Patents by Inventor Hisashi Yasoda

Hisashi Yasoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6958095
    Abstract: An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: October 25, 2005
    Inventors: Masakazu Kakimoto, Fumiaki Matsumoto, Hisashi Yasoda, Makoto Furuta
  • Patent number: 6892616
    Abstract: A cutting apparatus is capable of cutting a work-piece depending upon the quality of the work-piece. The cutting apparatus produces parallelism between a knife edge of a cutting blade and a mounting face of the work-piece. A support having the blade is provided to a column capable of controlling a tilting angle of the blade in a blade length direction. Cutting is executed by controlling vertical movement of the blade. A driving source is capable of controlling movement linearly. The driving source produces a parallel relationship between a surface of a table and a knife edge. Different supports are each unitized to include a driving source and the blade vertically moved by the driving source. The different supports can be mounted interchangeably and selectively on a column of a cutting apparatus.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: May 17, 2005
    Assignee: UHT Corporation
    Inventors: Hisashi Yasoda, Noriyuki Wakabayashi, Takashi Tsuchida
  • Patent number: 6868885
    Abstract: A manufacturing speed for a laminated member for every layer is increased to improve productivity and at the same time a small-sized manufacturing apparatus capable of being practically realized is provided. A base plate is mounted at a linear predetermined segment path in such a way that it can be reciprocated and moved up and down, each of one to a plurality of an insulating layer forming means for discharging ceramics slurry or insulating resin paste, conductive layer forming means for injecting conductive paste by an ink jet system and drying means for drying said slurry, paste are arranged side by side on the segment path, the thin film layer having a predetermined electrode pattern arranged thereon is formed on the ceramics insulating layer while the base plate reciprocates by once to several times over the segment path, and these operations are repeated to form the laminated member.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: March 22, 2005
    Assignee: UHT Corporation
    Inventors: Masakazu Kakimoto, Fumiaki Matsumoto, Hisashi Yasoda, Makoto Furuta
  • Patent number: 6818858
    Abstract: There are provided a laser processing unit easily detachable for replacement from the main body of a processing apparatus, excellent in maintainability, and capable of performing an efficient perforating operation and a processing apparatus having the laser processing unit. A casing detachable from the main body 1 of processing apparatus into which a work W is carried is composed integrally of a unit one half portion, a unit other half portion disposed in opposing relation to the unit one half portion with a work insertion space interposed therebetween, and a connecting portion for connecting the unit one half portion and the unit other half portion to each other. Optical means for guiding a laser beam emitted from a laser emission port into a processing area located above the unit other half portion and focusing the guided laser beam therein is provided in the unit one half portion. A beam receiving plate which transmits the laser beam is provided in the processing area.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: November 16, 2004
    Assignee: UHT Corporation
    Inventors: Hisashi Yasoda, Masato Fukushima
  • Patent number: 6766723
    Abstract: A grid pattern punch type multiaxis punch device is capable of simultaneously punching punched holes of the same shape showing different shapes for every location at each of the same positions in each of the areas defined in a work. Every time a work is moved in X-axis, Y-axis directions under its controlled state, a hammer holder is moved in a horizontal direction under its controlled state, a punch drive source (a servo motor) is driven under a state in which hammers are corresponded just above optional punches at the same positions in each group of units, each of the punches present at the same positions in the group of units is punched by each of the hammers, thereby the punch holes having the same shapes showing different shapes for every location are punched simultaneously at each of the same locations within each area defined in the work.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: July 27, 2004
    Assignee: UHT Corporation
    Inventors: Hisashi Yasoda, Takashi Tsuchida
  • Patent number: 6722245
    Abstract: There will be provided a punching unit capable of reliably drawing a punch out of the workpiece, improving the productivity and without deteriorating the boring precision even for a workpiece which easily spreads, and preventing leavings rising. A stripper plates which has been positioned close to the workpiece in accordance with the thickness thereof does not press the workpiece, but draws the punch during rising out of the workpiece to transmit the striking driving force of the electric motor to the movable die holding the punch. In an air path portion arranged within the machine frame, there is provided means for opening or closing through an electric signal and the air path between the air ejecting unit and the means is made shorter, whereby the response to air ejection is improved, the pressure loss during air flow is reduced to a minimum, and jet air is accurately applied to punching chips (leavings) which adhere to the punch at the bottom dead center for peeling off the punch.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: April 20, 2004
    Assignee: UHT Corporation
    Inventors: Hisashi Yasoda, Yoshikazu Muramatsu
  • Publication number: 20030183165
    Abstract: An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.
