Abstract: A microprocessor according to the present invention comprises a sub-read bus, to which output terminals of registers of a register file of the microprocessor are coupled. The sub-read bus is in turn coupled to a main read bus of the microprocessor through a bus output circuit. Upon occurrence of a read access to any of the registers, the bus output circuit couples the sub-read bus with the main read bus, whereby data read out from the registers to the sub-read bus are transmitted to the main read bus, and under no existence of the read access, the bus output circuit interrupts the data transmission from the sub-read bus to the main read bus. With this, a load capacitance of the read bus is reduced. As a result, a time for making access to the read bus is much improved.

Abstract: A prepreg for fiber-reinforced composite materials comprising (A) a reinforcing fiber having a modulus of elasticity of 200 GPa or more, (B) a fibrous thermoplastic resin having a modulus of elasticity of 100 GPa or less, and (C) a thermosetting matrix resin. The prepreg of the present invention does not only have excellent handling property equivalent to that of the prepreg with the conventional thermosetting resin as a matrix, but also gives excellent toughness to the resulting molded product without injuring the thermal and mechanical properties. Particularly, it has a high resistance to interlaminar fracture when exposed to impact, so that it is preferably used as a structural material for airplanes, etc.

Abstract: The present invention provides expandable plastics having a molecular weight of 50,000 to 500,000 which comprises the following structural units (I), (II) and (III) giving a foam having heat resistance and fine structure by heating, the molar ratio of (I+II) to (III) being 1 to 0.6-1.5 and the proportion of (I) being 5 to 50 wt. % of the total components: ##STR1## wherein R represents a hydrogen atom or a methyl group. When the copolymer, the expandable plastics, of the present invention is used, white foams having a very fine texture are obtained without using special foaming agents, and besides the heat resistance of the foams is high and the amount of water absorbed thereby is little. The foams of the present invention, therefore, can be used in a wide range as soundproofing materials and heat insulators for which the conventional foams cannot be used because of their low heat resistance, and substitutes for honeycomb structures used in airplanes.

Abstract: An epoxy resin composition used as a matrix for a fiber-reinforced composite is disclosed, which comprises the following components:(A) a bifunctional epoxy resin;(B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin;(C) a dihydroxybiphenyl compound represented by the following general formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and(D) an aromatic amine,wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions:1/0.1.gtoreq.a/b.gtoreq.1/1.210/1.gtoreq.(a+b)/c.gtoreq.1/11/0.8.gtoreq.(a+b-c)/d.gtoreq.1/1.5wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of NH groups in component (D).

Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenylmethanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical --CH.sub.2 --, ##STR2## --O--, --S--, --SO.sub.2 --, ##STR3## or ##STR4## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR5## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.

Abstract: A resin composition for composites which comprises as essential components(A) a three-bismaleimide mixture of N,N'-diphenyl-methanebismaleimide, N,N'-tolylenebismaleimide, and N,N'-trimethylhexamethylenebismaleimide and(B) an allyl etherified substituted phenol novolak resin and/or allyl phenyl ether compound represented by the following general formula (I): ##STR1## wherein, X denotes a direct bond or the divalent radical ##STR2## and R.sub.1 through R.sub.4 are the same or different in a molecule and denote each --CH.sub.3, --C.sub.2 H.sub.5, --CH(CH.sub.3).sub.2, --nC.sub.3 H.sub.7, --nC.sub.4 H.sub.9, --C(CH.sub.3).sub.3, ##STR3## --CH.sub.2 CH(CH.sub.3).sub.2, or --Br.

Abstract: An epoxy resin composition for use in carbon fiber reinforced plastics which comprises the following components (A), (B), (C), and (D):(A) an epoxy resin of the bisphenol A diglycidyl ether type;(B) at least one compound selected from the group consisting of dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipyldihydrazide, azelayldihydrazide, and isophthalic acid dihydrazide;(C) a compound represented by general formula (I) ##STR1## wherein X.sub.1 and X.sub.

Abstract: An epoxy resin composition characterized by comprising, as essential components,(A) a bifunctional epoxy resin,(B) a trifunctional epoxy resin,(C) a phenol compound represented by the following formula ##STR1## (X.sub.1 to X.sub.8 each represent Br, Cl or H and at least four of X.sub.1 to X.sub.8 each represent Br or Cl; R.sub.1 and R.sub.2 each represent H or CH.sub.3), and(D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone.

Abstract: An epoxy resin composition is disclosed that can be cured at a temperature of 150.degree. C. or below, and can be used to provide a high performance carbon fiber composite material having a 0.degree. direction bending strength of 220 kg/mm.sup.2 or over, and an interlayer shear strength of 10 kg/mm.sup.2 or over.The composition is made up of:(A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenyl-ether or its oligomer,(B) diaminodiphenylsulfone and/or diaminodiphenylmethane,(C) dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipil dihydrazide, azelayl dihydrazide, or isophthalic acid dihydrazide, and(D) a urea compound.

