Patents by Inventor Hisatoshi Atsumo

Hisatoshi Atsumo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing heat conductive substrate
    Patent number: 7279365
    Abstract: The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: October 9, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuya Tsumura, Shinya Tanaka, Michihiro Miyauchi, Hisatoshi Atsumo, Yoshiyuki Miyoshi
  • Method of manufacturing heat conductive substrate
    Publication number: 20050037543
    Abstract: The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.
    Type: Application
    Filed: March 27, 2003
    Publication date: February 17, 2005
    Inventors: Tetsuya Tsumura, Shinya Tanaka, Michihiro Miyauchi, Hisatoshi Atsumo, Yoshiyuki Miyoshi