Patents by Inventor Hisashi Shimazaki

Hisashi Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6319575
    Abstract: A polyester resin composition is produced by melt-kneading a mixture comprising a polyamide resin and a polyester resin, and a tricarboxylic acid compound. The polyamide resin is a polymerization product of a diamine component containing 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid. The polyester resin is a polymerization product of a dicarboxylic acid component containing 70 mol % or more of an aromatic dicarboxylic acid and a diol component containing 70 mol % or more of an aliphatic diol. The incorporation of a tricarboxylic acid compound such as aromatic tricarboxylic acids and their anhydrides improves transparency and whitening resistance at moisture absorbing of films, sheets and thin-wall hollow containers without deteriorating their gas barrier properties.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: November 20, 2001
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masahiko Takashima, Koji Yamamoto, Hisashi Shimazaki
  • Patent number: 6166171
    Abstract: A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at 25.degree. C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: December 26, 2000
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Koji Yamamoto, Makoto Takahashi, Hisashi Shimazaki, Katsuya Maruyama
  • Patent number: 5268219
    Abstract: A polyamide resin composition obtained by melting and kneading(A) a first polyamide containing not less than 90 mol %, based on the total recurring units, of a m-xylylene adipamide unit of the formula, ##STR1## and (B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160.degree. C. and having a solubility parameter in the range of 13.+-.1.5;(C) under the conditions where the following relationship is satisfied,(0.025C-2.2).ltoreq.log R.ltoreq.(0.025C-0.5)wherein C is a proportion (wt. %) of the first polyamide based on the total weight of the first and second polyamides, and R is a ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20.degree. C. than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is in the range of 20 to 95 (wt. %);and a film produced therefrom.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: December 7, 1993
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masahiro Harada, Takeo Hayashi, Hiroyuki Mishima, Hisashi Shimazaki