Patents by Inventor Hisashi Morikawa

Hisashi Morikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040113740
    Abstract: It is an object to decrease an occupied space in a printed board to carry out space saving and to reduce the size of a unit without sacrificing the performance of a transformer and increasing a cost.
    Type: Application
    Filed: September 16, 2003
    Publication date: June 17, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shinichi Sakai, Keiichi Satou, Kenji Yasui, Haruo Suenaga, Hisashi Morikawa, Yoshitaka Oda, Nobuo Shirokawa
  • Patent number: 6740968
    Abstract: Since the exposed collector part 32 of one semiconductor switching element 29 is attached to the heat radiating fin 42 by coating and filling a thermal conducting filler therebetween via spacers 33, 34 and 35, and the exposed collector part 37 of another semiconductor switching element 36 is directly attached to the same heat radiating fin 42 by coating the thermal conducting filler 41 thereto without any spacer, heat resulting from switching losses can be effectively transmitted to the heat radiating fin 42 and can be radiated therefrom. To effectively transmit heat, which results from switching losses, to a heat radiating fin and to radiate the same even if two semiconductor switching elements are connected in series, a collector part is exposed on the rear side thereof, and the two semiconductor switching elements are attached to a single heat radiating fin.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: May 25, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toyotsugu Matsukura, Shinichi Sakai, Hisashi Morikawa
  • Patent number: 6624579
    Abstract: It is provided a magnetron drive power supply wherein a series connection body of first and second semiconductor switch elements that can be brought into reverse conduction and a series connection body of first and second diodes are connected in parallel, first and second capacitors are connected in parallel to the first and second diodes, a series circuit of a commercial power supply and a primary winding of a high-voltage transformer is connected between a connection point of the first and second semiconductor switch elements that can be brought into reverse conduction and a connection point of the first and second diodes, and output of a secondary winding of the high-voltage transformer energizes a magnetron through a high-voltage rectification circuit.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: September 23, 2003
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Kenji Yasui, Takeshi Kitaizumi, Yoshiaki Ishio, Hideki Omori, Kazuho Sakamoto, Makoto Mihara, Haruo Suenaga, Hideaki Moriya, Emiko Ishizaki, Hisashi Morikawa
  • Publication number: 20020171374
    Abstract: It is provided a magnetron drive power supply wherein a series connection body of first and second semiconductor switch elements that can be brought into reverse conduction and a series connection body of first and second diodes are connected in parallel, first and second capacitors are connected in parallel to the first and second diodes, a series circuit of a commercial power supply and a primary winding of a high-voltage transformer is connected between a connection point of the first and second semiconductor switch elements that can be brought into reverse conduction and a connection point of the first and second diodes, and output of a secondary winding of the high-voltage transformer energizes a magnetron through a high-voltage rectification circuit.
    Type: Application
    Filed: May 15, 2002
    Publication date: November 21, 2002
    Inventors: Kenji Yasui, Takeshi Kitaizumi, Yoshiaki Ishio, Hideki Omori, Kazuho Sakamoto, Makoto Mihara, Haruo Suenaga, Hideaki Moriya, Emiko Ishizaki, Hisashi Morikawa
  • Publication number: 20020141161
    Abstract: Since the exposed collector part 32 of one semiconductor switching element 29 is attached to the heat radiating fin 42 by coating and filling a thermal conducting filler therebetween via spacers 33, 34 and 35, and the exposed collector part 37 of another semiconductor switching element 36 is directly attached to the same heat radiating fin 42 by coating the thermal conducting filler 41 thereto without any spacer, heat resulting from switching losses can be effectively transmitted to the heat radiating fin 42 and can be radiated therefrom. To effectively transmit heat, which results from switching losses, to a heat radiating fin and to radiate the same even if two semiconductor switching elements are connected in series, a collector part is exposed on the rear side thereof, and the two semiconductor switching elements are attached to a single heat radiating fin.
    Type: Application
    Filed: March 8, 2002
    Publication date: October 3, 2002
    Applicant: Matsushita Electric Industrial Co. Ltd.
    Inventors: Toyotsugu Matsukura, Shinichi Sakai, Hisashi Morikawa
  • Patent number: 6445596
    Abstract: High-voltage diodes (6) and (7) and high-voltage capacitors (8) and (9) making up a high-voltage circuit are connected and are molded of a resin (22) except that terminals (21a) and (21b) are drawn out as a small-sized high-voltage module (23) in one piece.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: September 3, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Mihara, Hisashi Morikawa, Takeshi Irii
  • Patent number: 5668714
    Abstract: A control system controls a multi-processor apparatus having a plurality of processors in which each of the plurality of processors are assigned to a process. The control system includes a determining unit for determining whether or not an excess processor for the process is included in processors assigned to the process, and a releasing unit for, when the determining unit determines that an excess processor for the process is included in the processors assigned to the process, releasing the excess processor from the process.
