, Kazuhito Kurose
  • Publication number: 20080145265
    Abstract: This invention has for an object thereof the provision of a leadless copper-based alloy which mends the deterioration of tensile strength at elevated temperatures and enables the mechanical properties thereof to approximate the CAC406 by forming in the alloy texture thereof an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. For the purpose of accomplishing the object, this invention incorporates in the copper-based alloy an additive element capable of forming an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. The additive element is one or more members selected from the group consisting of Te, P, Zr, Ti, Co, In, Ca, B and misch metal.
    Type: Application
    Filed: December 28, 2007
    Publication date: June 19, 2008
    Inventors: Kazuhito Kurose, Tomoyuki Ozasa, Masaki Matsuo, Hisanori Terui, Rokurou Kawanishi
  • Patent number: 7297215
    Abstract: By exactly comprehending the true properties of the rare elements (such as Bi and Se) which are alternative components for Pb, the alloy is enabled to secure machinability equal to the bronze alloy (CAC406) generally used hitherto and acquire mechanical properties at least equal to the CAC406 as well in spite of a decrease in the content of the rare elements (such as Bi and Se) in the alloy. Further, it is possible to suppress the occurrence of casting defects by elucidating the unresolved influence of the decrease of the alternative components (such as Bi and Se) for Pb on the wholesomeness of a casting. Moreover, it is possible, by decreasing the rare elements, to produce a copper-based alloy containing rare elements at a low cost and to provide a cast ingot and a liquid-contacting part each using the alloy. The copper-based alloy, and the cast ingot and liquid-contacting part each using the alloy individually contain at least 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi and satisfying 0<Se?0.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: November 20, 2007
    Assignee: Kitz Corporation
    Inventors: Kazuhito Kurose, Yukihiro Hirata, Tomoyuki Ozasa, Hisanori Terui
  • Publication number: 20070243096
    Abstract: A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0<Se?0.35 wt %, 0<P?0.5, one of 0<Sb?2.2 wt % and 0<Ni?4.8 wt %, and a balance of Cu and unavoidable impurities. It may essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0?Se?0.35 wt %, 0<P<0.5 wt %, one of 0<Sb?2.2 wt % and 0<Ni?4.8 wt %, 1.20 to 4.90 Vol. % of at least one selected from the group consisting of a non-solid solution substance secured with Bi and a non-solid solution secured with Bi and Se, and a balance of Cu and unavoidable impurities.
    Type: Application
    Filed: May 11, 2007
    Publication date: October 18, 2007
    Inventors: Kazuhito Kurose, Yukihiro Hirata, Tomoyuki Ozasa, Hisanori Terui
  • Publication number: 20060225816
    Abstract: This invention has for an object thereof the provision of a leadless copper-based alloy which mends the deterioration of tensile strength at elevated temperatures and enables the mechanical properties thereof to approximate the CAC406 by forming in the alloy texture thereof an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. For the purpose of accomplishing the object, this invention incorporates in the copper-based alloy an additive element capable of forming an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. The additive element is one or more members selected from the group consisting of Te, P, Zr, Ti, Co, In, Ca, B and misch metal.
    Type: Application
    Filed: April 1, 2004
    Publication date: October 12, 2006
    Inventors: Kazuhito Kurose, Masaki Matsuo, Hisanori Terui, Rokurou Kawanishi
  • Publication number: 20060005901
    Abstract: By exactly comprehending the true properties of the rare elements (such as Bi and Se) which are alternative components for Pb, the alloy is enabled to secure machinability equal to the bronze alloy (CAC406) generally used hitherto and acquire mechanical properties at least equal to the CAC406 as well in spite of a decrease in the content of the rare elements (such as Bi and Se) in the alloy. Further, it is possible to suppress the occurrence of casting defects by elucidating the unresolved influence of the decrease of the alternative components (such as Bi and Se) for Pb on the wholesomeness of a casting. Moreover, it is possible, by decreasing the rare elements, to produce a copper-based alloy containing rare elements at a low cost and to provide a cast ingot and a liquid-contacting part each using the alloy. The copper-based alloy, and the cast ingot and liquid-contacting part each using the alloy individually contain at least 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi and satisfying 0<Se?0.
    Type: Application
    Filed: September 9, 2003
    Publication date: January 12, 2006
    Inventors: Kazuhito Kurose, Yukihiro Harata, Tomoyuki Ozasa, Hisanori Terui