Patents by Inventor Hisao Aota

Hisao Aota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10773426
    Abstract: A resin molding mold in accordance with the present application is a resin molding mold for molding a resin molded product. The resin molding mold includes a molding mold and a mirror-surface coat layer formed on a mold surface of the molding mold. The mirror-surface coat layer is formed by a thermosetting resin having a thermal conductivity in a range from 0.10 W/(mK) or more to 0.99 W/(mK) or less. The thickness of the mirror-surface coat layer is set in a range from 1.0 ?m or more to 30 ?m or less, and is preferably set to 20 ?m or less. The surface of the mirror-surface coat layer is provided with a flat-surface maintaining part formed into a substantially flat surface.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: September 15, 2020
    Assignee: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Masayuki Sakai, Hisao Aota
  • Patent number: 10124514
    Abstract: To provide a resin molding mold capable of forming a resin molded product having embossing in which by controlling appearance of gloss, its texture is improved, and the resin molded product is prevented from occurrence of white blurring on the surface on which the molded embossing is formed. A resin molding mold in accordance with the present application is used for molding a resin molded product having embossing formed thereon. The resin molding mold includes a molding mold and a buffer layer formed on an inside mold surface of the molding mold. The buffer layer is formed by a mixture of a thermosetting resin and fine particles having substantially spherical shapes. The fine particles have a bulk specific gravity in a range from 0.4 g/ml or more to 0.9 g/ml or less, and on the surface of the buffer layer, a plurality of gloss adjusting convex portions having substantially spherical shapes derived from the fine particles are formed.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: November 13, 2018
    Assignee: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Masayuki Sakai, Hisao Aota
  • Publication number: 20170225364
    Abstract: To provide a resin molding mold capable of generating gloss on a resin molded product surface comparatively easily, even when the resin molding mold has concavo-convex portions by embossing, and of obtaining a resin molded product having improved texture by providing high luster. A resin molding mold in accordance with the present application is a resin molding mold for molding a resin molded product. The resin molding mold includes a molding mold and a mirror-surface coat layer formed on a mold surface of the molding mold. The mirror-surface coat layer is formed by a thermosetting resin having a thermal conductivity in a range from 0.10 W/(mK) or more to 0.99 W/(mK) or less. The thickness of the mirror-surface coat layer is set in a range from 1.0 ?m or more to 30 ?m or less, and is preferably set to 20 ?m or less. The surface of the mirror-surface coat layer is provided with a flat-surface maintaining part formed into a substantially flat surface.
    Type: Application
    Filed: April 15, 2016
    Publication date: August 10, 2017
    Applicant: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Masayuki SAKAI, Hisao AOTA
  • Publication number: 20170197336
    Abstract: To provide a resin molding mold capable of forming a resin molded product having embossing in which by controlling appearance of gloss, its texture is improved, and the resin molded product is prevented from occurrence of white blurring on the surface on which the molded embossing is formed. A resin molding mold in accordance with the present application is used for molding a resin molded product having embossing formed thereon. The resin molding mold includes a molding mold and a buffer layer formed on an inside mold surface of the molding mold. The buffer layer is formed by a mixture of a thermosetting resin and fine particles having substantially spherical shapes. The fine particles have a bulk specific gravity in a range from 0.4 g/ml or more to 0.9 g/ml or less, and on the surface of the buffer layer, a plurality of gloss adjusting convex portions having substantially spherical shapes derived from the fine particles are formed.
    Type: Application
    Filed: April 15, 2016
    Publication date: July 13, 2017
    Applicant: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Masayuki SAKAI, Hisao AOTA
  • Patent number: 8794951
    Abstract: An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: August 5, 2014
    Assignee: Tanazawa Hallosha Co., Ltd.
    Inventors: Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima, Yumiko Omiya
  • Publication number: 20120064308
    Abstract: A method for forming a convex pattern on a surface of a sheet includes the steps of covering a photosensitive resin film 21 with a masking film 4 having a convex forming area 40 corresponding to a convex pattern to be obtained, exposing the photosensitive resin film 21 to light from an outside of the masking film 4, and removing an unexposed portion of the photosensitive resin film 21 subjected to the exposing step, thereby forming a sheet 2 with an exposed portion 22 left, and the convex forming area 40 of the masking film 4 has a semi-translucent portion 43 and a translucent portion 41 formed in sequence at an outside of a light-shielding portion 42 in order to express a shade in gradation, and a light transmittance increases stepwise from the light-shielding portion 42 toward the translucent portion 41.
    Type: Application
    Filed: April 8, 2010
    Publication date: March 15, 2012
    Inventors: Sadayuki Yoneshima, Mitsushi Sogabe, Hisao Aota, Masayuki Goryozono, Yumiko Omiya
  • Publication number: 20100075149
    Abstract: An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
    Type: Application
    Filed: November 21, 2007
    Publication date: March 25, 2010
    Applicant: TANAZAWA HAKKOSHO CO., LTD.
    Inventors: Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima, Yumiko Omiya