Patents by Inventor Hisashi Koaizawa
Hisashi Koaizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210259174Abstract: A deep water drawing step of drawing deep water that exists in a deep region of the sea to a surface region of the sea with an upwelling pipe (1); and a phytoplankton culturing step of culturing the phytoplankton in the upwelling pipe (1) are included to produce, as a basic producer of a food chain, a living marine resource, such as fishes and shellfishes, with phytoplankton produced in the phytoplankton culturing step.Type: ApplicationFiled: June 14, 2019Publication date: August 26, 2021Applicant: Yokogawa Electric CorporationInventors: Hirofumi NAKANISHI, Satoshi YOSHITAKE, Hiroshi IKEDA, Hisashi KOAIZAWA
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Patent number: 10591135Abstract: A frame has an outer frame made of microcellular foam resin, and two inner frames made of the microcellular foam resin. The two inner frames are arranged together inside the outer frame. Both of the inner frames and the outer frame include openings provided at respective upper portions and recess portions formed downwardly from the openings, respectively. An LED light source, which is arranged inside a light guide space, emits light with a light emitting face thereof directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion. Also, an LED light source arranged inside a light guide space emits light directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion.Type: GrantFiled: March 16, 2018Date of Patent: March 17, 2020Assignees: FURUKAWA ELECTRIC CO., LTD., TOTOKU ELECTRIC CO., LTD.Inventors: Syouta Inoue, Tetsuji Kubota, Syunji Yamamoto, Hisashi Koaizawa, Tomio Kaise
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Publication number: 20180216799Abstract: A frame has an outer frame made of microcellular foam resin, and two inner frames made of the microcellular foam resin. The two inner frames are arranged together inside the outer frame. Both of the inner frames and the outer frame include openings provided at respective upper portions and recess portions formed downwardly from the openings, respectively. An LED light source, which is arranged inside a light guide space, emits light with a light emitting face thereof directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion. Also, an LED light source arranged inside a light guide space emits light directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion.Type: ApplicationFiled: March 16, 2018Publication date: August 2, 2018Inventors: Syouta Inoue, Tetsuji Kubota, Syunji Yamamoto, Hisashi Koaizawa, Tomio Kaise
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Patent number: 8778719Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.Type: GrantFiled: September 6, 2011Date of Patent: July 15, 2014Assignee: Furukawa Electric Co., Ltd.Inventors: Toshihiro Nakamura, Nobuaki Orita, Hisashi Koaizawa, Kenkichi Suzuki, Hiroshi Kuraseko, Michio Kondo
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Patent number: 8758637Abstract: An apparatus of removing coatings of a line-shaped body of the invention includes a non-equilibrium atmospheric pressure plasma source with radicals controlled, having a plasma generating gas, a microwave, a micro gap; a line-shaped body holding portion for holding the line-shaped body within a range of 2 to 3 mm from an electrode to generate a plasma jet; and a moving stage for relatively moving the line-shaped body in the longitudinal direction thereof.Type: GrantFiled: September 30, 2008Date of Patent: June 24, 2014Assignees: The Furukawa Electric Co., Ltd.Inventors: Takeshi Hirayama, Imei Shu, Sadayuki Toda, Hisashi Koaizawa, Masaru Hori
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Patent number: 8673396Abstract: A method of continuously forming a thin film includes the step of: moving a glass substrate with a thin strip shape having a constant db/2(d+b), where d is a thickness thereof and b is a width thereof in a cross section thereof, within a range from 0.015 to 0.15 through a film depositing region in which a reaction gas is supplied and a temperature is controlled to be high so that the glass substrate is rapidly heated; and moving continuously the glass substrate, immediately after the film depositing region, to pass through a cooling region in which a temperature is lower than that of the film depositing region, so that the glass substrate is rapidly cooled and the thin film formed of a component of the reaction gas is formed on the glass substrate.Type: GrantFiled: September 11, 2008Date of Patent: March 18, 2014Assignee: Furukawa Electric Co., Ltd.Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
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Patent number: 8598017Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are arranged at intervals in a width direction are formed on a surface of the fiber 1.Type: GrantFiled: September 13, 2012Date of Patent: December 3, 2013Assignee: The Furukawa Electric Co., Ltd.Inventors: Takashi Fuyuki, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
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Patent number: 8418503Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.Type: GrantFiled: January 10, 2011Date of Patent: April 16, 2013Assignee: The Furukawa Electric Co., Ltd.Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
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Publication number: 20130023090Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are arranged at intervals in a width direction are formed on a surface of the fiber 1.Type: ApplicationFiled: September 13, 2012Publication date: January 24, 2013Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Takashi FUYUKI, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
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Publication number: 20120034728Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.Type: ApplicationFiled: September 6, 2011Publication date: February 9, 2012Applicant: Furukawa Electric Co, Ltd.Inventors: Toshihiro NAKAMURA, Nobuaki ORITA, Hisashi KOAIZAWA, Kenkichi SUZUKI, Hiroshi KURASEKO, Michio KONDO
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Patent number: 8039927Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.Type: GrantFiled: March 23, 2006Date of Patent: October 18, 2011Assignee: The Furukawa Electric Co., Ltd.Inventors: Toshihiro Nakamura, Nobuaki Orita, Hisashi Koaizawa, Kenkichi Suzuki, Hiroshi Kuraseko, Michio Kondo
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Patent number: 8029327Abstract: A display device includes a first fiber having a silicon layer or an oxide layer, on which an active element is formed on the surface of the fiber and a second fiber forming a combined one-dimensional substrate together with the first fiber by being combined with the first fiber and having light emitting layers formed on a plurality of domains of the device. The first fiber and the second fiber are respectively drawn out from take-up jigs, are cut in necessary lengths and separated into plural fibers, and these plural first or second fibers are mounted in parallel with each other on a fixing jig. In this state, at least one-side elements of active elements and passive elements are formed on the first or second fibers.Type: GrantFiled: January 29, 2010Date of Patent: October 4, 2011Assignee: The Furukawa Electric Co., Ltd.Inventors: Tsuneo Suzuki, Takeshi Hirayama, Hisashi Koaizawa, Kiyoshi Yase, Kenkichi Suzuki, Michio Kondo
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Publication number: 20110100059Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.Type: ApplicationFiled: January 10, 2011Publication date: May 5, 2011Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Toshihiro NAKAMURA, Sadayuki TODA, Hisashi KOAIZAWA
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Patent number: 7883778Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.Type: GrantFiled: January 23, 2007Date of Patent: February 8, 2011Assignee: The Furukawa Electric Co., Ltd.Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
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Publication number: 20100136870Abstract: The invention provides a display device using a one-dimensional substrate making layout of a substrate unnecessary and realizing a further low cost. A display device of the invention comprises a first fiber having a silicon layer or an oxide layer, on which an active element is formed, formed on the surface of it and a second fiber forming a combined one-dimensional substrate together with the first fiber by being combined with the first fiber and having light emitting layers formed on a plurality of domains of it, wherein the first fiber and the second fiber are respectively drawn out from take-up jigs, are cut in necessary lengths and separated into plural fibers, and these plural first or second fibers are mounted in parallel with each other on a fixing jig and in this state, at least one-side elements of active elements and passive elements are formed on the first or second fibers.Type: ApplicationFiled: January 29, 2010Publication date: June 3, 2010Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Tsuneo SUZUKI, Takeshi Hirayama, Hisashi Koaizawa, Kiyoshi Yase, Kenkichi Suzuki, Michio Kondo
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Patent number: 7729565Abstract: A fiber sensor comprising: an optical waveguide unit having a measurement surface formed at an end of an optical waveguide; and a channel unit through which a specimen, serving as a measurement object to be measured by contact with the measurement surface, is caused to flow in and out via a specimen channel, wherein the optical waveguide is fixed to the optical waveguide unit such that the measurement surface forms a part of a channel wall surface of the channel unit, and the optical waveguide unit is provided so as to be detachable from the channel unit.Type: GrantFiled: November 25, 2005Date of Patent: June 1, 2010Assignee: The Furukawa Electric Co., Ltd.Inventors: Takayuki Ando, Hisashi Koaizawa, Takashi Shigematu, Ken Tsukii, Masaki Izumo
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Publication number: 20100021727Abstract: A method of continuously forming a thin film includes the step of: moving a glass substrate with a thin strip shape having a constant db/2(d+b), where d is a thickness thereof and b is a width thereof in a cross section thereof, within a range from 0.015 to 0.15 through a film depositing region in which a reaction gas is supplied and a temperature is controlled to be high so that the glass substrate is rapidly heated; and moving continuously the glass substrate, immediately after the film depositing region, to pass through a cooling region in which a temperature is lower than that of the film depositing region, so that the glass substrate is rapidly cooled and the thin film formed of a component of the reaction gas is formed on the glass substrate.Type: ApplicationFiled: September 11, 2008Publication date: January 28, 2010Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
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Publication number: 20090223929Abstract: An apparatus of removing coatings of a line-shaped body of the invention includes a non-equilibrium atmospheric pressure plasma source with radicals controlled, having a plasma generating gas, a microwave, a micro gap; a line-shaped body holding portion for holding the line-shaped body within a range of 2 to 3 mm from an electrode to generate a plasma jet; and a moving stage for relatively moving the line-shaped body in the longitudinal direction thereof.Type: ApplicationFiled: September 30, 2008Publication date: September 10, 2009Applicants: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Takeshi HIRAYAMA, Imei SHU, Sadayuki TODA, Hisashi KOAIZAWA, Masaru HORI
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Publication number: 20090001501Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are a ranged at intervals in a width direction are formed on a surface of the fiber 1.Type: ApplicationFiled: October 27, 2005Publication date: January 1, 2009Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Takashi Fuyuki, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
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Publication number: 20080093541Abstract: A fiber sensor comprising: an optical waveguide unit having a measurement surface formed at an end of an optical waveguide; and a channel unit through which a specimen, serving as a measurement object to be measured by contact with the measurement surface, is caused to flow in and out via a specimen channel, wherein the optical waveguide is fixed to the optical waveguide unit such that the measurement surface forms a part of a channel wall surface of the channel unit, and the optical waveguide unit is provided so as to be detachable from the channel unit.Type: ApplicationFiled: November 25, 2005Publication date: April 24, 2008Inventors: Takayuki Ando, Hisashi Koaizawa, Takashi Shigematu, Ken Tsukii, Masaki Izumo