Patents by Inventor Hisao Okuda

Hisao Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7880951
    Abstract: A micro oscillating device includes a frame, an oscillating part including a first drive electrode for application of a reference electric potential, and a connecting part for connecting the frame and the oscillating part to each other, where the connecting part defines an axis of an oscillating motion of the oscillating part. A second drive electrode is fixed to the frame to cooperate with the first drive electrode for generation of a driving force for the oscillating movement. The first drive electrode includes a first end extension and a second end extension separated from each other and extending in a direction crossing the axis. The second drive electrode is within a separation distance between the first and the second end extensions.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: February 1, 2011
    Assignee: Fujitsu Limited
    Inventors: Osamu Tsuboi, Norinao Kouma, Hiromitsu Soneda, Hisao Okuda, Yoshihiro Mizuno, Tsuyoshi Matsumoto
  • Patent number: 7871687
    Abstract: A microstructure device is made by processing a material substrate consisting of e.g. a first process layer, a second process layer and a middle layer arranged between the first and the second process layers. The microstructure device includes a first structural part and a second structural part that has a portion facing the first structural part via a gap. The first and the second structural parts are connected to each other by a connecting part extending across the gap. This connecting part is formed in the first process layer to be in contact with the middle layer. The microstructure device also includes a protective part extending from the first structural part toward the second structural part or vice versa. The protective part is formed in the first or second process layer to be in contact with the middle layer.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: January 18, 2011
    Assignee: Fujitsu Limited
    Inventors: Norinao Kouma, Yoshihiro Mizuno, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi, Ippei Sawaki
  • Patent number: 7855458
    Abstract: An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: December 21, 2010
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Matsumoto, Yoshihiro Mizuno, Xiaoyu Mi, Hisao Okuda, Satoshi Ueda
  • Patent number: 7833430
    Abstract: A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1?-T3?) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1?-T3?) to form the thin wall portions.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: November 16, 2010
    Assignee: Fujitsu Limited
    Inventors: Xiaoyu Mi, Norinao Kouma, Osamu Tsuboi, Masafumi Iwaki, Hisao Okuda, Hiromitsu Soneda, Satoshi Ueda, Ippei Sawaki
  • Patent number: 7808030
    Abstract: The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: October 5, 2010
    Assignee: Fujitsu Limited
    Inventors: Yoshihiro Mizuno, Xiaoyu Mi, Tsuyoshi Matsumoto, Hisao Okuda, Satoshi Ueda
  • Publication number: 20100194235
    Abstract: A micro movable device suitable for suppressing deterioration of driving characteristics, and a micro movable device array including such a micro movable device are provided. The micro movable device (X1) of the present invention includes a movable portion including a first driving electrode, a second driving electrode for generating electrostatic attraction between the first driving electrode and the second driving electrode, a first conductor portion (22c) electrically connected to the first driving electrode, a second conductor portion (22b) electrically connected to the second driving electrode, and a third conductor portion (21a) which is not electrically connected to the first and the second driving electrodes and which is bonded to the first conductor portion (22c) via an insulating film (23) and bonded to the second conductor portion (22b) via the insulating film (23).
    Type: Application
    Filed: April 15, 2010
    Publication date: August 5, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Osamu TSUBOI, Norinao Kouma, Yoshihiro Mizuno, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto
  • Patent number: 7755824
    Abstract: A micromirror unit is provided which includes a frame, a mirror forming base upon which a mirror surface is formed, and a torsion connector which includes a first end connected to the mirror forming base and a second end connected to the frame. The torsion connector defines a rotation axis about which the mirror forming base is rotated relative to the frame. The torsion connector has a width measured in a direction which is parallel to the mirror surface and perpendicular to the rotation axis. The width of the torsion connector is relatively great at the first end. The width becomes gradually smaller from the first end toward the second end.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: July 13, 2010
    Assignee: Fujitsu Limited
    Inventors: Osamu Tsuboi, Satoshi Ueda, Yoshihiro Mizuno, Ippei Sawaki, Hisao Okuda
  • Patent number: 7751108
    Abstract: The micro-actuation element (X1) includes a movable unit (111), a frame (112) and a coupler (113) for connecting these, where the unit, the frame and the coupler are integrally formed in a material substrate having a multi-layer structure that consists of electroconductive layers (110a-110c), such as a core conduction layer (110b), and insulation layers (110d, 110e) intervening between the electroconductive layers (110a-110c). The movable unit (111) includes a first structure originating in the core conduction layer (110b). The frame (112) includes a second structure originating in the core conduction layer (110b). The coupler (113) includes a plurality of electrically separated torsion bars (113a, 113b) that originate in the core conduction layer (110b) and are connected continuously to the first structure and the second structure.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: July 6, 2010
    Assignee: Fujitsu Limited
    Inventors: Osamu Tsuboi, Yoshihiro Mizuno, Satoshi Ueda, Ippei Sawaki, Hisao Okuda, Fumio Yamagishi, Hiromitsu Soneda, Norinao Kouma
  • Patent number: 7701155
    Abstract: A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: April 20, 2010
    Assignee: Fujitsu Limited
    Inventors: Osamu Tsuboi, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Mi Xiaoyu, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Publication number: 20100092130
    Abstract: A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.
    Type: Application
    Filed: October 5, 2009
    Publication date: April 15, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu SONEDA, Tsuyoshi Matsumoto, Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Osamu Tsuboi
  • Publication number: 20100018635
    Abstract: A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 28, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Norinao KOUMA, Osamu TSUBOI, Yoshihiro MIZUNO, Hiromitsu SONEDA, Hisao OKUDA, Tsuyoshi MATSUMOTO, Ippei SAWAKI
  • Publication number: 20100007940
    Abstract: A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.
    Type: Application
    Filed: June 15, 2009
    Publication date: January 14, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Osamu Tsuboi, Norinao Kouma, Yoshihiro Mizuno, Hiromitsu Soneda, Hisao Okuda, Tsuyoshi Matsumoto
  • Publication number: 20090267445
    Abstract: A micro rocking device includes a frame, a rocking portion, a torsion connecting portion, and a second comb-like electrode, the rocking portion including a first comb-like electrode. The torsion connecting portion connects the frame and the rocking portion. The torsion connecting portion defines the axis of rotational displacement of the rocking portion. The second comb-like electrode attracts the first comb-like electrode and rotationally displaces the rocking portion. The first comb-like electrode has a plurality of first parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction. The second comb-like electrode has a plurality of second parallel electrode teeth which extend in the direction of the axis and which are spaced from each other in a direction crossing the extension direction.
    Type: Application
    Filed: October 10, 2008
    Publication date: October 29, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Yoshihiro MIZUNO, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi, Ippei Sawaki
  • Publication number: 20090225387
    Abstract: A micro movable element including a movable portion; first and second driving electrodes; first and second conductor portions electrically connected to the first and second driving electrodes, respectively; an intermediate insulating portion disposed between the first conductor portion and the second conductor portion; and a partly laminated structure portion including the first conductor portion, the intermediate insulating portion and the second conductor portion, wherein the first conductor portion has an opposed face making contact with the intermediate insulating portion, a side face adjacent to the opposed face and an edge portion forming the boundary between the opposed face and the side face, part of the edge portion opposed to the second conductor portion is covered with an insulating film, and parts of the first and second driving electrodes are not covered with an insulating film.
    Type: Application
    Filed: March 4, 2009
    Publication date: September 10, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Yoshihiro MIZUNO, Norinao KOUMA, Hisao OKUDA, Hiromitsu SONEDA, Tsuyoshi MATSUMOTO, Osamu TSUBOI
  • Publication number: 20090218909
    Abstract: A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.
    Type: Application
    Filed: April 29, 2009
    Publication date: September 3, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Osamu Tsuboi, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Mi Xiaoyu, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Patent number: 7551054
    Abstract: An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: June 23, 2009
    Assignees: Fujitsu Limited, Fujitsu Media Devices Limited
    Inventors: Yoshihiro Mizuno, Xiaoyu Mi, Hisao Okuda, Hiromitsu Soneda, Satoshi Ueda, Takeo Takahashi
  • Patent number: 7550895
    Abstract: A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: June 23, 2009
    Assignee: Fujitsu Limited
    Inventors: Osamu Tsuboi, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Mi Xiaoyu, Satoshi Ueda, Ippei Sawaki, Yoshitaka Nakamura
  • Patent number: 7536068
    Abstract: A micro movable element includes a micro movable substrate, a package base and an electroconductive connector. The micro movable substrate is provided with a micro movable unit that includes a frame, a pivotally movable portion, a torsion connector connecting the frame and the movable portion, and an actuator to generate driving force for the pivotal motion of the movable portion. The package base includes an internal interconnect structure. The electroconductive connector is provided between the micro movable substrate and the package base for electrically connecting the actuator and the internal interconnect structure to each other.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: May 19, 2009
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Soneda, Xiaoyu Mi, Hisao Okuda, Osamu Tsuboi, Norinao Kouma, Satoshi Ueda
  • Patent number: 7473981
    Abstract: An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 ?m in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: January 6, 2009
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Matsumoto, Yoshihiro Mizuno, Xiaoyu Mi, Hisao Okuda, Satoshi Ueda
  • Publication number: 20090001847
    Abstract: A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode.
    Type: Application
    Filed: June 24, 2008
    Publication date: January 1, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Osamu TSUBOI, Norinao KOUMA, Hiromitsu SONEDA, Hisao OKUDA, Yoshihiro MIZUNO, Tsuyoshi MATSUMOTO, Ippei SAWAKI