Abstract: A semiconductor memory device includes a stacked body, a first metal layer, and a first columnar body. The stacked body includes a plurality of gate electrode layers and a plurality of insulating layers. The plurality of gate electrode layers include a first gate electrode layer, and a second gate electrode layer having a length in a second direction intersecting a first direction that is shorter than that of the first gate electrode layer. The first metal layer is disposed at least on a first side with respect to a terrace portion of the first gate electrode layer. The first columnar body is disposed on the first side with respect to the terrace portion of the first gate electrode layer. The first columnar body includes a conductive portion extending in the first direction and penetrating the first metal layer to be connected to the terrace portion of the first gate electrode layer, and an insulator disposed at least between the first metal layer and the conductive portion.

Abstract: According to one embodiment, a semiconductor memory device includes: a semiconductor layer arranged above a substrate in a first direction; a first interconnect layer between the substrate and the semiconductor layer; a second interconnect layer arranged adjacent to the first interconnect layer in a second direction; a plurality of memory pillars; and a first member between the first interconnect layer and the second interconnect layer. The semiconductor layer has, on a side of a second surface facing a first surface in contact with the first member, a first projecting portion projecting in the first direction and overlapping a part of an area in the first direction, the area being provided with the first interconnect layer and the first member.

Abstract: Provided is a foundry sand supply device capable of collecting foundry sand at an arbitrary timing. The foundry sand supply device includes a bucket collecting the foundry sand, a bucket drive unit rotatably supporting the bucket and driving the bucket, and a moving unit moving the bucket drive unit close to and away from the foundry sand, and moving the bucket drive unit between a collecting position to collect the foundry sand and a supply position to supply the foundry sand.

Abstract: A mold shake-out system to suppress the effects of an excessive or insufficient water sprinkling amount in mold shake-out that separates a mold, into which castings have been poured, into castings and molding sand, the mold shake-out system including: a shake-out device that separates the castings and a mold into the castings and the molding sand; a water sprinkling portion that sprinkles water in the shake-out device; and a control device that controls the water sprinkling amount in the water sprinkling portion; the control device adjusting the water sprinkling amount on the basis of molding/pouring data including molding data regarding the mold into which castings have been poured and which is loaded into the shake-out device, pouring data regarding molten metal that forms the castings, and time data from when the molten metal is poured into the mold until when the mold is loaded into the shake-out device.

Abstract: A casting mold molding machine includes a green sand mold molding sensor including a pressure sensor for evaluating moldability of a green sand mold molded by a casting mold molding machine, wherein the pressure sensor is embedded in a squeeze board or squeeze feet that compresses green sand.

Abstract: A water supply and kneading system for green sand, including: a weighing hopper that stores green sand that has been weighed; a kneading machine that kneads the green sand and water; a sand loading means for releasing the green sand in the weighing hopper into the kneading machine, or shutting off the release; a water supply device that supplies water to the green sand in the kneading machine; a moisture sensor that includes a pair of electrodes and measures the moisture content of the green sand stored in the weighing hopper by measuring an electric potential difference between the electrodes; and a kneading control device that controls the amount of water supplied by the water supply device and controls the sand loading means on the basis of the output of the moisture sensor.

Abstract: A green sand mold molding sensor that can measure the pressure applied to a parting plane of a green sand mold in order to determine the quality (casting mold strength) of a molded green sand mold. A green sand mold molding sensor including a pressure sensor for evaluating the molding properties of a green sand mold molded by a casting mold molding machine, wherein the pressure sensor is embedded in a plate having a model attached thereto.

Abstract: A mold shake-out system to suppress the effects of an excessive or insufficient water sprinkling amount in mold shake-out that separates a mold, into which castings have been poured, into castings and molding sand, the mold shake-out system including: a shake-out device that separates the castings and a mold into the castings and the molding sand; a water sprinkling portion that sprinkles water in the shake-out device; and a control device that controls the water sprinkling amount in the water sprinkling portion; the control device adjusting the water sprinkling amount on the basis of molding/pouring data including molding data regarding the mold into which castings have been poured and which is loaded into the shake-out device, pouring data regarding molten metal that forms the castings, and time data from when the molten metal is poured into the mold until when the mold is loaded into the shake-out device.

Abstract: A kneaded sand property adjusting system including: a kneading device; a kneaded sand storage hopper that stores kneaded sand; a molding device that molds the sand conveyed from the sand storage hopper; a control device that controls water injection until a property of the sand meets a kneaded sand target property; and kneaded sand amount measuring instruments that measure the amount of sand stored in storage hopper, wherein the control device stores the batch number of each kneaded batch and the kneaded sand property measured at the time of kneading, calculates the batch number of the kneaded batch that corresponds to the molding sand being loaded into the molding device by the kneaded sand amount measuring instruments, associates the property of the molding sand with the property stored on by the batch number that was calculated, and corrects the target property on the basis of the values of the properties.