Abstract: An intermediate for a composite material is described, comprising a reinforcing material impregnated with a resin composition which comprises: (A) 100 parts by weight of a mixture of (I) a polyfunctional maleimide and (II) a polyfunctional cyanate or an oligomer thereof, or a preliminary reaction product of (I) and (II); (B) from 5 to 100 parts by weight of an epoxy compound; and (C) from 5 to 50 parts by weight of a polyester compound.

Abstract: An epoxy resin composition is disclosed, which comprises the following elements:(A) a bifunctional epoxy resin;(B) a trifunctional epoxy resin;(C) a phenolic compound represented by the following general formula: ##STR1## wherein X.sub.1, X.sub.2, X.sub.3, X.sub.4, X.sub.5, X.sub.6, X.sub.7, X.sub.8, X.sub.9, X.sub.10, X.sub.11, X.sub.12, R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or a methyl group; and(D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone, wherein the molar ratio of epoxy groups in element (A) to those in element (B) is in the range of from 1/4.0 to 1/0.1, element (C) is used in an amount that satisfies the condition:1/0.9.ltoreq.(A+B)/C.ltoreq.1/0.1and element (D) is used in an amount that satisfies the condition:1/1.3.ltoreq.(A+B-C)/D.ltoreq.1/0.

Abstract: An epoxy resin composition is disclosed that can be cured at a temperature of 150.degree. C. or below, and can be used to provide a high performance carbon fiber composite material having a 0.degree. direction bending strength of 220 kg/mm.sup.2 or over, and an interlayer shear strength of 10 kg/mm.sup.2 or over.The composition is made up of:(A) an epoxy compound containing 10 to 100% by weight of m- or o-methyl-p-N,N-diglycidyl-aminophenyl-ester or its oligomer,(B) diaminodiphenylsulfone and/or diaminodiphenylmethane,(C) dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipil dihydrazide, azelayl dihydrazide, or isophthalic acid dihydrazide, and(D) a urea compound.

Abstract: Oxidizing treatment of carbon fibers under specific conditions provides carbon fibers having oxygen concentration (O.sub.1S /C.sub.1S atom number ratio) in the surface part of the carbon fibers of 0.05 to 0.30 as measured by X-ray photoelectron spectroscopy, coefficients of water-extractable fraction of up to 2.0, and coefficients of tow spread of at least 1.times.10.sup.-3. These carbon fibers are excellent in adhesion to various matrix resins and when mixed as reinforcements with matrix resins, provide composite materials superior especially in impact resistance. The thus obtained composite materials are useful for aircraft, automobiles, and general industrial materials.

Abstract: An intermediate for a composite material is disclosed. The intermediate is obtained by impregnating an epoxy resin composition containing a specific additive into a carbon fiber. The composite material obtained from the intermediate has improved mechanical properties.

Abstract: A resin composition comprising (I) at least one compound selected from the group consisting of hydroxyl-containing unsaturated polyesters, reaction products of polyepoxides and ethylenically unsaturated carboxylic acids and .beta.-polymers of diallyl phthalate (II) at least one monomer copolymerizable with said compound (I), which is selected from the group consisting of ethylenically unsaturated monomers and allylic unsaturated monomers, (III) a catalyst capable of polymerizing (I) and (II), (IV) at least one compound containing the oxirane ring, (V) a curing agent (excluding acid anhydrides, acids and amine compounds) capable of curing said compound (IV), and (VI) a catalyst capable of promoting the curing of (IV) by (V). A preferable composition further contains (VII) a polyisocyanate compound and (VIII) a promoter for the reaction between isocyanate group and hydroxyl group. The composition may contain fibrous reinforcing agents.

Abstract: A non-solvent type thermosetting resin film exhibiting excellent uniformity in thickness is prepared by a process wherein a molten thermosetting resin composition having a curing agent incorporated therein is extruded through a linear slit of a flat die, maintained at a constant temperature, onto a release sheet continuously moving at a constant rate in close proximity to the exit end of the linear slit. As the flat die a flat sheeting die having a substantially circular manifold is used and the molten thermosetting resin is extruded onto the release sheet, which is supported by a back-up roll and confronts the exit end of the linear slit of the flat sheeting die.

Abstract: A fiber-reinforced plastic sheet molding compound comprising a sheet member (A) formed of a resin composition which consists of 30 to 90% by weight of a reinforcing cut fiber and 70 to 10% by weight of a matrix resin, at least one surface of said sheet member (A) being intimately applied to a sheet member (B) which is formed of the matrix resin and which has a thickness thinner than that of sheet member (A).

Abstract: An intermediate for a composite material is disclosed. The intermediate is obtained by impregnating an epoxy resin composition containing a specific additive into a carbon fiber. The composite material obtained from the intermediate has improved mechanical properties.