Patents by Inventor Hisashi Satou
Hisashi Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127982Abstract: An information processing apparatus includes a converting portion having a plurality of electrical conductors to be arranged in mutual separation and a medium arranged so as to mutually connect the plurality of electrical conductors, wherein the converting portion is the information processing apparatus to convert an input signal to an output signal. The medium includes the electrolyte and is configured to be capable of controlling an electrical conductivity of an electrically conductive path mutually electrically connecting the plurality of electrical conductors, and the medium is selected such that the electrical conductivity of the electrically conductive path changes over time with the input signal not being present.Type: ApplicationFiled: January 27, 2022Publication date: April 18, 2024Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, TOKYO UNIVERSITY OF SCIENCE FOUNDATION, TOYOTA PHYSICAL AND CHEMICAL RESEARCH INSTITUTE, NATIONAL UNIVERSITY CORPORATION TOTTORI UNIVERSITY, NAGASE & CO., LTD.Inventors: Hiroyuki AKINAGA, Hisashi SHIMA, Yasuhisa NAITOH, Hiroshi SATOU, Dan SATOU, Takuma MATSUO, Kentaro KINOSHITA, Toshiyuki ITOH, Toshiki NOKAMI, Masakazu KOBAYASHI
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Patent number: 10872704Abstract: A high reliable water injection device is provided that injects water into a reactor containment vessel and can reliably shut off cooling water at normal times and quickly and reliably inject water into the reactor containment vessel without the need for external power, in a case of emergency. The water injection device injects water into a reactor containment vessel includes a flow path through which cooling water is supplied; a disk that closes the flow path; a swing arm that is connected to the disk and performs closing and opening of the flow path by the disk; and a weight that is connected to the swing arm via a swing lever, in which the weight is supported by a support member made of a low melting point alloy.Type: GrantFiled: December 22, 2017Date of Patent: December 22, 2020Assignees: Hitachi-GE Nuclear Energy, Ltd., Okano Valve Mfg. Co. Ltd.Inventors: Daisuke Hirasawa, Yoshihisa Kiyotoki, Hisashi Satou, Keisuke Sakemura, Keiji Sasaki, Yuta Fukuda
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Publication number: 20180182500Abstract: A high reliable water injection device is provided that injects water into a reactor containment vessel and can reliably shut off cooling water at normal times and quickly and reliably inject water into the reactor containment vessel without the need for external power, in a case of emergency. The water injection device injects water into a reactor containment vessel includes a flow path through which cooling water is supplied; a disk that closes the flow path; a swing arm that is connected to the disk and performs closing and opening of the flow path by the disk; and a weight that is connected to the swing arm via a swing lever, in which the weight is supported by a support member made of a low melting point alloy.Type: ApplicationFiled: December 22, 2017Publication date: June 28, 2018Inventors: Daisuke HIRASAWA, Yoshihisa KIYOTOKI, Hisashi SATOU, Keisuke SAKEMURA, Keiji SASAKI, Yuta FUKUDA
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Patent number: 9496087Abstract: There is provided a multilayer ceramic capacitor in which an increase in conductor resistance at an end of an internal electrode layer is suppressed, and in which a gap between the internal electrode layer and a dielectric layer is reduced. A multilayer ceramic capacitor includes a stacked body including dielectric layers and internal electrode layers alternately laminated; and an external electrode disposed on an end surface of the stacked body and connected to the internal electrode layers, the internal electrode layers each including a connection electrode portion connected to the external electrode, and an internal electrode portion which is connected to the connection electrode portion and extends toward an inner side of the stacked body, a ratio of a material having a melting point higher than that of a conductive material being higher in the connection electrode portion than in the internal electrode portion.Type: GrantFiled: June 21, 2013Date of Patent: November 15, 2016Assignee: KYOCERA CorporationInventor: Hisashi Satou
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Publication number: 20150325373Abstract: There is provided a multilayer ceramic capacitor in which an increase in conductor resistance at an end of an internal electrode layer is suppressed, and in which a gap between the internal electrode layer and a dielectric layer is reduced. A multilayer ceramic capacitor includes a stacked body including dielectric layers and internal electrode layers alternately laminated; and an external electrode disposed on an end surface of the stacked body and connected to the internal electrode layers, the internal electrode layers each including a connection electrode portion connected to the external electrode, and an internal electrode portion which is connected to the connection electrode portion and extends toward an inner side of the stacked body, a ratio of a material having a melting point higher than that of a conductive material being higher in the connection electrode portion than in the internal electrode portion.Type: ApplicationFiled: June 21, 2013Publication date: November 12, 2015Inventor: Hisashi SATOU
