Patents by Inventor Hisashi Simizu

Hisashi Simizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition of maleimide and aromatic-double bond epoxy resin
    Patent number: 5070154
    Abstract: A thermosetting resin composition comprising a maleimide compound having in the molecule thereof, at least one N-substituted maleimide group and an epoxy resin having a double bond conjugated with an aromatic ring is easily workable and which yields cured products having improved heat resistance.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: December 3, 1991
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Hisashi Simizu