    Type: Application
    Filed: March 27, 2003
    Publication date: October 2, 2003
    Applicant: UHT Corporation
    Inventors: Masakazu Kakimoto, Fumiaki Matsumoto, Hisashi Yasoda, Makoto Furuta
  • Publication number: 20030160029
    Abstract: There are provided a laser processing unit easily detachable for replacement from the main body of a processing apparatus, excellent in maintainability, and capable of performing an efficient perforating operation and a processing apparatus having the laser processing unit. A casing detachable from the main body 1 of processing apparatus into which a work W is carried is composed integrally of a unit one half portion, a unit other half portion disposed in opposing relation to the unit one half portion with a work insertion space interposed therebetween, and a connecting portion for connecting the unit one half portion and the unit other half portion to each other. Optical means for guiding a laser beam emitted from a laser emission port into a processing area located above the unit other half portion and focusing the guided laser beam therein is provided in the unit one half portion. A beam receiving plate which transmits the laser beam is provided in the processing area.
    Type: Application
    Filed: January 29, 2003
    Publication date: August 28, 2003
    Applicant: UHT Corporation
    Inventors: Hisashi Yasoda, Masato Fukushima
  • Publication number: 20030159783
    Abstract: A manufacturing speed for a laminated member for every layer is increased to improve productivity and at the same time a small-sized manufacturing apparatus capable of being practically realized is provided. A base plate is mounted at a linear predetermined segment path in such a way that it can be reciprocated and moved up and down, each of one to a plurality of an insulating layer forming means for discharging ceramics slurry or insulating resin paste, conductive layer forming means for injecting conductive paste by an ink jet system and drying means for drying said slurry, paste are arranged side by side on the segment path, the thin film layer having a predetermined electrode pattern arranged thereon is formed on the ceramics insulating layer while the base plate reciprocates by once to several times over the segment path, and these operations are repeated to form the laminated member.
    Type: Application
    Filed: March 22, 2002
    Publication date: August 28, 2003
    Applicant: UHT CORPORATION
    Inventors: Masakazu Kakimoto, Fumiaki Matsumoto, Hisashi Yasoda, Makoto Furuta
  • Publication number: 20020139233
    Abstract: A grid pattern punch type multiaxis punch device is capable of simultaneously punching punched holes of the same shape showing different shapes for every location at each of the same positions in each of the areas defined in a work. Every time a work is moved in X-axis, Y-axis directions under its controlled state, a hammer holder is moved in a horizontal direction under its controlled state, a punch drive source (a servo motor) is driven under a state in which hammers are corresponded just above optional punches at the same positions in each group of units, each of the punches present at the same positions in the group of units is punched by each of the hammers, thereby the punch holes having the same shapes showing different shapes for every location are punched simultaneously at each of the same locations within each area defined in the work.
    Type: Application
    Filed: March 27, 2002
    Publication date: October 3, 2002
    Applicant: UHT CORPORATION
    Inventors: Hisashi Yasoda, Takashi Tsuchida
  • Publication number: 20020092392
    Abstract: There will be provided a punching unit capable of reliably drawing a punch out of the workpiece, improving the productivity and without deteriorating the boring precision even for a workpiece which easily spreads, and preventing leavings rising. A stripper plates which has been positioned close to the workpiece in accordance with the thickness thereof does not press the workpiece, but draws the punch during rising out of the workpiece to transmit the striking driving force of the electric motor to the movable die holding the punch. In an air path portion arranged within the machine frame, there is provided means for opening or closing through an electric signal and the air path between the air ejecting unit and the means is made shorter, whereby the response to air ejection is improved, the pressure loss during air flow is reduced to a minimum, and jet air is accurately applied to punching chips (leavings) which adhere to the punch at the bottom dead center for peeling off the punch.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 18, 2002
    Applicant: UHT CORPORATION
    Inventors: Hisashi Yasoda, Yoshikazu Muramatsu
  • Publication number: 20020069736
    Abstract: To provide a cutting apparatus capable of executing cutting or half cutting of a work-piece depending upon quality of the work-piece by producing parallelism between a knife edge of a cutting blade and a mounting face of the work-piece.
    Type: Application
    Filed: November 26, 2001
    Publication date: June 13, 2002
    Applicant: UHT CORPORATION
    Inventors: Hisashi Yasoda, Noriyuki Wakabayashi, Takashi Tsuchida
  • Patent number: 6272962
    Abstract: A cutting blade includes a shank portion and a cutting portion having a predetermined length and opposed sides, and affixed to the shank portion. The cutting portion has a cutting edge portion having a predetermined length and opposed sides and a continuous portion which continuously extends from the cutting edge portion to the shank portion, so that blade thickness gradually increases in a direction towards the shank portion. The cutting portion further has at least one pair of opposed concave curved surfaces substantially symmetrical to each other with respect to a center line, each opposed concave surface axially extending in a direction substantially parallel to the length of the cutting edge portion and provided on at least one of the cutting edge portion and the continuous portion.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: August 14, 2001
    Assignee: UHT Corporation
    Inventors: Hisashi Yasoda, Noriyuki Wakabayashi