Patents by Inventor Hisashi Wakako
Hisashi Wakako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7700885Abstract: A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having a bottom surface (6, 26) and a side surface (7, 27), and a projection which is provided on a front surface side of the side surface (7, 27) of the cavity and projects toward a center of the opening; a metal layer (11) provided on the side surface (7, 27) of the cavity; and an insulating portion which is provided on a back surface (9, 29) of the projection (8, 28) so as to define an obtuse angle (?) with the metal layer (11), or which covers at least a top end portion of the metal layer (11).Type: GrantFiled: April 25, 2006Date of Patent: April 20, 2010Assignee: NGK Spark Plug Co., Ltd.Inventors: Makoto Nagai, Hisashi Wakako, Atsushi Uchida, Masahito Morita
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Patent number: 7648775Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.Type: GrantFiled: December 2, 2005Date of Patent: January 19, 2010Assignee: NGK Spark Plug Co., Ltd.Inventors: Hisashi Wakako, Makoto Nagai, Atsushi Uchida, Masahito Morita, Kazuo Kimura
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Publication number: 20070095565Abstract: A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having a bottom surface (6, 26) and a side surface (7, 27), and a projection which is provided on a front surface side of the side surface (7, 27) of the cavity and projects toward a center of the opening; a metal layer (11) provided on the side surface (7, 27) of the cavity; and an insulating portion which is provided on a back surface (9, 29) of the projection (8, 28) so as to define an obtuse angle (?) with the metal layer (11), or which covers at least a top end portion of the metal layer (11).Type: ApplicationFiled: April 25, 2006Publication date: May 3, 2007Inventors: Makoto Nagai, Hisashi Wakako, Atsushi Uchida, Masahito Morita
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Publication number: 20060147746Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.Type: ApplicationFiled: December 2, 2005Publication date: July 6, 2006Inventors: Hisashi Wakako, Makoto Nagai, Atsushi Uchida, Masahito Morita, Kazuo Kimura
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Patent number: 6887512Abstract: A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.Type: GrantFiled: August 9, 2002Date of Patent: May 3, 2005Assignee: NGK Spark Plug Co., Ltd.Inventors: Hisashi Wakako, Masahiro Iba, Kazuhisa Sato, Kazuo Kimura
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Patent number: 6546622Abstract: A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.Type: GrantFiled: March 16, 2001Date of Patent: April 15, 2003Assignee: NGK Spark Plug Co., Ltd.Inventors: Masahiro Iba, Hisashi Wakako, Kazuhisa Sato, Haruhiko Murata, Kazuyuki Takahashi, Kenzo Kawaguchi
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Publication number: 20020189860Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.Type: ApplicationFiled: August 9, 2002Publication date: December 19, 2002Applicant: NGK SPARK PLUG CO., LTD.Inventors: Hisashi Wakako, Masahiro Iba, Kazuhisa Sato, Kazuo Kimura
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Patent number: 6495211Abstract: A process for producing a substrate 1 having a base-metal plating layer, which includes an immersion step for immersing the substrate 1 in a plating solution contained in a plating tank 33, to thereby form a base-metal plating layer; a washing step for removing the substrate 1 from the plating tank 33, transferring the substrate 1 to a washing tank, and washing the substrate 1; and a cooling step for applying a cooling liquid to the substrate 1 during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate 1. An apparatus for carrying out the above process is also disclosed.Type: GrantFiled: June 18, 2001Date of Patent: December 17, 2002Assignee: NGK Spark Plug Co., Ltd.Inventors: Masahiro Iba, Hisashi Wakako, Kazuhisa Sato, Hiroyuki Hashimoto, Yasuo Doi
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Patent number: 6472609Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.Type: GrantFiled: May 25, 2001Date of Patent: October 29, 2002Assignee: NGK Spark Plug Co., Ltd.Inventors: Hisashi Wakako, Masahiro Iba, Kazuhisa Sato, Kazuo Kimura
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Publication number: 20010053562Abstract: A process for producing a substrate 1 having a base-metal plating layer, which includes an immersion step for immersing the substrate 1 in a plating solution contained in a plating tank 33, to thereby form a base-metal plating layer; a washing step for removing the substrate 1 from the plating tank 33, transferring the substrate 1 to a washing tank, and washing the substrate 1; and a cooling step for applying a cooling liquid to the substrate 1 during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate 1. An apparatus for carrying out the above process is also disclosed.Type: ApplicationFiled: June 18, 2001Publication date: December 20, 2001Applicant: NGK SPARK PLUG CO., LTD.Inventors: Masahiro Iba, Hisashi Wakako, Kazuhisa Sato, Hiroyuki Hashimoto, Yasuo Doi
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Publication number: 20010052183Abstract: A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.Type: ApplicationFiled: March 16, 2001Publication date: December 20, 2001Inventors: Masahiro Iba, Hisashi Wakako, Kazuhisa Sato, Haruhiko Murata, Kazuyuki Takahashi, Kenzo Kawaguchi
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Publication number: 20010047881Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.Type: ApplicationFiled: May 25, 2001Publication date: December 6, 2001Applicant: NGK SPARK PLUG CO., LTDInventors: Hisashi Wakako, Masahiro IBA, Kazuhisa Sato, Kazuo Kimura
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Patent number: 5798566Abstract: In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.Type: GrantFiled: November 24, 1997Date of Patent: August 25, 1998Assignee: NGK Spark Plug Co., Ltd.Inventors: Kazuhisa Sato, Masanori Kitou, Hisashi Wakako, Kazuo Kimura