Patents by Inventor Hisashi Mihori
Hisashi Mihori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11932733Abstract: Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 ?m and not more than 200 ?m, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10?3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.Type: GrantFiled: February 5, 2021Date of Patent: March 19, 2024Assignee: Asahi Kasei Construction Materials CorporationInventors: Hisashi Mihori, Narumi Miyata, Nobuki Hiramatsu
-
Publication number: 20230226801Abstract: In the phenolic resin foam laminate board (10), a surface material (2) is arranged on at least one of one side of a phenolic resin foam (1) and the back side of the one side. The phenolic resin foam (1) has a density of not less than 22 kg/m3 and not more than 50 kg/m3, a cell diameter of not less than 50 ?m and not more than 170 ?m, and a closed cell ratio of not less than 80%. When HCFO-1224yd(Z), aliphatic hydrocarbons having a carbon number of 6 or less, chlorinated saturated hydrocarbons having a carbon number of 5 or less, and hydrofluoroolefin are gas components, the phenolic resin foam contains only HCFO-1224yd (Z) as a gas component. A cell internal pressure of air bubble is 0.20 atm or more.Type: ApplicationFiled: January 15, 2021Publication date: July 20, 2023Applicant: Asahi Kasei Construction Materials CorporationInventors: Nobuki HIRAMATSU, Hisashi MIHORI, Takayuki KURODA
-
Publication number: 20230074052Abstract: Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 ?m and not more than 200 ?m, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10?3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.Type: ApplicationFiled: February 5, 2021Publication date: March 9, 2023Applicant: Asahi Kasei Construction Materials CorporationInventors: Hisashi MIHORI, Narumi MIYATA, Nobuki HIRAMATSU
-
Patent number: 11326036Abstract: A phenolic resin foam has a density of 30 kg/m3 to 80 kg/m3, a closed cell ratio of 85% or more, and reaches a total amount of heat release of 8 MJ/m2 in a time of 20 minutes or more in a heat release test performed using a cone calorimeter.Type: GrantFiled: April 26, 2019Date of Patent: May 10, 2022Assignee: Asahi Kasei Construction Materials CorporationInventors: Hisashi Mihori, Noriaki Kikuchi, Masami Komiyama
-
Patent number: 11299598Abstract: A phenolic resin foam has a density of 30 kg/m3 to 80 kg/m3, a closed cell ratio of 85% or more, and reaches a total amount of heat release of 8 MJ/m2 in a time of 20 minutes or more in a heat release test performed using a cone calorimeter.Type: GrantFiled: April 26, 2019Date of Patent: April 12, 2022Assignee: Asahi Kasei Construction Materials CorporationInventors: Hisashi Mihori, Noriaki Kikuchi, Masami Komiyama
-
Publication number: 20210230389Abstract: A phenolic resin foam has a density of 30 kg/m3 to 80 kg/m3, a closed cell ratio of 85% or more, and reaches a total amount of heat release of 8 MJ/m2 in a time of 20 minutes or more in a heat release test performed using a cone calorimeter.Type: ApplicationFiled: April 26, 2019Publication date: July 29, 2021Applicant: Asahi Kasei Construction Materials CorporationInventors: Hisashi MIHORI, Noriaki KIKUCHI, Masami KOMIYAMA
-
Publication number: 20190352484Abstract: A method of producing a phenolic resin foam is provided. The method includes foaming and curing, on a surface material, a foamable phenolic resin composition containing a phenolic resin, a surfactant, a curing catalyst, and at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin has a weight average molecular weight Mw of at least 400 and no greater than 3,000 as determined by gel permeation chromatography. The phenolic resin has a viscosity at 40° C. of at least 1,000 mPa·s and no greater than 100,000 mPa·s. The phenolic resin has a viscosity increase rate constant of at least 0.05 (1/min) and no greater than 0.5 (1/min).Type: ApplicationFiled: July 29, 2019Publication date: November 21, 2019Applicant: Asahi Kasei Construction Materials CorporationInventors: Masato HAMAJIMA, Shigemi MUKAIYAMA, Ken IHARA, Hisashi MIHORI, Yoshihito FUKASAWA
-
Publication number: 20180230283Abstract: Provided are a phenolic resin foam that has low environmental impact, can maintain excellent thermal insulation performance over the long-term, and reduces condensation inside walls associated with increased water vapor permeation, and also a method of producing the same. The phenolic resin foam contains a phenolic resin and at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin foam has a density of at least 20 kg/m3 and no greater than 100 kg/m3, an average cell diameter of at least 10 um and no greater than 300 ?m, a closed cell ratio of at least 80% and no greater than 99%, and a water vapor permeance of at least 0.38 ng/(m·s·Pa) and no greater than 2.00 ng/(m·s·Pa).Type: ApplicationFiled: March 23, 2016Publication date: August 16, 2018Applicant: Asahi Kasei Construction Materials CorporationInventors: Ken IHARA, Shigemi MUKAIYAMA, Masato HAMAJIMA, Hisashi MIHORI, Yoshihito FUKASAWA
-
