Patents by Inventor Hisashi Kayano
Hisashi Kayano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7007736Abstract: A molten magnesium material is filled into a product section of a die. The molten magnesium material is cooled and solidified in the die, so that a molded product is formed. Subsequently, a thread-shaped pin is rotated, so that a female-thread forming section is drawn from the female-thread section of the molded product while the female-thread forming section is rotated. Thus, the female-thread section can be formed when the molded product is formed. A magnesium-alloy material is not apt to stick to a steel material used in the die compared with an aluminum-alloy material, so that the female-thread section can be steadily formed.Type: GrantFiled: January 6, 2004Date of Patent: March 7, 2006Assignee: Denso CorporationInventors: Hideyuki Suzuki, Hisashi Kayano, Koichiro Sato
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Publication number: 20050248048Abstract: In a thermosetting resin injection molding method, a mold comprising at least two portions and heaters for heating and controlling the mold to a predetermined temperature is provided. The method comprises a mold closing steps for closing the mold to form a cavity, an injection step for injecting a thermosetting resin material into the cavity, a hardening step for hardening the thermosetting resin material, and a mold opening step for opening the mold for taking out a hardened and molded product. When one cycle consists of steps from the mold closing step to the mold opening step, a cooling step is included in which the temperature of a cavity forming surface is reduced during a period from the end of the hardening step to the start of the injection step, and mold temperature is controlled by the heaters to a predetermined temperature at all times through the cycle.Type: ApplicationFiled: May 3, 2005Publication date: November 10, 2005Applicant: DENSO CorporationInventors: Makoto Suzuki, Takeshi Kusano, Hiroshi Nagae, Yoshitaka Kamiya, Hisashi Kayano
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Patent number: 6827129Abstract: A front-end module, including a heat exchanger including a radiator and a condenser integrated with each other, brackets, etc. and having a dual function as a strength member for the vehicle body, is mounted on an automotive vehicle. As a result, the front end panel is eliminated, and a simple structure is provided in which the parts which can be assembled on the front end of the vehicle, including the radiator, the condenser, headlights, a hood lock, a horn and sensors, can be assembled on the vehicle.Type: GrantFiled: June 27, 2001Date of Patent: December 7, 2004Assignee: Denso CorporationInventors: Ikuo Ozawa, Toshiki Sugiyama, Norihisa Sasano, Masakazu Watanabe, Hisashi Kayano
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Publication number: 20040159417Abstract: A molten magnesium material is filled into a product section of a die. The molten magnesium material is cooled and solidified in the die, so that a molded product is formed. Subsequently, a thread-shaped pin is rotated, so that a female-thread forming section is drawn from the female-thread section of the molded product while the female-thread forming section is rotated. Thus, the female-thread section can be formed when the molded product is formed. A magnesium-alloy material is not apt to stick to a steel material used in the die compared with an aluminum-alloy material, so that the female-thread section can be steadily formed.Type: ApplicationFiled: January 6, 2004Publication date: August 19, 2004Inventors: Hideyuki Suzuki, Hisashi Kayano, Koichiro Sato
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Publication number: 20030111765Abstract: A method which can prevent primary mold products from being deformed or broken during a secondary molding process to improve joining strength of joining portions.Type: ApplicationFiled: December 18, 2002Publication date: June 19, 2003Inventors: Masato Ichikawa, Hisashi Kayano, Tsutomu Onoue, Manabu Ishiguro, Toshiaki Nakayama
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Patent number: 6488887Abstract: A first compact (11) is molded by injection according to the MIM method in which a molding material composed of a mixture of metal powder and a binder is injected into a die for molding, after which a second compact (12) is molded by injection in close contact with the joining surface (110) of the first compact (11) thereby to fabricate a metal composite compact (1). The second compact (12) is molded by injection by making it flow and fill a die (8) in such a manner as to obtain a flow component (R) in the direction parallel to the joining surface (110) of the first compact (11) on the same joining surface (110). In a method according to another embodiment, cavity surfaces (60, 61) formed on a reference die (50) and a first replacement die (51), respectively, are placed in opposed relation to each other thereby to form a first cavity (71), in which the first compact (11) is molded by injection.Type: GrantFiled: October 27, 2000Date of Patent: December 3, 2002Assignee: Denso CorporationInventors: Tsuyoshi Arai, Isao Makino, Eiji Mimura, Hisashi Kayano
