Patents by Inventor Hisashi MASUMOTO

Hisashi MASUMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND MOLDED ARTICLE THEREOF
    Publication number: 20240025093
    Abstract: An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 ?m and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 ?m which is smaller than the average cell diameter of the expanded bead.
    Type: Application
    Filed: July 3, 2023
    Publication date: January 25, 2024
    Applicant: JSP CORPORATION
    Inventor: Hisashi MASUMOTO