Patents by Inventor Hisao Iwase
Hisao Iwase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8377159Abstract: A synthetic grinding stone used for the polishing of a silicon wafer is composed of a structure containing cerium oxide fine particles as abrasive grains, a resin as a binder, a salt as a filler and a nano diamond as an additive. This synthetic grinding stone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nano diamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of the structure is less than 30%.Type: GrantFiled: March 25, 2008Date of Patent: February 19, 2013Assignees: Tokyo Diamond Tools Mfg. Co., Ltd., Toyota Motor CorporationInventors: Yuji Yoshida, Hiroshi Eda, Libo Zhou, Masaaki Kenmochi, Yoshiaki Tashiro, Sumio Kamiya, Hisao Iwase, Teruki Yamashita, Noboru Otake
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Patent number: 7997953Abstract: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator (6b) and the base (3) is controlled in multiple stages with different feed speeds according to control based on the amount of movement, and in the second step, movement of the rotator (6b) and the base (3) is controlled with a constant pressure or in multiple stages having different constant pressures.Type: GrantFiled: April 4, 2006Date of Patent: August 16, 2011Assignee: Toyota Jidosha Kabushiki KaishaInventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Patent number: 7950981Abstract: A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting the amount of movement of the second mount in a rough grinding stage through an ultra-precision grinding stage. A posture control device is interposed between a first mount and a rotating device that rotates a grinding target body. The thickness and evenness of the grinding target body are measured by an optical probe and the measurement results are sent to a computer. A feedback command is then sent to the posture control device to reduce the difference between target values and the measurement values and posture control is performed accordingly.Type: GrantFiled: August 3, 2006Date of Patent: May 31, 2011Assignee: Toyota Jidosha Kabushiki KaishaInventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Publication number: 20100167627Abstract: A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting the amount of movement of the second mount in a rough grinding stage through an ultra-precision grinding stage. A posture control device is interposed between a first mount and a rotating device that rotates a grinding target body. The thickness and evenness of the grinding target body are measured by an optical probe and the measurement results are sent to a computer. A feedback command is then sent to the posture control device to reduce the difference between target values and the measurement values and posture control is performed accordingly.Type: ApplicationFiled: August 3, 2006Publication date: July 1, 2010Inventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Publication number: 20100037530Abstract: Disclosed is a synthetic grinding stone used for polishing of silicon wafer, which is composed of a structure comprising cerium oxide fine particles as abrasive grain, a resin as a binder, a salt as a filler and a nano diamond as an additive. This synthetic grinding stone is characterized in that the purity of the cerium oxide is not less than 60% by weight, the content of the salt as a filler is not less than 1% but not more than 20%, the volume content of the nano diamond as an additive is not less than 0.1% but less than 20% relative to the total volume of the structure, and the porosity as the volume fraction relative to the total volume of the structure is less than 30%.Type: ApplicationFiled: March 25, 2008Publication date: February 18, 2010Inventors: Yuji Yoshida, Hiroshi Eda, Libo Zhou, Masaaki Kenmochi, Yoshiaki Tashiro, Sumio Kamiya, Hisao Iwase, Teruki Yamashita, Noboru Otake
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Publication number: 20090047869Abstract: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator (6b) and the base (3) is controlled in multiple stages with different feed speeds according to control based on the amount of movement, and in the second step, movement of the rotator (6b) and the base (3) is controlled with a constant pressure or in multiple stages having different constant pressures.Type: ApplicationFiled: April 4, 2006Publication date: February 19, 2009Inventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Patent number: 7247081Abstract: A precision machining apparatus and a precision machining method capable of carrying out grinding with accuracy by performing switching control, for example, on a device for rotating a grinding wheel according to grinding stages through the amount of movement and constant pressure changed stepwise. To a second pedestal 3 supporting a rotary device 6b for rotating a grinding wheel b, an actuator 5 and a feed screw mechanism 4 constituted by at least a feed screw 41 and a nut 42 are attached. In a rough grinding stage, the movement of the rotary device 6b and the second pedestal 3 is adjusted through a predetermined amount of movement of the nut 42. In a super-precision grinding stage, the movement of the rotary device 6b and the second pedestal 3 is adjusted by pressure control using stepwise a plurality of pneumatic actuators 5a, 5b differing in pressure performance. An attitude control device 7 is interposed between a first pedestal 2 and a rotary device 6a for rotating an object a to be ground.Type: GrantFiled: December 27, 2005Date of Patent: July 24, 2007Assignee: Toyoda Jidosha Kabushiki KaishaInventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Patent number: 7160175Abstract: An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with the first flat-plate while being spaced apart from the same by a distance L. A spherical member 3 is interposed between the first and second flat-plate members 21, 22 while fitting its portions in recesses 21a, 22a respectively formed in the first and second flat-plate members 21, 22. A first actuator 4a expandable in a Z-axis direction perpendicular to a plane defined by an X-axis and a Y-axis is interposed between the flat-plate members. Second actuators 4b, 4b expandable in a suitable direction in the plane defined by the X-axis and the Y-axis are connected to the second flat-plate member 22.Type: GrantFiled: December 27, 2005Date of Patent: January 9, 2007Assignee: Toyota Jidosha Kabushiki KaishaInventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Publication number: 20060234603Abstract: An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with the first flat-plate while being spaced apart from the same by a distance L. A spherical member 3 is interposed between the first and second flat-plate members 21, 22 while fitting its portions in recesses 21a, 22a respectively formed in the first and second flat-plate members 21, 22. A first actuator 4a expandable in a Z-axis direction perpendicular to a plane defined by an X-axis and a Y-axis is interposed between the flat-plate members. Second actuators 4b, 4b expandable in a suitable direction in the plane defined by the X-axis and the Y-axis are connected to the second flat-plate member 22.Type: ApplicationFiled: December 27, 2005Publication date: October 19, 2006Inventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou
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Publication number: 20060194510Abstract: A precision machining apparatus and a precision machining method capable of carrying out grinding with accuracy by performing switching control, for example, on a device for rotating a grinding wheel according to grinding stages through the amount of movement and constant pressure changed stepwise. To a second pedestal 3 supporting a rotary device 6b for rotating a grinding wheel b, an actuator 5 and a feed screw mechanism 4 constituted by at least a feed screw 41 and a nut 42 are attached. In a rough grinding stage, the movement of the rotary device 6b and the second pedestal 3 is adjusted through a predetermined amount of movement of the nut 42. In a super-precision grinding stage, the movement of the rotary device 6b and the second pedestal 3 is adjusted by pressure control using stepwise a plurality of pneumatic actuators 5a, 5b differing in pressure performance. An attitude control device 7 is interposed between a first pedestal 2 and a rotary device 6a for rotating an object a to be ground.Type: ApplicationFiled: December 27, 2005Publication date: August 31, 2006Inventors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Hiroshi Eda, Libo Zhou