Patents by Inventor Hisashi Minoura
Hisashi Minoura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130048355Abstract: A printed wiring board has a core substrate including an insulative base material and having a penetrating hole, a first conductive circuit formed on a first surface of the substrate, a second conductive circuit formed on a second surface of the substrate, and a through-hole conductor including a copper-plated film and formed in the penetrating hole such that the through-hole conductor is connecting the first and second conductive circuits. The insulative base material of the substrate includes reinforcing material and resin and has a thermal expansion coefficient in a Z direction which is set at or above a thermal expansion coefficient of the copper-plated film of the through-hole conductor and set at or below 23 ppm, and the insulative base material of the substrate has a thermal expansion coefficient in an XY direction which is set lower than the thermal expansion coefficient of the copper-plated film of the through-hole conductor.Type: ApplicationFiled: June 29, 2012Publication date: February 28, 2013Applicant: IBIDEN Co., Ltd.Inventors: Toru FURUTA, Hirofumi FUTAMURA, Hisashi MINOURA
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Patent number: 7765692Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: GrantFiled: September 25, 2008Date of Patent: August 3, 2010Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 7612295Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.Type: GrantFiled: May 25, 2006Date of Patent: November 3, 2009Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hisashi Minoura, Kiyotaka Tsukada, Hiroyuki Kobayashi, Mitsuhiro Kondo
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Patent number: 7594320Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: GrantFiled: October 27, 2005Date of Patent: September 29, 2009Assignee: IBIDEN Co., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 7552531Abstract: A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.Type: GrantFiled: February 19, 2003Date of Patent: June 30, 2009Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Kiyotaka Tsukada, Hiroyuki Kobayashi, Hisashi Minoura, Yoshikazu Ukai, Mitsuhiro Kondo
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Publication number: 20090019693Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: ApplicationFiled: September 25, 2008Publication date: January 22, 2009Applicant: IBIDEN CO., LTDInventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 7339118Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.Type: GrantFiled: March 9, 1998Date of Patent: March 4, 2008Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hisashi Minoura, Kiyotaka Tsukada, Hiroyuki Kobayashi, Mitsuhiro Kondo
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Publication number: 20060202344Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.Type: ApplicationFiled: May 25, 2006Publication date: September 14, 2006Applicant: IBIDEN CO., LTD.Inventors: Masaru Takada, Hisashi Minoura, Kiyotaka Tsukada, Hiroyuki Kobayashi, Mitsuhiro Kondo
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Publication number: 20060042824Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: ApplicationFiled: October 27, 2005Publication date: March 2, 2006Applicant: IBIDEN CO., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 6986917Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: GrantFiled: April 7, 2003Date of Patent: January 17, 2006Assignee: IBIDEN Co., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 6825421Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.Type: GrantFiled: September 13, 1999Date of Patent: November 30, 2004Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hisashi Minoura, Kiyotaka Tsukada, Hiroyuki Kobayashi, Mitsuhiro Kondo
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Publication number: 20030203170Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: ApplicationFiled: April 7, 2003Publication date: October 30, 2003Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Publication number: 20030150644Abstract: In production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101˜103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 131, 161 and the blind via-holes 141, 142.Type: ApplicationFiled: February 19, 2003Publication date: August 14, 2003Applicant: Ibiden Co., Ltd.Inventors: Masaru Takada, Kiyotaka Tsukada, Hiroyuki Kobayashi, Hisashi Minoura, Yoshikazu Ukai, Mitsuhiro Kondo
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Patent number: 6590165Abstract: In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101˜103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142.Type: GrantFiled: July 19, 1999Date of Patent: July 8, 2003Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Kiyotaka Tsukada, Hiroyuki Kobayashi, Hisashi Minoura, Yoshikazu Ukai, Mitsuhiro Kondo
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Patent number: 6555208Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: GrantFiled: June 26, 2001Date of Patent: April 29, 2003Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 6455783Abstract: A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate (21) including ad core pattern (12, 13), which has a pad (101, 111), is first prepared. Then, a laminated plate is formed by laminating an insulating layer (22) on the surface of the core substrate. Afterward, a surface pattern (11) is formed on the surface of the laminated plate. Further, the conductive hole (30, 31) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole (30, 31) is covered by the pad (101, 111).Type: GrantFiled: May 11, 2000Date of Patent: September 24, 2002Assignee: Ibiden Co., Ltd.Inventors: Kiyotaka Tsukada, Mitsuhiro Kondo, Naoto Ishida, Kouji Asano, Hisashi Minoura
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Publication number: 20010038905Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: ApplicationFiled: June 26, 2001Publication date: November 8, 2001Inventors: Masaru Takada, Hiroyuki Kobaryashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 6284353Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.Type: GrantFiled: July 7, 1999Date of Patent: September 4, 2001Assignee: Ibiden Co., Ltd.Inventors: Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Kiyotaka Tsukada, Mitsuhiro Kondo
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Patent number: 6232558Abstract: An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.Type: GrantFiled: April 23, 1998Date of Patent: May 15, 2001Assignees: Ibiden Co., Ltd., Texas Instruments IncorporatedInventors: Kiyotaka Tsukada, Hisashi Minoura, Koji Asano, Naoto Ishida, Morio Nakao