Patents by Inventor Hisashi Sakamoto

Hisashi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5705393
    Abstract: The present invention provides a reagent composition for measurement of ionic strength of liquid samples (especially for measurement of specific gravity of urine), which contains at least one phosphoric diester, at least one pH buffering agent, and at least one pH indicator. The present invention also provides a test tool containing the reagent composition which may be a test strip made by impregnation, coating, or printing of the composition. The reagent composition and the test tool are convenient and less susceptible to pH and temperature of the samples, measurement timing, etc. The compounds shown by the following general formula (1): ##STR1## wherein R.sub.1 and R.sub.2 in the formula (1) represent straight or branched alkyl groups containing 4-20 carbon atoms, phenyl groups which may be substituted, benzyl groups which may be substituted, or groups containing polyalkylene glycol chains, are preferable as a phosphoric diester.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: January 6, 1998
    Assignee: Kyoto Daiichi Kagaku Co., Ltd.
    Inventors: Hisashi Sakamoto, Toshihisa Inoue, Kaori Kurata
  • Patent number: 5565170
    Abstract: A multilayer analytical element for assaying fructosamine having a liquid-impermeable support, a dried buffer-containing layer which contains a buffer having pH of 8 to 12 formed on the support, and a tetrazolium salt-containing layer which is laminated on the buffer-containing layer, which element assays fructosamine in a short time with good accuracy.
    Type: Grant
    Filed: April 6, 1995
    Date of Patent: October 15, 1996
    Assignee: Kyoto Daiichi Kagaku Co., Ltd.
    Inventor: Hisashi Sakamoto
  • Patent number: 5366868
    Abstract: A multilayer analytical element for assaying fructosamine, having a liquid-impermeable support, a buffer-containing layer which contains a buffer having pH of 8 to 12 formed on the support, a tetrazolium salt containing layer which is formed on the buffer-containing layer and, optionally, an intermediate layer interposed between the buffer-containing layer and the tetrazolium salt-containing layer to prevent contact of these two layers, which element assays fructosamine in a short time with good accuracy.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: November 22, 1994
    Assignee: Kyoto Daiichi Kagaku Co., Ltd.
    Inventor: Hisashi Sakamoto
  • Patent number: 5304467
    Abstract: A device for colorimetric assay of at least one component in a liquid sample, which device comprises a support, a reagent layer formed on a part of one surface of the support and a sample-receiving layer which covers at least a part of the reagent layer and at least a part of the support surface, with which the timing of application of a sample on the device is automatically detected with accuracy.
    Type: Grant
    Filed: December 18, 1991
    Date of Patent: April 19, 1994
    Assignee: Kyoto Daiichi Kagaku Co., Ltd.
    Inventors: Hisashi Sakamoto, Shigeki Yamada, Hiroshi Taniguchi
  • Patent number: 5227310
    Abstract: A device for colorimetric assay of at least one component in a liquid sample, which device comprises a support having a through hole with an area of from 3 to 80 mm.sup.2, a transparent porous film which is provided on the support to cover the hole, a reagent layer provided on a surface of the porous film which is not contacted to the support, and a sample-holding layer which covers the reagent layer and a part of a surface of the support, whereby an amount or concentration of at least one component in the liquid sample may be easily and accurately measured.
    Type: Grant
    Filed: November 30, 1989
    Date of Patent: July 13, 1993
    Assignee: Kyoto Daiichi Kagaku Co., Ltd.
    Inventors: Hisashi Sakamoto, Shigeki Yamada, Hiroshi Taniguchi
  • Patent number: 4540603
    Abstract: A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.
    Type: Grant
    Filed: December 19, 1983
    Date of Patent: September 10, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Hidaka, Hisashi Sakamoto, Toshiaki Fukuhara, Sadao Fujieda, Yutaka Misawa