Abstract: According to one embodiment, there are contact pins, each of which is provided in a contact pin arrangement recess by corresponding to an arrangement position of a lead line of an IC, and changes a position in a vertical direction, depending on presence or absence of contact with the lead line. There are detection pins, each of which is inserted in a through-hole formed in a protruding portion of a cover by corresponding to an arrangement position of each contact pin, and moves up and down, depending on a position of the contact pin. A relative position of an upper surface of each detection pin relative to an upper surface of the cover differs between a first occasion where the contact pin is not in contact with the lead line and a second occasion where the contact pin is in contact with the lead line.

Abstract: According to one embodiment, there are contact pins, each of which is provided in a contact pin arrangement recess by corresponding to an arrangement position of a lead line of an IC, and changes a position in a vertical direction, depending on presence or absence of contact with the lead line. There are detection pins, each of which is inserted in a through-hole formed in a protruding portion of a cover by corresponding to an arrangement position of each contact pin, and moves up and down, depending on a position of the contact pin. A relative position of an upper surface of each detection pin relative to an upper surface of the cover differs between a first occasion where the contact pin is not in contact with the lead line and a second occasion where the contact pin is in contact with the lead line.