Patent number: 9976026Abstract: A phenol resin foamed plate contains hydrocarbon and/or chlorinated aliphatic hydrocarbon, in which an average cell diameter is in a range of 5 ?m or more and 200 ?m or less, a void area ratio is 5% or less in its cross section, a density is 15 kg/m3 or more and 26 kg/m3 or less, and when compression is made by a 10% displacement in a direction perpendicular to the thickness direction, a recovery rate 1 minute after release of this compression is 96.0% or more and 98.5% or less and a degree of change in recovery rates C is 0.030%/hr or more and 0.060%/hr or less.Type: GrantFiled: October 17, 2011Date of Patent: May 22, 2018Assignee: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Hisashi Mihori, Yukihiro Shimizu, Yuuki Saito, Yoshihito Fukasawa
-
Patent number: 9975311Abstract: A phenolic resin foam laminated sheet comprising a phenolic resin foam; and a face material for covering a surface of the phenolic resin foam, wherein the phenolic resin foam contains a hydrocarbon, a chlorinated aliphatic hydrocarbon or a combination thereof, a density of the phenolic resin foam is 10 kg/m3 or higher and 100 kg/m3 or lower, an average cell diameter of the phenolic resin foam is 5 ?m or larger and 200 ?m or smaller, a closed cell content of the phenolic resin foam is 85% or higher and 99% or lower, and an absolute value of a dimensional charge rate of the phenolic resin foam after 70° C. for 48 hours is 0.49% or lower.Type: GrantFiled: March 25, 2011Date of Patent: May 22, 2018Assignee: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Masato Hamajima, Yoshimitsu Inoue, Hisashi Mihori, Yoshihito Fukasawa
-
Patent number: 9957368Abstract: The present invention is a phenolic resin foam board having a thickness of 40 mm or more to 300 mm or less, when the phenolic resin foam board is sliced into n pieces (n?5) at approximately equal intervals of 8 mm or more to 10 mm or less, a density of an n-th specimen is dn, an average density of n pieces of specimens is dave, a lowest density among the densities of n pieces of specimens is dmin, 0?(dave?dmin)/dave?0.12 is established, and when values for Di=(di+d(i+1))/2 are calculated, Di values are plotted and points corresponding to the Di values are connected, resulting in a density distribution curve, no straight line parallel to the horizontal axis intersects the density distribution curve at four points.Type: GrantFiled: February 26, 2014Date of Patent: May 1, 2018Assignee: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Takayuki Kuroda, Hisashi Mihori, Takatoshi Kitagawa
-
Publication number: 20180044494Abstract: Provided are a phenolic resin foam having low environmental impact, high compressive strength, excellent handling properties in installation, and low costs associated with securing, and also a method of producing the same. The phenolic resin foam contains at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin foam has a density of at least 20 kg/m3 and no greater than 100 kg/m3, and a closed cell ratio of at least 80% and no greater than 99%. The density and 10% compressive strength of the phenolic resin foam satisfy a relationship: C?0.5X?7, where C represents the 10% compressive strength (N/cm2) and X represents the density (kg/m3).Type: ApplicationFiled: March 23, 2016Publication date: February 15, 2018Applicant: Asahi Kasei Construction Materials CorporationInventors: Masato HAMAJIMA, Shigemi MUKAIYAMA, Ken IHARA, Hisashi MIHORI, Yoshihito FUKASAWA
-
Publication number: 20160002428Abstract: The present invention is a phenolic resin foam board having a thickness of 40 mm or more to 300 mm or less, when the phenolic resin foam board is sliced into n pieces (n?5) at approximately equal intervals of 8 mm or more to 10 mm or less, a density of an n-th specimen is dn, an average density of n pieces of specimens is dave, a lowest density among the densities of n pieces of specimens is dmin, 0?(dave?dmin)/dave?0.12 is established, and when values for Di=(di+d(i+1))/2 are calculated, Di values are plotted and points corresponding to the Di values are connected, resulting in a density distribution curve, no straight line parallel to the horizontal axis intersects the density distribution curve at four points.Type: ApplicationFiled: February 26, 2014Publication date: January 7, 2016Applicant: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Takayuki KURODA, Hisashi MIHORI, Takatoshi KITAGAWA
-
Patent number: 9120904Abstract: There is provided an expandable phenolic resin composition comprising: a phenolic resin; an acid curing catalyst for the resin; a foaming agent; and a surfactant, wherein the foaming agent comprises a hydrocarbon-based foaming agent; and the surfactant is a polyoxyethylene alkyl ether having an alkyl ether moiety having 14 to 22 carbon atoms, and the content of the surfactant is 0.01 to 10 parts by weight relative to 100 parts by weight of the phenolic resin.Type: GrantFiled: November 4, 2009Date of Patent: September 1, 2015Assignee: ASAHI KASEI CONTRUCTION MATERIALS CORPORATIONInventors: Takatoshi Kitagawa, Hisashi Mihori, Yoshihito Fukasawa
-
