Patents by Inventor Hisashi Kawashima
Hisashi Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932696Abstract: The present invention provides a pharmaceutical composition for cancer treatment comprising an antibody against CCR8.Type: GrantFiled: December 28, 2020Date of Patent: March 19, 2024Assignees: SHIONOGI & CO., LTD., OSAKA UNIVERSITYInventors: Tetsuya Yoshida, Yujiro Kidani, Mitsunobu Matsumoto, Takayuki Kanazawa, Satomi Shinonome, Kanji Hojo, Naganari Ohkura, Shimon Sakaguchi, Atsushi Tanaka, Hisashi Wada, Atsunari Kawashima, Norio Nonomura
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Patent number: 7007506Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.Type: GrantFiled: May 4, 2004Date of Patent: March 7, 2006Assignee: Fujitsu LimitedInventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
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Publication number: 20040200229Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.Type: ApplicationFiled: May 4, 2004Publication date: October 14, 2004Applicant: FUJITSU LIMITEDInventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
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Patent number: 6748755Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.Type: GrantFiled: December 28, 2000Date of Patent: June 15, 2004Assignee: Fujitsu LimitedInventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
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Patent number: 6621707Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.Type: GrantFiled: October 2, 2001Date of Patent: September 16, 2003Assignee: Fujitsu LimitedInventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
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Publication number: 20020082988Abstract: A technology of the present invention takes not a method of determining a usage fee by a conventional charge-by-quantity system of an ASP (Application Service Provider) but a method of reflecting an evaluation of a quality of provided service in a fee calculation. A server device (1) of the present invention comprises a communication module (8) for performing communications with a client device (21, 21A, 21B), a service providing module (2) for providing a service to the client device via the communication module, an evaluation module (2) for evaluating a quality of the service provided, and a fee calculation module (13) for calculating a fee charged for the service in a way that reflects a result of the evaluation in the calculation.Type: ApplicationFiled: June 19, 2001Publication date: June 27, 2002Inventors: Kazuyuki Ujiie, Hisashi Kawashima
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Patent number: 6404640Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.Type: GrantFiled: January 22, 1999Date of Patent: June 11, 2002Assignee: Fujitsu LimitedInventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wie, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
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Publication number: 20020021557Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.Type: ApplicationFiled: October 2, 2001Publication date: February 21, 2002Applicant: Fujitsu Limited,Inventors: Junichi Ishimine, Masahiro Suzuki, Akira Tamura, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
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Publication number: 20010020365Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.Type: ApplicationFiled: December 28, 2000Publication date: September 13, 2001Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
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Patent number: 5862038Abstract: A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.Type: GrantFiled: March 20, 1997Date of Patent: January 19, 1999Assignee: Fujitsu LimitedInventors: Masahiro Suzuki, Junichi Ishimine, Hisashi Kawashima, Keizo Takemura, Kiyotaka Seyama
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Patent number: 5048598Abstract: A reservoir tank of the present invention employed in a liquid cooling system is provided with a plurality of outlets for feeding out the coolant and a plurality of inlets to which the coolant returns after cooling electronics devices. These outlets are provided at the center of bottom of the tank and these inlets are provided at the external circumference of the outlets. Incident angle of the inlets to the tank is inclined from the vertical line of tank so that the coolant generates a whirlpool around the vertical axis of tank. A cylindrical partition may be provided between the center of the bottom having the inlets and the circumferential part having the outlets, so as to prevent a short path of the coolant flowing from inlets to the outlets. In this case, holes may be provided at the partition so that the coolant stirred at the outside of partition flows to the outlets therethrough.Type: GrantFiled: January 24, 1990Date of Patent: September 17, 1991Assignee: Fujitsu LimitedInventors: Motohiro Takemae, Takaaki Kanki, Hirofumi Takao, Hisashi Kawashima, Hideo Katsumi
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Patent number: 4865123Abstract: An apparatus for circulating cooling fluid through a plurality of cooling modules for cooling electronic components, such as IC'S or LSI'S. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules. Each of the supply systems includes a fluid line connected to a single tank containing cooling fluid and is provided with a pump and a heat exchanger, so that the cooling fluid in the tank is circulated through the respective cooling modules and returned to the tank, in which the cooling fluid is then mixed.Type: GrantFiled: October 18, 1988Date of Patent: September 12, 1989Assignee: Fujitsu LimitedInventors: Hisashi Kawashima, Tsuguo Okada, Haruhiko Yamamoto