Abstract: A method for examining bonded-metal by ultrasonic examination, the method comprising a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a sending probe and received by a receiving probe through a bonding interface, the sending probe and the receiving probe being disposed on the bonded-metal with putting the bonding interface therebetween, the bonded-metal being bonded under unknown condition, and a step of examining a bonding property of the bonded-metal based on the attenuation amount, with utilizing a relationship between a bonding property and an attenuation amount for standard metal bonded under known condition measured preliminarily.