Patents by Inventor Hisao OKU

Hisao OKU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200087500
    Abstract: Provided are a heat-shrinkable label and a package each having solvent bonded-portion where solvent penetration-through is not caused even when the film is thin. Provided are particularly a heat-shrinkable label and a package each having solvent bonded-portion gaining a high peel strength stability even when the film is passed through a tubing step made high in speed. A heat-shrinkable label has a tubular shape, in which both end portions of a heat-shrinkable polyvinyl chloride-based film or a heat-shrinkable polystyrene-based film are bonded to each other with a solvent composition. The solvent composition contains at least one organic solvent selected from the group consisting of tetrahydrofuran (THF), methyl ethyl ketone (MEK) and ethyl acetate, and at least one resin selected from the group consisting of polyester, polypropylene and hydrogenated petroleum resin, and the end portion bonded has a peel strength of 2 N/15 mm or more.
    Type: Application
    Filed: March 23, 2018
    Publication date: March 19, 2020
    Applicant: TOYOBO CO., LTD.
    Inventors: Masafumi INOUE, Masayuki HARUTA, Hisao OKU