Abstract: A multilayer analytical element for assaying fructosamine having a liquid-impermeable support, a dried buffer-containing layer which contains a buffer having pH of 8 to 12 formed on the support, and a tetrazolium salt-containing layer which is laminated on the buffer-containing layer, which element assays fructosamine in a short time with good accuracy.

Abstract: A multilayer analytical element for assaying fructosamine, having a liquid-impermeable support, a buffer-containing layer which contains a buffer having pH of 8 to 12 formed on the support, a tetrazolium salt containing layer which is formed on the buffer-containing layer and, optionally, an intermediate layer interposed between the buffer-containing layer and the tetrazolium salt-containing layer to prevent contact of these two layers, which element assays fructosamine in a short time with good accuracy.

Abstract: A device for colorimetric assay of at least one component in a liquid sample, which device comprises a support, a reagent layer formed on a part of one surface of the support and a sample-receiving layer which covers at least a part of the reagent layer and at least a part of the support surface, with which the timing of application of a sample on the device is automatically detected with accuracy.

Abstract: A device for colorimetric assay of at least one component in a liquid sample, which device comprises a support having a through hole with an area of from 3 to 80 mm.sup.2, a transparent porous film which is provided on the support to cover the hole, a reagent layer provided on a surface of the porous film which is not contacted to the support, and a sample-holding layer which covers the reagent layer and a part of a surface of the support, whereby an amount or concentration of at least one component in the liquid sample may be easily and accurately measured.

Abstract: A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.