Publication number: 20130288038Abstract: A phenol resin foamed plate contains hydrocarbon and/or chlorinated aliphatic hydrocarbon, in which an average cell diameter is in a range of 5 ?m or more and 200 ?m or less, a void area ratio is 5% or less in its cross section, a density is 15 kg/m3 or more and 26 kg/m3 or less, and when compression is made by a 10% displacement in a direction perpendicular to the thickness direction, a recovery rate 1 minute after release of this compression is 96.0% or more and 98.5% or less and a degree of change in recovery rates C is 0.030%/hr or more and 0.060%/hr or less.Type: ApplicationFiled: October 17, 2011Publication date: October 31, 2013Applicant: Asahi Kasei Construction Materials CorporationInventors: Hisashi Mihori, Yukihiro Shimizu, Yuuki Saito, Yoshihito Fukasawa
-
Publication number: 20130011655Abstract: A phenolic resin foam laminated sheet comprising a phenolic resin foam; and a face material for covering a surface of the phenolic resin foam, wherein the phenolic resin foam contains a hydrocarbon, a chlorinated aliphatic hydrocarbon or a combination thereof, a density of the phenolic resin foam is 10 kg/m3 or higher and 100 kg/m3 or lower, an average cell diameter of the phenolic resin foam is 5 ?m or larger and 200 ?m or smaller, a closed cell content of the phenolic resin foam is 85% or higher and 99% or lower, and an absolute value of a dimensional charge rate of the phenolic resin foam after 70° C. for 48 hours is 0.49% or lower.Type: ApplicationFiled: March 25, 2011Publication date: January 10, 2013Applicant: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Masato Hamajima, Yoshimitsu Inoue, Hisashi Mihori, Yoshihito Fukasawa
-
Publication number: 20120270026Abstract: A phenolic resin foamed plate having a thickness of 50 mm or more, in which when the phenolic resin foamed plate is sliced from one main surface of the phenolic resin foamed plate along the main surface in a thickness direction at 5 mm intervals to produce n pieces, which are designated as Q1 to Qn in order from the main surface side, where average densities of Q1 to Qn are dq1 to dqn, respectively, the ratio (dqmin/dqave) of a minimum value dqmin of dq2 to dq(n-1) to an average value dqave of dq2 to dq(n-1) is 0.91?dqmin/dqave?0.98, and when a density distribution line is obtained, there exists a straight line parallel with the axis of abscissas that intersects the density distribution line at four points. The phenolic resin foamed plate exhibiting practically sufficient compressive strength and thermal conductivity even when the product thickness is increased.Type: ApplicationFiled: December 15, 2010Publication date: October 25, 2012Applicant: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Hisashi Mihori, Hirofumi Watanabe, Yuki Saito
-
Publication number: 20110263731Abstract: There is provided an expandable phenolic resin composition comprising: a phenolic resin; an acid curing catalyst for the resin; a foaming agent; and a surfactant, wherein the foaming agent comprises a hydrocarbon-based foaming agent; and the surfactant is a polyoxyethylene alkyl ether having an alkyl ether moiety having 14 to 22 carbon atoms, and the content of the surfactant is 0.01 to 10 parts by weight relative to 100 parts by weight of the phenolic resin.Type: ApplicationFiled: November 4, 2009Publication date: October 27, 2011Applicant: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATIONInventors: Takatoshi Kitagawa, Hisashi Mihori, Yoshihito Fukasawa
-
Publication number: 20100295201Abstract: The present invention is a process for producing a thermosetting resin foamed plate, comprising a step of discharging a resin composition obtained by mixing at least a thermosetting resin, a foaming agent and a curing agent onto a surface material and foaming and curing the resin composition, wherein the resin composition is supplied into a die from a plurality of inlets of the die by a plurality of branched channels to reside, and the resin composition is discharged from a die lip outlet onto the surface material into a plate form.Type: ApplicationFiled: November 14, 2008Publication date: November 25, 2010Applicant: Asahi Kasei Construction Materials CorporationInventors: Hisashi Mihori, Hideaki Ohkubo
-
Patent number: 5319134Abstract: Disclosed is a process for introducing a carboxyl group to an aromatic carboxylic acid or a derivative thereof, which comprises reacting a starting aromatic carboxylic acid, such as a benzoic acid, a biphenylcarboxylic acid, a naphthalenecarboxylic acid, a diphenylcarboxylic acid, or a derivative thereof, with a carbon tetrahalide in the presence of a cyclodextrin and an alkali metal hydroxide, thereby introducing a carboxyl group to the aromatic ring of the starting aromatic carboxylic acid or the derivative thereof in substitution for a hydrogen atom bonded thereto. By the process of the present invention, a desired aromatic polycarboxylic acid or a derivative thereof can be easily obtained with high selectivity.Type: GrantFiled: October 26, 1992Date of Patent: June 7, 1994Assignee: Hidefumi HiraiInventors: Hidefumi Hirai, Rikinori Terakado, Hisashi Mihori, Tsutomu Nakamura, Kazuhiro Saito