Abstract: The present disclosure provides a disk brake capable of making it easier for the piston to return than conventional ones when the brake is released from a state where the brake is applied. In the disk brake, the seal groove 5 includes a front wall 51, a rear wall 52 farther from the brake rotor than the front wall 51 in the axial direction Dl, and a bottom wall 53 extending along the axial direction Dl between the rear wall 52 and the front wall 51. The bottom wall 53 includes a front bottom wall 53a adjacent to the front wall 51 and a rear bottom wall 53b adjacent to the rear wall 52. The rear bottom wall 53b has a depth d2 from the inner circumferential surface 42a of the cylinder 42, the depth d2 being larger than a dimension d3 of the uncompressed piston seal 6 in the direction of the depth d2 and being larger than a depth d1 from the inner circumferential surface 42a of the cylinder 42 of the front bottom wall 53a.

Abstract: A vibration generation device which can vibrate in only one axial direction is used to simultaneously load a vibration force in a plurality of axial directions onto a test piece, and to make it possible to easily modify the proportion of vibration force in each axial direction.

Abstract: Provided is a highly reliable semiconductor device capable of reducing stress generated in a semiconductor element even when a highly elastic joining material such as a Pb-free material is used in a power semiconductor having a double-sided mounting structure. The semiconductor device includes a semiconductor element including a gate electrode only on one surface, an upper electrode connected to the surface of the semiconductor element on which the gate electrode is provided, and a lower electrode connected to a surface opposite to the surface of the semiconductor element on which the gate electrode is provided.

Abstract: Provide is a highly reliable semiconductor device in which stress generated in a semiconductor chip is reduced and an increase in thermal resistance is suppressed. The semiconductor device includes: a semiconductor chip including a first main electrode on one surface thereof and a second main electrode and a gate electrode on the other surface thereof; a first electrode connected to the one surface of the semiconductor chip via a first bonding material; and a second electrode connected to the other surface of the semiconductor chip via a second bonding material. The first electrode is a plate-shaped electrode and has a groove in a region overlapping with the semiconductor chip. The groove penetrates in a thickness direction of the first electrode and reaches an end portion of the first electrode when viewed in a plan view.

Abstract: A problem is that close contact with a heat dissipation surface of a power semiconductor device is not sufficient, and thus heat dissipation performance is low. A thermally conductive layer 5 abuts on a heat dissipation surface 4a of a circuit body 100, and a heat dissipation member 7 abuts on the outside of the thermally conductive layer 5, which is a side of the heat dissipation surface 4a of the circuit body 100. A fixing member 8 abuts on a side of the circuit body 100 opposite to the heat dissipation surface 4a. A connection member 9 is penetrated at the respective end portions of the heat dissipation member 7 and the fixing member 8. FIG. 3 illustrates a state before a bolt and a nut of the connection member 9 are tightened. The heat dissipation member 7 holds a curved shape such that the central portion of the heat dissipation member 7 protrudes toward the circuit body 100.

Abstract: The present invention addresses the problem of providing a disc brake device for which sliding at the boundary surface between a piston and a piston seal is suppressed, and dragging is reduced. The present invention is provided with a cylinder, a piston housed in the cylinder, an inner brake pad opposing a disc rotor, an inner circumferential groove formed in a cylinder inner circumference, and a piston seal that is provided in the inner circumferential groove and contacts the piston. The inner circumferential groove is provided with a wall, a wall on the opposite side from the wall, a bottom wall connecting the wall and the wall, and a curved surface expanding the inner circumferential groove at the wall. The bottom wall is formed such that the distance to the piston gradually increases from the wall toward the wall.

Abstract: Provided are: a technique for improving failure probability evaluation precision, even when the center and tails of an occurrence frequency distribution for stress or strength, or a physical quantity associated with stress or strength, such as load, for example, do not conform to the same probability distribution, by precisely estimating a tail probability density function; and a high-precision failure probability evaluation device.

Abstract: Some materials desired to acquire mechanical characteristics and fatigue characteristics are difficult to make in a large-size bulk material for a test piece. The invention provides a test jig which includes a primary jig which fixes both sides of a test piece, which is a test object, an upper jig which includes a load portion to load a weight on two places of an upper surface and two places of a lower surface of the primary jig, and a lower jig which includes a load portion to load a weight on two places of the upper surface and two places of the lower surface of the primary jig. The upper surface and the lower surface of the primary jig disposed on both sides of the test piece are on almost the same flat surface.

Abstract: The present disclosure provides a disk brake capable of making it easier for the piston to return than conventional ones when the brake is released from a state where the brake is applied. In the disk brake, the seal groove 5 includes a front wall 51, a rear wall 52 farther from the brake rotor than the front wall 51 in the axial direction D1, and a bottom wall 53 extending along the axial direction D1 between the rear wall 52 and the front wall 51. The bottom wall 53 includes a front bottom wall 53a adjacent to the front wall 51 and a rear bottom wall 53b adjacent to the rear wall 52. The rear bottom wall 53b has a depth d2 from the inner circumferential surface 42a of the cylinder 42, the depth d2 being larger than a dimension d3 of the uncompressed piston seal 6 in the direction of the depth d2 and being larger than a depth d1 from the inner circumferential surface 42a of the cylinder 42 of the front bottom wall 53a.

