Patents by Inventor Hisao Tomizawa

Hisao Tomizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device with a brazing mount
    Patent number: 5998239
    Abstract: A method of manufacturing a semiconductor device with a mount 2 secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: December 7, 1999
    Assignees: Mitsubishi Electric Corp., Sanken Electric Co. Ltd.
    Inventor: Hisao Tomizawa
  • Semiconductor device with brazing mount
    Patent number: 5917245
    Abstract: A mount 2 is secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: June 29, 1999
    Assignees: Mitsubishi Electric Corp., Sanken Electric Co. Ltd.
    Inventor: Hisao Tomizawa