Patents by Inventor Hisao Sugoh

Hisao Sugoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
    Patent number: 7723161
    Abstract: There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: May 25, 2010
    Assignee: Panasonic Corporation
    Inventors: Takeshi Kobayashi, Hisao Sugoh
  • Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
    Patent number: 7659634
    Abstract: There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: February 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Takeshi Kobayashi, Hisao Sugoh
  • Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
    Publication number: 20050224918
    Abstract: There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 13, 2005
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Takeshi Kobayashi, Hisao Sugoh
  • Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
    Publication number: 20040147063
    Abstract: There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
    Type: Application
    Filed: January 15, 2004
    Publication date: July 29, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kobayashi, Hisao Sugoh