Abstract: To provide, as a sheet material of a Cu—Ni—Al based copper alloy having a compositional range exhibiting a whitish metallic appearance that is excellent in “strength-bending workability balance” and is excellent in discoloration resistance, a copper alloy sheet material having a composition containing, in terms of % by mass, Ni: more than 12.0% and 30.0% or less, Al: 1.80-6.50%, Mg: 0-0.30%, Cr: 0-0.20%, Co: 0-0.30%, P: 0-0.10%, B: 0-0.05%, Mn: 0-0.20%, Sn: 0-0.40%, Ti: 0-0.50%, Zr: 0-0.20%, Si: 0-0.50%, Fe: 0-0.30%, and Zn: 0-1.00%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al?15.0, and having a metallic structure having, on an observation plane in parallel to a sheet surface (rolled surface), a number density of fine secondary phase particles having a particle diameter of 20 to 100 nm of 1.0×107 per mm2 or more.

Abstract: A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio SB/SS of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein SS represents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112> orientation of 10° or less and a crystal orientation difference from the S2 {231} <124> orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011} <211> orientation of 10° or less.

Abstract: A copper alloy sheet material has a composition containing from 0.20 to 6.00% in total of Ni and Co, from 0 to 3.00% of Ni, from 0.20 to 4.00% of Co, and from 0.10 to 1.50% of Si, all in mass %, one or more of Fe, Mg, Zn, Mn, B, P, Cr, Al, Zr, Ti, Sn contained appropriately depending on necessity, the balance of Cu and unavoidable impurities, and has on a polished sheet surface thereof, a ratio SB/SC of 2.0 or more and an area ratio of SB occupied on the surface of 5.0% or more, wherein SB represents an area of a region having a crystal orientation difference from a Brass orientation {011} <211> measured by EBSD (electron backscattered diffraction) of 100 or less, and SC represents an area of a region having a crystal orientation difference from a Cube orientation {001} <100> of 10° or less.

Abstract: To provide, as a sheet material of a Cu—Ni—Al based copper alloy having a compositional range exhibiting a whitish metallic appearance that is excellent in “strength-bending workability balance” and is excellent in discoloration resistance, a copper alloy sheet material having a composition containing, in terms of % by mass, Ni: more than 12.0% and 30.0% or less, Al: 1.80-6.50%, Mg: 0-0.30%, Cr: 0-0.20%, Co: 0-0.30%, P: 0-0.10%, B: 0-0.05%, Mn: 0-0.20%, Sn: 0-0.40%, Ti: 0-0.50%, Zr: 0-0.20%, Si: 0-0.50%, Fe: 0-0.30%, and Zn: 0-1.00%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al?15.0, and having a metallic structure having, on an observation plane in parallel to a sheet surface (rolled surface), a number density of fine secondary phase particles having a particle diameter of 20 to 100 nm of 1.0×107 per mm2 or more.

Abstract: A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 ?m or more of 4.0×103 per square millimeter or less. KAM value measured with a step size of 0.5 ?m is more than 3.00.

Abstract: A copper alloy sheet material has a composition containing from 0.20 to 6.00% in total of Ni and Co, from 0 to 3.00% of Ni, from 0.20 to 4.00% of Co, and from 0.10 to 1.50% of Si, all in mass %, one or more of Fe, Mg, Zn, Mn, B, P, Cr, Al, Zr, Ti, Sn contained appropriately depending on necessity, the balance of Cu and unavoidable impurities, and has on a polished sheet surface thereof, a ratio SB/SC of 2.0 or more and an area ratio of SB occupied on the surface of 5.0% or more, wherein SB represents an area of a region having a crystal orientation difference from a Brass orientation {011} <211> measured by EBSD (electron backscattered diffraction) of 10° or less, and SC represents an area of a region having a crystal orientation difference from a Cube orientation {001} <100> of 10° or less.

Abstract: A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 ?m or more of 4.0×103 per square millimeter or less. KAM value measured with a step size of 0.5 ?m is more than 3.00.

Abstract: A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I0{200}?1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I0{200}, and which satisfies I{200}/I{422}?15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.

Abstract: A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.

Abstract: Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower.

Abstract: A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.

Abstract: A female terminal includes a box portion which is formed into a quadrangular prism-like shape so as for a tab of a male terminal to fit therein by bending a copper alloy plate which is obtained by being continuously and repeatedly bent before an age heat treatment is applied thereto, which has a proof stress of 700 MPa or larger and a width of 10 mm or larger and in which no crack is produced therein when bent 180 degrees about a bending axis which is at right angle to a rolling direction of the copper alloy plate. The box portion comprises notches which are formed in inner sides of bent portions produced by bending the copper alloy plate. A depth of the notch is set to be in the range from ¼ to ½ of a thickness of the copper alloy plate.

Abstract: This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420}/I0{420}>1.0??(1), where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

Abstract: There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.

Abstract: Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower.

Abstract: A sheet material of a copper alloy has a chemical composition including 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 ?m. I{420}/I0{420}>1.0??(1) I{220}/I0{220}?3.

Abstract: There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.