Abstract: A fabricating apparatus includes a powder layer forming device, a fabrication liquid discharge device, and processing circuitry. The powder layer forming device is configured to form a powder layer. The fabrication liquid discharge device is configured to discharge fabrication liquid onto the powder layer. The processing circuitry is configured to control the fabrication liquid discharge device to discharge the fabrication liquid with a first kinetic energy and then discharge the fabrication liquid with a second kinetic energy higher than the first kinetic energy.

Abstract: A lamination fabricating method includes forming a powder layer including a powder for three-dimensional fabrication, applying a fabrication liquid to the powder layer, repeating the forming of the powder layer and the forming the powder layer to form a fabricated object, and forming a base layer prior to the forming of the powder layer. A powder filling rate of the base layer is higher than a powder filling rate of the powder layer.

Abstract: A liquid fabrication applied to a layer of powder containing an inorganic particle, wherein the liquid fabrication has a powder contact angle with the inorganic particle of 50 degrees or greater and satisfies the following relationship 1: ?cos?/??1.5 m/s, where ? represents the powder contact angle, ? represents a surface tension in mN/m of the liquid fabrication at 23 degrees C., and ? represents a viscosity in mPa·s of the liquid fabrication at 25 degrees C.

Abstract: A fabricated object manufactured from powder contained in a container of a fabrication apparatus is provided. The fabricated object satisfies the following relationship d>d?, where d (?m) denotes a number average diameter of the powder contained in the container and d? (?m) denotes a number average diameter of the powder included in the fabricated object.

Abstract: A fabricating apparatus includes a powder layer forming device, a fabrication liquid discharge device, and processing circuitry. The powder layer forming device is configured to form a powder layer. The fabrication liquid discharge device is configured to discharge fabrication liquid onto the powder layer. The processing circuitry is configured to control the fabrication liquid discharge device to discharge the fabrication liquid with a first kinetic energy and then discharge the fabrication liquid with a second kinetic energy higher than the first kinetic energy.