Abstract: A pusher 30 is composed of a pusher base 31 and a pressing body 32 attached to the pusher base 31 in a removable way. Specifically, a base portion of the pressing body 32 is provided with a flange portion 321, and the pusher base 31 is provided with a plate 33 having a U-shape when seen two-dimensionally. By sliding the pressing body 32 with respect to the pusher base 31 with the flange portion 321 of the pressing body 32 supported by the plate 33, the pressing body 32 can be attached to and removed from the pusher 30 without using any tools.

Abstract: A pusher 30 is composed of a pusher base 31 and a pressing body 32 attached to the pusher base 31 in a removable way. Specifically, a base portion of the pressing body 32 is provided with a flange portion 321, and the pusher base 31 is provided with a plate 33 having a U-shape when seen two-dimensionally. By sliding the pressing body 32 with respect to the pusher base 31 with the flange portion 321 of the pressing body 32 supported by the plate 33, the pressing body 32 can be attached to and removed from the pusher 30 without using any tools.

Abstract: An IC tester is provided which is capable of preventing the temperature of an IC heated to a predetermined temperature from falling during the test. A box-like housing 70 constructed of a thermally insulating material is mounted on a performance board PB. An IC socket SK and a socket guide 35 are accommodated in a space bounded by the box-like housing 70 and the performance board PB. A through-aperture 71 is formed in the top wall of the housing 70 for passing an IC under test carried by a movable rod 60R of a Z-axis driver into and out of the interior of the housing 70. An opening/closing plate 72 is disposed over the housing 70 for movement in a horizontal direction. This plate 72 is adapted to close the through-aperture 71 of the housing 70 when the movable rod 60R is outside of the housing to thereby maintain the interior of the box-like 70 in an almost thermally insulated condition.

Abstract: An automatic test handler system for automatically supplying IC devices to be tested to an IC tester and sorting the tested IC devices based on the test results. The system includes a testing machine for testing the IC devices by contacting the IC devices with test contactors. Test signals are provided from the IC tester and the resulting signals from the IC devices are received. The testing machine is installed in a test room in which dust, temperature and humidity are controlled in a high degree. A sorting machine is installed outside of the test room for sorting the IC devices that have been tested based on the test results. The sorting machine has a plurality of sort stations for receiving the IC devices based on categories defined in the test results. Tray cassettes hold a plurality of IC trays containing the IC devices, and both the tray cassettes and IC trays are provided with identification numbers.

Abstract: A vertical drive unit is mounted on a fixed beam provided above a performance board for testing IC elements and fixed to a support frame. An X-Y carrier head of an X-Y transport unit mounted on the support frame is movable in a planar area including space between the vertical drive unit and the performance board. The X-Y carrier head has a vertical guide, by which an air chuck for sucking up and holding an IC element is supported so that it is movable in the vertical direction. The X-Y carrier head is brought to a predetermined position above the test head, the air chuck is brought down by the vertical drive unit, and then terminals of the IC element are pressed into contact with an IC socket on the performance board at a predetermined pressure.

Abstract: In IC test equipment in which an IC element sucked by an air chuck is carried in the horizontal direction by an X-Y transport unit and the air chuck is lowered toward a test head to load the IC element onto a socket provided on a performance board for test, the socket has a contact housing room defined by a bottom panel and a surrounding wall raised about the periphery thereof, in which spring contacts are arranged, and a planar heat cap made of metal is placed on the socket. In a hole made in the heat cap there are buried a heater and a temperature sensor. The heat cap has a centrally-disposed through hole for receiving the IC element. The through hole is closed to shield the contact housing room from the outside when the air chuck is brought down to the socket.