Patents by Inventor Hisashl Aida

Hisashl Aida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film deposition method and apparatus for semiconductor devices
    Patent number: 6511538
    Abstract: When performing film deposition on the surface of a wafer, a turntable supporting the wafer is first rotated. Next, a fluid containing an organic metal is applied onto the wafer via the tip of a nozzle. At the same time, an ultrasound wave is generated by an ultrasound wave generating device, and the turntable is vibrated. Thus the vibrations from the turntable are applied to the wafer, these wafer vibrations allow the fluid containing an organic metal to thoroughly permeate into the detailed patterning of the wafer surface, and said fluid covers its entirety. As a result, film deposition with excellent filling-in characteristics becomes possible.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: January 28, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Yuichi Wada, Hiroyuki Yarita, Hisashl Aida, Naomi Yoshida