Abstract: A substrate support stage of a plasma processing device, which stably controls a substrate at a relatively high temperature. The substrate support stage includes an electrostatic attraction plate (14) containing a first electrode for holding a substrate (W) by electrostatic attraction, a second electrode for applying a bias to the substrate (W), and a heater for heating the substrate, a cylindrical flange (13) welded to the lower surface of the electrostatic attraction plate (14) and produced from an alloy having the same heat characteristic as the electrostatic attraction plate (14), and a support stage (10) including an O-ring (12) in a surface facing the lower surface of the flange (13), to which the flange (13) is attached via the O-ring (12), wherein when the bias power to be applied to the substrate (W) is changed, the heater power for heating the substrate (W); is changed so that the temperature of the substrate (W) is constant.

Abstract: An object is to provide a substrate support stage of a plasma processing apparatus, in which electrical discharge from a connection terminal is prevented with a simple structure. In the substrate support stage of a plasma processing apparatus, an electrostatic attraction plate (13) configured to electrostatically attract a substrate (W) and to apply a bias to the substrate (W) is provided on an upper surface of a support stage (10) in a vacuum chamber, a sealing member (12) is provided on the upper surface of the support stage (10), an outer periphery side of the sealing member (12) is hermetically sealed as the vacuum chamber, and a connection terminal (17) commonly used for electrostatic attraction voltage supply and bias power supply is disposed on an atmosphere side which is an inner periphery side of the sealing member (12).

Abstract: An electrostatic chuck support mechanism is disclosed. An electrostatic chuck plate is fixed to a support stand by hold-down fittings, whereby a plug in a lower end portion of a copper pipe is fitted into a fitting socket against the pushing-up force of a jump-up fitting relying on a compression spring member. When the fixing of the electrostatic chuck plate is released from the support stand, the plug of the copper pipe is pushed up by the pushing-up force of the jump-up fitting relying on the compression spring member to move the copper pipe upward along with the electrostatic chuck plate. The electrostatic chuck support mechanism so constructed enables the electrostatic chuck plate to be mounted and detached easily.

Abstract: An electrostatic chuck support mechanism is disclosed. An electrostatic chuck plate is fixed to a support stand by hold-down fittings, whereby a plug in a lower end portion of a copper pipe is fitted into a fitting socket against the pushing-up force of a jump-up fitting relying on a compression spring member. When the fixing of the electrostatic chuck plate is released from the support stand, the plug of the copper pipe is pushed up by the pushing-up force of the jump-up fitting relying on the compression spring member to move the copper pipe upward along with the electrostatic chuck plate. The electrostatic chuck support mechanism so constructed enables the electrostatic chuck plate to be mounted and detached easily.