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Publication number: 20020135101Abstract: The present invention relates to a method of producing an insert-molding product in which an insert product 2 is covered with a synthetic resin by arranging the insert product 2 in a cavity 11 of a mold 10, holding the insert product by a holding pin 12, pouring a molten synthetic resin 3 into the cavity 11, and retracting the holding pin 12. The moving pin 13 is provided adjacent to the holding pin 12. After the cavity 11 is filled with the synthetic resin 3, the holding pin 12 is retracted and the moving pin 13 is moved in the direction of the cavity 11 to extrude and introduce the synthetic resin 3 into the space where the holding pin 12 used to be positioned.Type: ApplicationFiled: May 23, 2002Publication date: September 26, 2002Inventors: Tsutomu Onoue, Takehiro Sengoku, Hisashi Kayano
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Patent number: 6428732Abstract: A method of producing an insert-molding product in which an insert product is covered with a synthetic resin by arranging the insert product in a cavity of a mold is provided. The method includes holding the insert product by a holding pin, pouring a molten synthetic resin into the cavity, and retracting the holding pin. At least one moving pin is provided adjacent the holding pin. After the cavity is filled with the synthetic resin, the holding pin is retracted and the at least one moving pin is moved to extrude and introduce the synthetic resin into a space where the holding pin used to be positioned prior to its retraction from the cavity.Type: GrantFiled: June 9, 1999Date of Patent: August 6, 2002Assignee: Denso CorporationInventors: Tsutomu Onoue, Takehiro Sengoku, Hisashi Kayano
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Publication number: 20010050160Abstract: A front-end module, including a heat exchanger including a radiator and a condenser integrated with each other, brackets, etc. and having a dual function as a strength member for the vehicle body, is mounted on an automotive vehicle. As a result, the front end panel is eliminated, and a simple structure is provided in which the parts which can be assembled on the front end of the vehicle, including the radiator, the condenser, headlights, a hood lock, a horn and sensors, can be assembled on the vehicle.Type: ApplicationFiled: June 27, 2001Publication date: December 13, 2001Inventors: Ikuo Ozawa, Toshiki Sugiyama, Norihisa Sasano, Masakazu Watanabe, Hisashi Kayano
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Publication number: 20010027883Abstract: The flexible section 452 made of rubber or elastomer is molded integrally with the panel body 450 on the forward end side of the guide duct section 451 of the panel body made of resin, and the seal section 461 for tightly closing gap &dgr; between the panel body 450 and the heat exchanger 21 is molded integrally with the panel body 450 on the introduction opening section 460 side in the panel body 450. Due to the foregoing, it is possible to prevent the panel body 450 and the guide duct section 451 from being damaged in the case of a light collision. Therefore, a repair cost, which must be paid by a vehicle owner, is reduced and an increase in the number of parts of the front end structure and an increase in the cost of assembling are suppressed even though gap &dgr; between the panel body 450 and the heat exchanger 21 is tightly closed so that a decrease in the heat radiating capacity (heat exchange capacity) of the heat exchanger 21 can be prevented.Type: ApplicationFiled: April 5, 2001Publication date: October 11, 2001Inventors: Norihisa Sasano, Ikuo Ozawa, Noriaki Maeda, Toshiki Sugiyama, Tsutomu Onoue, Hisashi Kayano, Yasushi Hibi
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Patent number: 5875750Abstract: In a rotational phase adjusting apparatus which may be used for controlling opening/closing timings of intake and exhaust valves of an internal combustion engine, one side wall of a housing is fixed to one of a driving member and a driven member, while the other side wall of the housing is made integrally with a circumferential wall of the housing. A seal made of a material less harder than the housing is provided between the housing and a vane. The housing is made of an aluminum while the seal is made of a PPS resin mixed with an inorganic filler. The inorganic filler is harder than the PPS resin but less harder than the housing to reduce wear of the housing.Type: GrantFiled: September 12, 1997Date of Patent: March 2, 1999Assignee: Denso CorporationInventors: Kazutoshi Iwasaki, Hiroyuki Yamazaki, Michio Adachi, Masayasu Ushida, Hisashi Kayano, Isamu Inai
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Patent number: 5282385Abstract: A hot-wire type flowmeter for measuring a flow rate of a fluid in a passage comprises a pair of support pins extending in parallel with an axis of the passage and an electrical resistor supported between the support pins in the passage. The resistor includes a pipe made of an electrically insulating material, a resistor wire wound on the pipe, and a pair of lead wires. The lead wires are secured to opposite end portions of the pipe and extend in opposite directions and in parallel to each other. The resistor is supported by the support pins through the lead wires.Type: GrantFiled: May 29, 1991Date of Patent: February 1, 1994Assignee: Nippondenso Co., Ltd.Inventors: Hisashi Kayano, Tomokazu Kondo, Yukio Sawada