Abstract: According to one embodiment, a semiconductor memory device includes a first stacked body disposed between the belt-like portions and stacked a plurality of first conductive layers via a first insulating layer, a second stacked body disposed in a region in the first stacked body and stacked a plurality of second insulating layers via the first insulating layer, a first pillar extending in the first stacked body in a stacking direction of the first stacked body, and a plurality of second pillars extending in the stacking direction on both sides of the second stacked body facing the belt-like portions and arranged in the first direction, in which the second pillars each include a plate-like portion disposed at a height position of each of the first conductive layers, and the adjacent second pillars are connected to each other by the plate-like portion.

Abstract: A casting mold molding device, a casting mold quality evaluation device, and a casting mold quality evaluation method are capable of evaluating the quality (casting mold strength) of a molded green sand mold without measuring a green sand mold by using a casting mold strength gauge each time a green sand mold is molded in one frame. A green sand mold molding sensor that, during molding of a green sand mold, measures a pressure value applied to a joining section between green sand introduced into a casting mold molding space and a plate having a model attached thereto; and a casting mold quality evaluation device that evaluates the quality of a molded green sand mold from the pressure value.

Abstract: Provided is a foundry sand supply device capable of collecting foundry sand at an arbitrary timing. The foundry sand supply device includes a bucket collecting the foundry sand, a bucket drive unit rotatably supporting the bucket and driving the bucket, and a moving unit moving the bucket drive unit close to and away from the foundry sand, and moving the bucket drive unit between a collecting position to collect the foundry sand and a supply position to supply the foundry sand.

Abstract: A semiconductor device of an embodiment includes a control circuit arranged on a substrate, a first conductive layer arranged on the control circuit and containing a first element as a main component, a multilayer structure arranged on the first conductive layer and configured such that multiple second conductive layers and multiple insulating layers are alternately stacked on each other, a memory layer penetrating the multilayer structure and reaching the first conductive layer at a bottom portion, a first layer arranged between the control circuit and the first conductive layer and containing the first element as a main component, and a second layer arranged between the control circuit and the first layer and containing, as a main component, a second element different from the first element.

Abstract: A casting mold molding device, a casting mold quality evaluation device, and a casting mold quality evaluation method that are capable of evaluating the quality of a molded green sand mold without measuring a green sand mold by using a casting mold strength gauge each time a green sand mold is molded in one flask. The device includes a green sand mold molding sensor that, during molding of a green sand mold, measures a pressure value applied to a joining section between green sand introduced into a casting mold molding space and a squeeze board or squeeze feet; and a casting mold quality evaluation device that evaluates the quality of a molded green sand mold from the pressure value.

Abstract: A green sand mold molding sensor including a pressure sensor for evaluating moldability of a green sand mold molded by a casting mold molding machine, wherein the pressure sensor is embedded in a squeeze board or squeeze feet that compresses green sand.

Abstract: A mold-shift detection device for upper and lower molds molded and assembled with each other by a flaskless molding machine, comprises: a first distance sensor measuring a distance by irradiating side surfaces of the upper and lower molds with light; a cylinder causing the first distance sensor to scan the side surfaces of the upper and lower molds; and a controller detecting a mold-shift between the upper and lower molds, based on a measurement result in a scan range.

Abstract: A green sand mold molding sensor that can measure the pressure applied to a parting plane of a green sand mold in order to determine the quality (casting mold strength) of a molded green sand mold. A green sand mold molding sensor including a pressure sensor for evaluating the molding properties of a green sand mold molded by a casting mold molding machine, wherein the pressure sensor is embedded in a plate having a model attached thereto.

Abstract: A semiconductor memory device according to an embodiment includes first to third conductive layers, first and second pillars, first and second contacts, and first to third members. The first pillar penetrates the first and second conductive layers in a first area. A second pillar penetrates the first and third conductive layers in the first area. The first and second contacts are provided on the second and third conductive layers respectively in a second area. The first and second members are provided between the second and third conductive layers in the first and second area, respectively. The third member penetrates the first conductive layers. The third member is in contact with each of the second and third conductive layers, and the first and second members.

Abstract: A semiconductor device of an embodiment includes a control circuit arranged on a substrate, a first conductive layer arranged on the control circuit and containing a first element as a main component, a multilayer structure arranged on the first conductive layer and configured such that multiple second conductive layers and multiple insulating layers are alternately stacked on each other, a memory layer penetrating the multilayer structure and reaching the first conductive layer at a bottom portion, a first layer arranged between the control circuit and the first conductive layer and containing the first element as a main component, and a second layer arranged between the control circuit and the first layer and containing, as a main component, a second element different from the first element.

Abstract: A semiconductor memory device according to an embodiment includes: a substrate; a plurality of first gate electrodes; a first semiconductor film facing the plurality of first gate electrodes; and a first gate insulating film provided between the plurality of first gate electrodes and the first semiconductor film. Moreover, this semiconductor memory device includes: a plurality of second gate electrodes; a second semiconductor film facing the plurality of second gate electrodes; and a second gate insulating film provided between the plurality of second gate electrodes and the second semiconductor film. Moreover, this semiconductor memory device includes: a third gate electrode that is provided between the plurality of first gate electrodes and the plurality of second gate electrodes, and extends in a second direction; and a third gate insulating film provided between the third gate electrode and the first semiconductor film.