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Patent number: 8743528Abstract: [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented. [Solution] A capacitor 1 includes a laminate 2 in which a plurality of dielectric layers 6 are laminated, an inner electrode 3 disposed between the dielectric layers 6 of the laminate 2, an outer electrode 4 that is disposed on an end face of the laminate 2 so as to be connected to the inner electrode 3 and that has an extending portion 4A extending to a first main surface 2A of the laminate 2, and an underlying layer 5 including a base 5a disposed between the extending portion 4A and the first main surface 2A and metal particles 5b that are contained in the base 5a and that are joined to the outer electrode 4. With this structure, it is possible to provide a capacitor 1 in which warpage is not easily generated in the laminate 2 during sintering.Type: GrantFiled: September 29, 2011Date of Patent: June 3, 2014Assignee: Kyocera CorporationInventor: Hisashi Satou
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Patent number: 8355240Abstract: A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be used in decoupling circuits such as power supply decoupling circuits. The equivalent series resistance of the multilayer capacitor can be increased while suppressing an increase in the equivalent series inductance resulting in improved noise grounding.Type: GrantFiled: July 24, 2009Date of Patent: January 15, 2013Assignee: KYOCERA CorporationInventor: Hisashi Satou
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Publication number: 20120218678Abstract: [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented. [Solution] A capacitor 1 includes a laminate 2 in which a plurality of dielectric layers 6 are laminated, an inner electrode 3 disposed between the dielectric layers 6 of the laminate 2, an outer electrode 4 that is disposed on an end face of the laminate 2 so as to be connected to the inner electrode 3 and that has an extending portion 4A extending to a first main surface 2A of the laminate 2, and an underlying layer 5 including a base 5a disposed between the extending portion 4A and the first main surface 2A and metal particles 5b that are contained in the base 5a and that are joined to the outer electrode 4. With this structure, it is possible to provide a capacitor 1 in which warpage is not easily generated in the laminate 2 during sintering.Type: ApplicationFiled: September 29, 2011Publication date: August 30, 2012Inventor: Hisashi Satou
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Patent number: 8232479Abstract: There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.Type: GrantFiled: June 29, 2010Date of Patent: July 31, 2012Assignee: Kyocera CorporationInventor: Hisashi Satou
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Publication number: 20110024175Abstract: There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.Type: ApplicationFiled: June 29, 2010Publication date: February 3, 2011Applicant: KYOCERA CORPORATIONInventor: Hisashi SATOU
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Patent number: 7662430Abstract: The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.Type: GrantFiled: September 8, 2005Date of Patent: February 16, 2010Assignee: Kyocera CorporationInventor: Hisashi Satou
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Publication number: 20100027190Abstract: A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be used in decoupling circuits such as power supply decoupling circuits. The equivalent series resistance of the multilayer capacitor can be increased while suppressing an increase in the equivalent series inductance resulting in improved noise grounding.Type: ApplicationFiled: July 24, 2009Publication date: February 4, 2010Applicant: KYOCERA CORPORATIONInventor: Hisashi Satou
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Patent number: 7537667Abstract: A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.Type: GrantFiled: February 24, 2006Date of Patent: May 26, 2009Assignee: Kyocera CorporationInventor: Hisashi Satou
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Patent number: 7206187Abstract: Ceramic electronic components having improved peel resistance and a method of manufacturing them are disclosed. The components have laminated bodies that include internal electrodes which join or bond the layer to the external conductor and prevent the external conductor from peeling.Type: GrantFiled: August 23, 2005Date of Patent: April 17, 2007Assignee: Kyocera CorporationInventor: Hisashi Satou
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Patent number: 7122131Abstract: The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.Type: GrantFiled: February 25, 2005Date of Patent: October 17, 2006Assignee: Kyocera CorporationInventor: Hisashi Satou
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Publication number: 20060196599Abstract: A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.Type: ApplicationFiled: February 24, 2006Publication date: September 7, 2006Inventor: Hisashi Satou
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Publication number: 20060049131Abstract: The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.Type: ApplicationFiled: September 8, 2005Publication date: March 9, 2006Inventor: Hisashi Satou
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Publication number: 20060039097Abstract: Ceramic electronic components having improved peel resistance and a method of manufacturing them are disclosed. The components have laminated bodies that include internal electrodes which join or bond the layer to the external conductor and prevent the external conductor from peeling.Type: ApplicationFiled: August 23, 2005Publication date: February 23, 2006Applicant: Kyocera CorporationInventor: Hisashi Satou
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Publication number: 20050194575Abstract: The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.Type: ApplicationFiled: February 25, 2005Publication date: September 8, 2005Inventor: Hisashi Satou