Abstract: [Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.

Abstract: An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

Abstract: [Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.

Abstract: A measurement system includes a drive device configured to drive the plurality of optical semiconductor elements, a probe unit including a plurality of optical connection devices configured to receive respective emitted lights from the plurality of optical semiconductor elements and a processing device including a plurality of photoelectric converters. Each of the optical connection devices is connected to each of the photoelectric converter, and at least some of the emitted lights received by the optical connection devices are input to the photoelectric converter. The photoelectric converter converts the input emitted lights into electric signals.

Abstract: An electrical connecting device (1) includes probes (10), and a probe head (20) including a middle guide plate (23) arranged between a top guide plate (21) and a bottom guide plate (22) and closer to the bottom guide plate (22) so as to lead the probes (10) to penetrate therethrough. The top guide plate (21) and the middle guide plate (23) are provided with guide holes through which the probes (10) are inserted at positions shifted between the top guide plate (21) and the middle guide plate (23) so as to lead the probes (10) to be held in a bent state between the top guide plate (21) and the middle guide plate (23). The probes (10) have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes (10) buckled when tip end parts of the probes (10) are brought into contact with an inspection object.

Abstract: A measurement method of receiving an emission light output from an optical semiconductor element on an incident end surface of an optical probe, shifts a relative position between the optical semiconductor element and the optical probe on a plane surface intersecting with an optical axis of the emission light, measures an incident intensity of the emission light at several positions, and obtains an incident intensity pattern showing a relationship between a change in the relative position and the respective incident intensities.

Abstract: A measurement system includes an optical probe array including the m-number of optical probe groups arranged, each including the n-number of optical probes, the m-number of optical signal selectors each corresponding one of the optical probe groups, and a control circuit configured to control the optical signal selectors. The respective optical signal selectors select and output one of optical signals output from the n-number of the optical probes of the corresponding optical probe groups. The measurement system causes the control circuit to control the optical signal selectors to repeat the selection of the optical signals until the optical signals output from all of the optical probes included in the respective optical probe groups are selected.

Abstract: An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

Abstract: An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).

Abstract: An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).

Abstract: An embodiment of an electrical connecting apparatus enables reliable identification of a mark and enables accurate and easy determination of a coordinate position of the mark. The electrical connecting apparatus comprises a supporting body having a lower surface, a plurality of contacts arranged on the lower surface of the supporting body, a mark that is provided on a lower side of the supporting body and whose light passing feature differs from that of an area adjacent to the mark, and a light source provided to the supporting body to irradiate light to the mark from an upper side of the mark.

Abstract: An embodiment of an electrical connecting apparatus comprises a support board, a plate spring arranged on the support board, an attachment device attaching the plate spring to the support board, a block having an attachment surface directing downward, and a flexible circuit board in which a plurality of contactors are arranged. As for the block, the attachment surface for attaching the circuit board is protruded further to the lower side than the support board. The plate spring receives initial load to bring a state where at least a center area for attaching the block is biased toward the upper side. Thus, a good electrical contacting state can be obtained without increasing the overdriving amount.

Abstract: The probe card includes a plurality of probes arranged on one surface side of a board. These probes belonging to any one of a first probe group including a plurality of probes contacting respective electrodes in a first electrode row of an electronic device, a second probe group including a plurality of probes contacting respective electrodes in a second electrode row of the electronic device, and a third and fourth probe groups respectively including a plurality of probes contacting respective electrodes in a middle electrode row of the electronic device alternately.

Abstract: An embodiment of an electrical connecting apparatus enables reliable identification of a mark and enables accurate and easy determination of a coordinate position of the mark. The electrical connecting apparatus comprises a supporting body having a lower surface, a plurality of contacts arranged on the lower surface of the supporting body, a mark that is provided on a lower side of the supporting body and whose light passing feature differs from that of an area adjacent to the mark, and a light source provided to the supporting body to irradiate light to the mark from an upper side of the mark.

Abstract: An electrical connecting device includes a supporting substrate, a plate spring arranged on the supporting substrate, an assembling device for assembling the plate spring to the supporting substrate, a block having a mounting surface facing down, and a flexible circuit board whereupon a plurality of contacts are formed. The block has the mounting surface which protrudes downward from the supporting substrate, for mounting the circuit board. The plate spring is applied with an initial load to be in a status where at least a center region whereupon the block is mounted is urged upward. Thus, excellent electric contact status can be obtained without increasing an over drive quantity.

Abstract: The probe card includes a plurality of probes arranged on one surface side of a board. These probes belonging to any one of a first probe group including a plurality of probes contacting respective electrodes in a first electrode row of an electronic device, a second probe group including a plurality of probes contacting respective electrodes in a second electrode row of the electronic device, and a third and fourth probe groups respectively including a plurality of probes contacting respective electrodes in a middle electrode row of the electronic device alternately.

Abstract: In the case where a received multi-level orthogonal amplitude signal is not synchronized with a local carrier frequency signal, a digital multiplexing radio receiver recognizes that an adaptively-equalized data exist in a specified area on the phase plane of Ich and Qch orthogonal coordinates. The receiver controls an operation of amplifying Ich and Qch demodulated signals to a fixed level, based on the data of which exist in the specified area. Similarly, the receiver controls a phase of the local carrier frequency signal based on the data of existing in the specified area, and controls tap coefficients of an adaptive transversal filter which equalizes the received multi-level orthogonal amplitude signal. In the specified area, a distance between signal points of multi-level orthogonal amplitude signal is large so that influence caused by a phase rotation is small. Accordingly, the digital multiplexing radio receiver can rapidly and stably return to a synchronous mode.