Patents by Inventor Hisashi Koaizawa

Hisashi Koaizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210259174
    Abstract: A deep water drawing step of drawing deep water that exists in a deep region of the sea to a surface region of the sea with an upwelling pipe (1); and a phytoplankton culturing step of culturing the phytoplankton in the upwelling pipe (1) are included to produce, as a basic producer of a food chain, a living marine resource, such as fishes and shellfishes, with phytoplankton produced in the phytoplankton culturing step.
    Type: Application
    Filed: June 14, 2019
    Publication date: August 26, 2021
    Applicant: Yokogawa Electric Corporation
    Inventors: Hirofumi NAKANISHI, Satoshi YOSHITAKE, Hiroshi IKEDA, Hisashi KOAIZAWA
  • Patent number: 10591135
    Abstract: A frame has an outer frame made of microcellular foam resin, and two inner frames made of the microcellular foam resin. The two inner frames are arranged together inside the outer frame. Both of the inner frames and the outer frame include openings provided at respective upper portions and recess portions formed downwardly from the openings, respectively. An LED light source, which is arranged inside a light guide space, emits light with a light emitting face thereof directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion. Also, an LED light source arranged inside a light guide space emits light directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 17, 2020
    Assignees: FURUKAWA ELECTRIC CO., LTD., TOTOKU ELECTRIC CO., LTD.
    Inventors: Syouta Inoue, Tetsuji Kubota, Syunji Yamamoto, Hisashi Koaizawa, Tomio Kaise
  • Publication number: 20180216799
    Abstract: A frame has an outer frame made of microcellular foam resin, and two inner frames made of the microcellular foam resin. The two inner frames are arranged together inside the outer frame. Both of the inner frames and the outer frame include openings provided at respective upper portions and recess portions formed downwardly from the openings, respectively. An LED light source, which is arranged inside a light guide space, emits light with a light emitting face thereof directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion. Also, an LED light source arranged inside a light guide space emits light directing toward the light guide space. Accordingly, light from the LED light source is uniformly emitted from a light extraction portion.
    Type: Application
    Filed: March 16, 2018
    Publication date: August 2, 2018
    Inventors: Syouta Inoue, Tetsuji Kubota, Syunji Yamamoto, Hisashi Koaizawa, Tomio Kaise
  • Patent number: 8778719
    Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: July 15, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Nakamura, Nobuaki Orita, Hisashi Koaizawa, Kenkichi Suzuki, Hiroshi Kuraseko, Michio Kondo
  • Patent number: 8758637
    Abstract: An apparatus of removing coatings of a line-shaped body of the invention includes a non-equilibrium atmospheric pressure plasma source with radicals controlled, having a plasma generating gas, a microwave, a micro gap; a line-shaped body holding portion for holding the line-shaped body within a range of 2 to 3 mm from an electrode to generate a plasma jet; and a moving stage for relatively moving the line-shaped body in the longitudinal direction thereof.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: June 24, 2014
    Assignees: The Furukawa Electric Co., Ltd.
    Inventors: Takeshi Hirayama, Imei Shu, Sadayuki Toda, Hisashi Koaizawa, Masaru Hori
  • Patent number: 8673396
    Abstract: A method of continuously forming a thin film includes the step of: moving a glass substrate with a thin strip shape having a constant db/2(d+b), where d is a thickness thereof and b is a width thereof in a cross section thereof, within a range from 0.015 to 0.15 through a film depositing region in which a reaction gas is supplied and a temperature is controlled to be high so that the glass substrate is rapidly heated; and moving continuously the glass substrate, immediately after the film depositing region, to pass through a cooling region in which a temperature is lower than that of the film depositing region, so that the glass substrate is rapidly cooled and the thin film formed of a component of the reaction gas is formed on the glass substrate.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: March 18, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
  • Patent number: 8598017
    Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are arranged at intervals in a width direction are formed on a surface of the fiber 1.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 3, 2013
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takashi Fuyuki, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
  • Patent number: 8418503
    Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: April 16, 2013
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
  • Publication number: 20130023090
    Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are arranged at intervals in a width direction are formed on a surface of the fiber 1.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 24, 2013
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takashi FUYUKI, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
  • Publication number: 20120034728
    Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.
    Type: Application
    Filed: September 6, 2011
    Publication date: February 9, 2012
    Applicant: Furukawa Electric Co, Ltd.
    Inventors: Toshihiro NAKAMURA, Nobuaki ORITA, Hisashi KOAIZAWA, Kenkichi SUZUKI, Hiroshi KURASEKO, Michio KONDO
  • Patent number: 8039927
    Abstract: The linear semiconductor substrate 1 or 2 of the present invention comprises at least one desired thin film 4 formed on a linear substrate 3 having a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin film 4 forms a linear semiconductor thin film. The linear semiconductor substrate 1 or 2 of the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: October 18, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Nakamura, Nobuaki Orita, Hisashi Koaizawa, Kenkichi Suzuki, Hiroshi Kuraseko, Michio Kondo
  • Patent number: 8029327
    Abstract: A display device includes a first fiber having a silicon layer or an oxide layer, on which an active element is formed on the surface of the fiber and a second fiber forming a combined one-dimensional substrate together with the first fiber by being combined with the first fiber and having light emitting layers formed on a plurality of domains of the device. The first fiber and the second fiber are respectively drawn out from take-up jigs, are cut in necessary lengths and separated into plural fibers, and these plural first or second fibers are mounted in parallel with each other on a fixing jig. In this state, at least one-side elements of active elements and passive elements are formed on the first or second fibers.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 4, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsuneo Suzuki, Takeshi Hirayama, Hisashi Koaizawa, Kiyoshi Yase, Kenkichi Suzuki, Michio Kondo
  • Publication number: 20110100059
    Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.
    Type: Application
    Filed: January 10, 2011
    Publication date: May 5, 2011
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Toshihiro NAKAMURA, Sadayuki TODA, Hisashi KOAIZAWA
  • Patent number: 7883778
    Abstract: A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 ?m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: February 8, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
  • Publication number: 20100136870
    Abstract: The invention provides a display device using a one-dimensional substrate making layout of a substrate unnecessary and realizing a further low cost. A display device of the invention comprises a first fiber having a silicon layer or an oxide layer, on which an active element is formed, formed on the surface of it and a second fiber forming a combined one-dimensional substrate together with the first fiber by being combined with the first fiber and having light emitting layers formed on a plurality of domains of it, wherein the first fiber and the second fiber are respectively drawn out from take-up jigs, are cut in necessary lengths and separated into plural fibers, and these plural first or second fibers are mounted in parallel with each other on a fixing jig and in this state, at least one-side elements of active elements and passive elements are formed on the first or second fibers.
    Type: Application
    Filed: January 29, 2010
    Publication date: June 3, 2010
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tsuneo SUZUKI, Takeshi Hirayama, Hisashi Koaizawa, Kiyoshi Yase, Kenkichi Suzuki, Michio Kondo
  • Patent number: 7729565
    Abstract: A fiber sensor comprising: an optical waveguide unit having a measurement surface formed at an end of an optical waveguide; and a channel unit through which a specimen, serving as a measurement object to be measured by contact with the measurement surface, is caused to flow in and out via a specimen channel, wherein the optical waveguide is fixed to the optical waveguide unit such that the measurement surface forms a part of a channel wall surface of the channel unit, and the optical waveguide unit is provided so as to be detachable from the channel unit.
    Type: Grant
    Filed: November 25, 2005
    Date of Patent: June 1, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takayuki Ando, Hisashi Koaizawa, Takashi Shigematu, Ken Tsukii, Masaki Izumo
  • Publication number: 20100021727
    Abstract: A method of continuously forming a thin film includes the step of: moving a glass substrate with a thin strip shape having a constant db/2(d+b), where d is a thickness thereof and b is a width thereof in a cross section thereof, within a range from 0.015 to 0.15 through a film depositing region in which a reaction gas is supplied and a temperature is controlled to be high so that the glass substrate is rapidly heated; and moving continuously the glass substrate, immediately after the film depositing region, to pass through a cooling region in which a temperature is lower than that of the film depositing region, so that the glass substrate is rapidly cooled and the thin film formed of a component of the reaction gas is formed on the glass substrate.
    Type: Application
    Filed: September 11, 2008
    Publication date: January 28, 2010
    Inventors: Toshihiro Nakamura, Sadayuki Toda, Hisashi Koaizawa
  • Publication number: 20090223929
    Abstract: An apparatus of removing coatings of a line-shaped body of the invention includes a non-equilibrium atmospheric pressure plasma source with radicals controlled, having a plasma generating gas, a microwave, a micro gap; a line-shaped body holding portion for holding the line-shaped body within a range of 2 to 3 mm from an electrode to generate a plasma jet; and a moving stage for relatively moving the line-shaped body in the longitudinal direction thereof.
    Type: Application
    Filed: September 30, 2008
    Publication date: September 10, 2009
    Applicants: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takeshi HIRAYAMA, Imei SHU, Sadayuki TODA, Hisashi KOAIZAWA, Masaru HORI
  • Publication number: 20090001501
    Abstract: The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substrate 5 comprising a fiber 1 with a polygonal cross section, and a semiconductor thin film 3 crystallized after film formation on at least one surface of the fiber 1, and a plurality of grooves 8 that extend in a linear direction of the fiber 1 and are a ranged at intervals in a width direction are formed on a surface of the fiber 1.
    Type: Application
    Filed: October 27, 2005
    Publication date: January 1, 2009
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takashi Fuyuki, Kenkichi Suzuki, Sadayuki Toda, Hisashi Koaizawa
  • Publication number: 20080093541
    Abstract: A fiber sensor comprising: an optical waveguide unit having a measurement surface formed at an end of an optical waveguide; and a channel unit through which a specimen, serving as a measurement object to be measured by contact with the measurement surface, is caused to flow in and out via a specimen channel, wherein the optical waveguide is fixed to the optical waveguide unit such that the measurement surface forms a part of a channel wall surface of the channel unit, and the optical waveguide unit is provided so as to be detachable from the channel unit.
    Type: Application
    Filed: November 25, 2005
    Publication date: April 24, 2008
    Inventors: Takayuki Ando, Hisashi Koaizawa, Takashi Shigematu, Ken Tsukii, Masaki Izumo