    Type: Grant
    Filed: June 7, 1996
    Date of Patent: September 16, 1997
    Assignee: Fujitsu Limited
    Inventor: Hisashi Morikawa
  • Patent number: 5393961
    Abstract: In a microwave heating device, a propeller fan is mounted on a drive shaft of a motor that in vertically positioned parts of a high frequency power supply unit are arranged in the order of a power control semiconductor device and a high-voltage transformer along the direction of revolution of the propeller fan. The motor is secured to a support member formed by a motor cover attached to the casing of the propeller fan. The fan and high frequency power supply unit are mounted to a first frame and a second frame, both of which are bent and connected at a connecting portion and fixed in an approximately "L" shape, while an airflow path is defined by a first guide wall and a second guide wall to cool the parts of the high frequency power supply unit. An airflow path is formed by a plurality of guide walls provided on the two frames, and a communicating hole is provided in proximity to the connecting portion of the two frames. The propeller fan is so arranged as to revolve at a low r.p.m.
    Type: Grant
    Filed: June 1, 1993
    Date of Patent: February 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiro Umekage, Shinichi Sakai, Yoshiaki Watanabe, Hisashi Morikawa, Makoto Mihara
  • Patent number: 4948618
    Abstract: A process for tempering edible plastic fat products such as margarine and shortenings which comprises crystallizing with cooling a starting material of fats and oils with or without other ingredients and subjecting the resulting product to pressuring treatment.
    Type: Grant
    Filed: September 6, 1989
    Date of Patent: August 14, 1990
    Assignee: Kanegafuchi Chemical Industry Co., Ltd.
    Inventors: Norio Hirokawa, Satoshi Imai, Hisashi Morikawa
  • Patent number: 4517344
    Abstract: In a process of emulsion-polymerization in a polymerization system containing an acrylate or a methacrylate monomer at least 60%; the improvement which comprises carrying out the emulsion polymerization in a polymerization vessel having a film of a quinone-amine compound of not less than 3000 in average molecular weight on the inner vessel wall, said quinone-amine compound being prepared by addition-reacting an aromatic quinone and an aromatic diamine in a solvent medium having a solubility parameter of 9.0 to 12.2. According to the process, the polymer scale deposition can be prevented in the acrylate or methacrylate polymerization system.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: May 14, 1985
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toragoro Mitani, Hideo Yasui, Hisashi Morikawa
  • Patent number: 4487898
    Abstract: A continuous suspension polymerization process for the production of polymeric particles substantially uniform particle size, entailing the steps of forming monomer droplets of substantially uniform particle size through an orifice under vibration, and effecting polymerization of the monomer droplets in an aqueous medium. The process permits carrying out polymerization without destruction or agglomeration of the monomer droplets, so that the particle size of the polymeric particles thus produced depends predominantly upon the particle size of the monomer droplets as initially formed.
    Type: Grant
    Filed: June 4, 1982
    Date of Patent: December 11, 1984
    Assignee: Kanegafuchi Chemical Industry Co., Ltd.
    Inventors: Shinji Kato, Kyouji Uku, Hisashi Morikawa
  • Patent number: 4474051
    Abstract: A method of measuring a combustible component in a liquid or gas employs a gas having a high oxygen content, instead of air or an inert gas, as the carrier gas to thereby improve drastically the scope and accuracy of measurement by a semicondutor gas sensor. The carrier gas having a high oxygen content is supplied into a combustible component sampler formed from a gas-permeable membrane and disposed in the liquid or gas to be tested so that the combustible component may be diffused into the carrier gas through the gas-permeable membrane. The carrier gas entraining the combustible component therein is introduced into a detector having a semiconductor gas sensor, in which the combustible component is detected, and its concentration is determined continuously or intermittently.
    Type: Grant
    Filed: March 16, 1983
    Date of Patent: October 2, 1984
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Fukuda, Hisashi Morikawa, Hideki Nakatani, deceased
  • Patent number: 3960787
    Abstract: In a process for preparing foamable synthetic resin granules by suspension polymerization, a fatty acid bisamide is added prior to or at an early stage of polymerization in the presence of an inorganic salt and a foaming agent is added at a later stage of polymerization or after completion thereof.
    Type: Grant
    Filed: June 6, 1974
    Date of Patent: June 1, 1976
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroji Isukamoto, Hisashi Morikawa, Masao Nakagawa, Shinji Kato, Masaki Miyamoto, Toichiro Yoda, Katsuhiko Yoshihara