Patents by Inventor Hisatane Komori

Hisatane Komori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10831235
    Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: November 10, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
  • Patent number: 10735673
    Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp?To)×?PCB1<(Tgf?To)×?f1+(Tgp?Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf?To)×?f1<(Tgp?To)×?PCB1+(Tgf?Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: August 4, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
  • Publication number: 20190335119
    Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp-To) ×?PCB1<(Tgf-To)×?f1+(Tgp-Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf-To)×?f1<(Tgp-To)×?PCB1+(Tgf-Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 31, 2019
    Inventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
  • Publication number: 20190294213
    Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
  • Patent number: 9815133
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9774769
    Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: September 26, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20160119564
    Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.
    Type: Application
    Filed: September 29, 2015
    Publication date: April 28, 2016
    Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20160044796
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 11, 2016
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9253922
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: February 2, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 9155212
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: October 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 8698938
    Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: April 15, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Hisatane Komori, Satoru Hamasaki
  • Publication number: 20130286565
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20130286566
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20130286592
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 8279336
    Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(?A?2?C)?L1+L1? at any point on the upright surface, and H tan(?A?2?B)+(H1)tan ?B?L1 and ?B>?C at any point on the non-vertical surface, where ?A is the inclination of incident light, ?B is the inclination at a point on the non-vertical surface, ?C is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1? is the distance from the upper edge to the lower edge of the upright surface in the planar direction.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: October 2, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Hisatane Komori, Yasuhiro Matsuki, Satoru Hamasaki
  • Publication number: 20120212637
    Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 23, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Hisatane Komori, Satoru Hamasaki
  • Patent number: 8241951
    Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: August 14, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hisatane Komori, Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki
  • Publication number: 20100309354
    Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(?A?2?C)?L1+L1? at any point on the upright surface, and H tan(?A?2?B)+(H1)tan ?B?L1 and ?B>?C at any point on the non-vertical surface, where ?A is the inclination of incident light, ?B is the inclination at a point on the non-vertical surface, ?C is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1? is the distance from the upper edge to the lower edge of the upright surface in the planar direction.
    Type: Application
    Filed: June 7, 2010
    Publication date: December 9, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Hisatane Komori, Yasuhiro Matsuki, Satoru Hamasaki
  • Publication number: 20100155869
    Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.
    Type: Application
    Filed: December 17, 2009
    Publication date: June 24, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hisatane Komori, Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki