Patents by Inventor Hisashi Komiya

Hisashi Komiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6692691
    Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 17, 2004
    Assignees: Nihon Alimit Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa
  • Patent number: 6440360
    Abstract: The present invention proposes Pb-free soldering alloy which does not contain Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it contains Cu in 0.05 to 2.0 wt. %, Ni in 0.001 to 2.0 wt. % and Sn in the balance.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: August 27, 2002
    Assignee: Tokyo First Trading Company
    Inventors: Tadashi Sawamura, Hisashi Komiya
  • Publication number: 20020015659
    Abstract: Pb-free soldering alloy that does not include any amount of Pb is proposed.
    Type: Application
    Filed: June 29, 2001
    Publication date: February 7, 2002
    Applicant: Nihon Almit Co., Ltd.
    Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa