Patents by Inventor Hisashi Kawashima

Hisashi Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200232973
    Abstract: The disclosure provides a method of measuring an efficacy of a drug composition for cancer and a method for treating a cancer by administering to a subject an effective amount of a pharmaceutical composition having a polypeptide that binds to a peptide produced by cDNA of GenBank ACC No. NM_005201.3 or NM_007720.2.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 23, 2020
    Applicants: Shionogi & Co., Ltd., Osaka University
    Inventors: Tetsuya Yoshida, Yujiro Kidani, Mitsunobu Matsumoto, Takayuki Kanazawa, Satomi Shinonome, Kanji Hojo, Naganari Ohkura, Shimon Sakaguchi, Atsushi Tanaka, Hisashi Wada, Atsunari Kawashima, Norio Nonomura
  • Publication number: 20200222463
    Abstract: The disclosure provides a pharmaceutical composition with a polypeptide that binds to a peptide produced by cDNA of GenBank ACC No. NM_005201.3 or NM_007720.2, and methods of use thereof.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 16, 2020
    Applicants: Shionogi & Co., Ltd., Osaka University
    Inventors: Tetsuya Yoshida, Yujiro Kidani, Mitsunobu Matsumoto, Takayuki Kanazawa, Satomi Shinonome, Kanji Hojo, Naganari Ohkura, Shimon Sakaguchi, Atsushi Tanaka, Hisashi Wada, Atsunari Kawashima, Norio Nonomura
  • Publication number: 20200127401
    Abstract: An ECU (1) includes a circuit board (10), a connector (20) fixed to the circuit board (10), and a resin portion (50) covering the circuit board (10) and the connector (20). The connector (20) includes a connector housing (21) having a terminal holding wall (22) that separates the internal space from the external space, and terminal fittings (41) extend through the terminal holding wall (22). The connector housing (21) includes a surrounding wall (27) disposed on the lateral surface of the terminal holding wall (22) to surround the terminal fittings (41). A potting material (28) is disposed inside the surrounding wall (27) and separates the terminal holding wall (22) from the resin portion (50). This can prevent a melted resin from entering a hood (24) through press fitting holes (23) at the time of forming the resin portion (50) by mold forming.
    Type: Application
    Filed: June 27, 2018
    Publication date: April 23, 2020
    Inventors: Hirokazu Komori, Hisashi Sawada, Naomichi Kawashima, Hirokazu Eguchi
  • Patent number: 10550191
    Abstract: The present invention provides a pharmaceutical composition for cancer treatment comprising an antibody against CCR8.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: February 4, 2020
    Assignees: Shionogi & Co., Ltd., Osaka University
    Inventors: Tetsuya Yoshida, Yujiro Kidani, Mitsunobu Matsumoto, Takayuki Kanazawa, Satomi Shinonome, Kanji Hojo, Naganari Ohkura, Shimon Sakaguchi, Atsushi Tanaka, Hisashi Wada, Atsunari Kawashima, Norio Nonomura
  • Patent number: 7007506
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: March 7, 2006
    Assignee: Fujitsu Limited
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Publication number: 20040200229
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Application
    Filed: May 4, 2004
    Publication date: October 14, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 6748755
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: June 15, 2004
    Assignee: Fujitsu Limited
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 6621707
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: September 16, 2003
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Publication number: 20020082988
    Abstract: A technology of the present invention takes not a method of determining a usage fee by a conventional charge-by-quantity system of an ASP (Application Service Provider) but a method of reflecting an evaluation of a quality of provided service in a fee calculation. A server device (1) of the present invention comprises a communication module (8) for performing communications with a client device (21, 21A, 21B), a service providing module (2) for providing a service to the client device via the communication module, an evaluation module (2) for evaluating a quality of the service provided, and a fee calculation module (13) for calculating a fee charged for the service in a way that reflects a result of the evaluation in the calculation.
    Type: Application
    Filed: June 19, 2001
    Publication date: June 27, 2002
    Inventors: Kazuyuki Ujiie, Hisashi Kawashima
  • Patent number: 6404640
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: June 11, 2002
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wie, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Publication number: 20020021557
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Application
    Filed: October 2, 2001
    Publication date: February 21, 2002
    Applicant: Fujitsu Limited,
    Inventors: Junichi Ishimine, Masahiro Suzuki, Akira Tamura, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Publication number: 20010020365
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Application
    Filed: December 28, 2000
    Publication date: September 13, 2001
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 5862038
    Abstract: A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.
    Type: Grant
    Filed: March 20, 1997
    Date of Patent: January 19, 1999
    Assignee: Fujitsu Limited
    Inventors: Masahiro Suzuki, Junichi Ishimine, Hisashi Kawashima, Keizo Takemura, Kiyotaka Seyama
  • Patent number: 5048598
    Abstract: A reservoir tank of the present invention employed in a liquid cooling system is provided with a plurality of outlets for feeding out the coolant and a plurality of inlets to which the coolant returns after cooling electronics devices. These outlets are provided at the center of bottom of the tank and these inlets are provided at the external circumference of the outlets. Incident angle of the inlets to the tank is inclined from the vertical line of tank so that the coolant generates a whirlpool around the vertical axis of tank. A cylindrical partition may be provided between the center of the bottom having the inlets and the circumferential part having the outlets, so as to prevent a short path of the coolant flowing from inlets to the outlets. In this case, holes may be provided at the partition so that the coolant stirred at the outside of partition flows to the outlets therethrough.
    Type: Grant
    Filed: January 24, 1990
    Date of Patent: September 17, 1991
    Assignee: Fujitsu Limited
    Inventors: Motohiro Takemae, Takaaki Kanki, Hirofumi Takao, Hisashi Kawashima, Hideo Katsumi
  • Patent number: 4865123
    Abstract: An apparatus for circulating cooling fluid through a plurality of cooling modules for cooling electronic components, such as IC'S or LSI'S. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules. Each of the supply systems includes a fluid line connected to a single tank containing cooling fluid and is provided with a pump and a heat exchanger, so that the cooling fluid in the tank is circulated through the respective cooling modules and returned to the tank, in which the cooling fluid is then mixed.
    Type: Grant
    Filed: October 18, 1988
    Date of Patent: September 12, 1989
    Assignee: Fujitsu Limited
    Inventors: Hisashi Kawashima, Tsuguo Okada, Haruhiko Yamamoto