Abstract: The objective of the present invention is to provide a technique that ensures conduction between a gate terminal of a semiconductor switching element and a wiring layer in a semiconductor device formed with a wiring layer inside a ceramic layer. This semiconductor device comprises: a wiring layer that is inside a ceramic layer formed above an insulation layer; and a metal layer for connecting terminals from the semiconductor switching element other than the gate terminal. The wiring layer and the gate terminal from the semiconductor switching element are connected electrically via a connection part formed from a conductive material. The connection part protrudes more than the metal layer toward the semiconductor switching element.

Abstract: Provided is a highly reliable semiconductor device capable of reducing stress generated in a semiconductor element even when a highly elastic joining material such as a Pb-free material is used in a power semiconductor having a double-sided mounting structure. The semiconductor device includes a semiconductor element including a gate electrode only on one surface, an upper electrode connected to the surface of the semiconductor element on which the gate electrode is provided, and a lower electrode connected to a surface opposite to the surface of the semiconductor element on which the gate electrode is provided.

Abstract: A highly reliable electromechanical integral motor is provided. In the electromechanical integral motor including an axial gap type motor and a power conversion control device, the power conversion control device is mounted on an end bracket portion of the motor. Additionally, a space is provided between the end bracket portion of the motor and the power conversion control device. Further, the end bracket portion of the motor and the power conversion control device are fixed by a plurality of fixing members, and at least one set of the plurality of fixing members is disposed to be spaced apart from each other.

Abstract: A ceramic substrate capable of suppressing the reduced reliability caused by via misalignment during manufacturing, and capable of suppressing the reduced reliability caused by thermal stress between the ceramic substrate and a mounting board is provided. The ceramic substrate includes an electrode and a via connected to the electrode. The ceramic substrate includes a plurality of vias provided to a center portion in a first direction of the electrode along a second direction. The first direction is parallel to a surface on which the electrode is disposed. The first direction is a direction connecting a center of the surface to a center of the electrode. The second direction is parallel to the surface and perpendicular to the first direction.

Abstract: The objective of the present invention is to provide a technique that ensures conduction between a gate terminal of a semiconductor switching element and a wiring layer in a semiconductor device formed with a wiring layer inside a ceramic layer. This semiconductor device comprises: a wiring layer that is inside a ceramic layer formed above an insulation layer; and a metal layer for connecting terminals from the semiconductor switching element other than the gate terminal. The wiring layer and the gate terminal from the semiconductor switching element are connected electrically via a connection part formed from a conductive material. The connection part protrudes more than the metal layer toward the semiconductor switching element.

Abstract: To significantly improve a heat dissipation property of an axial gap rotary electric machine within a size necessary for configuring a motor. In an axial gap rotary electric machine comprising a stator and a rotor in an axial direction, the stator has a plurality of stator cores arranged in a circumferential direction and coils wound around the stator cores, and a heat pipe obtained by filling an inside of a metal hollow pipe with a refrigerant is arranged in a gap between adjacent coils formed in an outer diameter portion of the stator in a radial direction and a housing with a necessary insulation distance between the coils and the heat pipe. The heat pipe extends in a direction of a rotation axis and an opposite output side, and is in contact with a heat dissipating fin outside an end bracket on the opposite output side.

Abstract: Some materials desired to acquire mechanical characteristics and fatigue characteristics are difficult to make in a large-size bulk material for a test piece. The invention provides a test jig which includes a primary jig which fixes both sides of a test piece, which is a test object, an upper jig which includes a load portion to load a weight on two places of an upper surface and two places of a lower surface of the primary jig, and a lower jig which includes a load portion to load a weight on two places of the upper surface and two places of the lower surface of the primary jig. The upper surface and the lower surface of the primary jig disposed on both sides of the test piece are on almost the same flat surface.

Abstract: To significantly improve a heat dissipation property of an axial gap rotary electric machine within a size necessary for configuring a motor. In an axial gap rotary electric machine comprising a stator and a rotor in an axial direction, the stator has a plurality of stator cores arranged in a circumferential direction and coils wound around the stator cores, and a heat pipe obtained by filling an inside of a metal hollow pipe with a refrigerant is arranged in a gap between adjacent coils formed in an outer diameter portion of the stator in a radial direction and a housing with a necessary insulation distance between the coils and the heat pipe. The heat pipe extends in a direction of a rotation axis and an opposite output side, and is in contact with a heat dissipating fin outside an end bracket on the opposite output side.

Abstract: An object of the present invention is to provide a highly reliable electromechanical integral motor. In an electromechanical integral motor including an axial gap type motor and a power conversion control device, the power conversion control device is mounted on an end bracket portion of the motor, a space is installed between the end bracket portion of the motor and the power conversion control device, the end bracket portion of the motor and the power conversion control device are fixed by a plurality of fixing members, and at least one set of the plurality of fixing members is disposed to be spaced apart from each other.

Abstract: A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

Abstract: In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected.