Patents by Inventor Hisao Nemoto

Hisao Nemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11517971
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: December 6, 2022
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20220226968
    Abstract: A tweezers device is provided having a first leg, a second leg, and a rotating shaft to rotatably connect the first leg and the second leg. A leaf spring biases the first leg and the second leg in a rotating direction of the rotating shaft, working to push away the end of the first leg and the second leg. An opening width-adjusting member is provided to adjust an acceptable opening width between the end of the first leg and the second leg by the rotation of a width-adjusting wheel. The width-adjusting wheel is positioned distally to the rotating shaft, and is rotatable on the axis along the opening direction of the first leg and the second leg.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 21, 2022
    Inventor: Hisao NEMOTO
  • Patent number: 11316326
    Abstract: A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 26, 2022
    Assignee: Hakko Corp
    Inventors: Hisao Nemoto, Tomoyo Maeshima, Norihisa Sekimori
  • Publication number: 20210354225
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: May 12, 2020
    Publication date: November 18, 2021
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 11124881
    Abstract: The objective of the present invention is to provide a hydrophilic metal surface treatment agent by which a water-repellent property can be given to a metal surface with suppressing a corrosion and a discolorment of the metal, a method for treating a surface of a metal by using the hydrophilic metal surface treatment agent, a synthetic intermediate compound of a branched glycerol derivative as an active ingredient of the hydrophilic metal surface treatment agent, and a method for efficiently producing the synthetic intermediate compound. The hydrophilic metal surface treatment agent of the present invention is characterized in comprising the branched glycerol derivative represented by the following formula (I) as an active ingredient. wherein R1 is a hydrocarbon group having a carbon number of 10 or more and 30 or less, X is S or a carbonyl group, Y is an n+1 valent linker group, n is an integer of 1 or more and 5 or less.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: September 21, 2021
    Assignees: CHEMICAL DENSHI CO., LTD., TOKUSHIMA UNIVERSITY
    Inventors: Shoichi Yamada, Toshio Hyuga, Hisao Nemoto
  • Publication number: 20210246560
    Abstract: The objective of the present invention is to provide a hydrophilic metal surface treatment agent by which a water-repellent property can be given to a metal surface with suppressing a corrosion and a discolorment of the metal, a method for treating a surface of a metal by using the hydrophilic metal surface treatment agent, a synthetic intermediate compound of a branched glycerol derivative as an active ingredient of the hydrophilic metal surface treatment agent, and a method for efficiently producing the synthetic intermediate compound. The hydrophilic metal surface treatment agent of the present invention is characterized in comprising the branched glycerol derivative represented by the following formula (I) as an active ingredient. wherein R1 is a hydrocarbon group having a carbon number of 10 or more and 30 or less, X is S or a carbonyl group, Y is an n +1 valent linker group, n is an integer of 1 or more and 5 or less.
    Type: Application
    Filed: June 4, 2020
    Publication date: August 12, 2021
    Applicants: CHEMICAL DENSHI CO., LTD., Tokushima University
    Inventors: Shoichi YAMADA, Toshio HYUGA, Hisao NEMOTO
  • Patent number: 10618127
    Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: April 14, 2020
    Assignee: Hakko Corp.
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 10520219
    Abstract: The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: December 31, 2019
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20190341753
    Abstract: A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 7, 2019
    Applicant: Hakko Corporation
    Inventors: Hisao Nemoto, Tomoyo Maeshima, Norihisa Sekimori
  • Publication number: 20180161903
    Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 14, 2018
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 9981332
    Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 29, 2018
    Assignee: Hakko Corp
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 9931705
    Abstract: A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: April 3, 2018
    Assignee: Hakko Corp.
    Inventors: Mitsuhiko Miyazaki, Hisao Nemoto
  • Publication number: 20170336098
    Abstract: The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
    Type: Application
    Filed: May 18, 2016
    Publication date: November 23, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20170182576
    Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
    Type: Application
    Filed: September 12, 2016
    Publication date: June 29, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo TERAOKA, Hisao Nemoto
  • Publication number: 20170165771
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: June 2, 2016
    Publication date: June 15, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20150083707
    Abstract: A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 26, 2015
    Applicant: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Hisao Nemoto
  • Patent number: D829519
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 2, 2018
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Hisao Nemoto, Kenta Nakamura
  • Patent number: D895386
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 8, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto
  • Patent number: D904849
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto
  • Patent number: D956499
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 5, 2022
    Assignee: HAKKO CORPORATION
    Inventor: Hisao Nemoto