Abstract: A laser beam irradiating unit of a laser processing apparatus includes a laser oscillator, a mirror configured to reflect a laser beam emitted from the laser oscillator and propagate the laser beam to a processing point, a power measuring unit configured to measure power of leakage light of the laser beam transmitted without being reflected by the mirror, and a condensing lens configured to condense the laser beam propagated by the mirror and irradiate a workpiece with the condensed laser beam. The control unit measures the power of the leakage light of the laser beam by the power measuring unit while irradiating the workpiece with the laser beam.

Abstract: Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

Abstract: Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

Abstract: A laser processing apparatus includes a first chuck table for holding a first workpiece, moving units for moving the first chuck table in X and Y directions, and a first focusing unit for focusing a first laser beam to the first workpiece. A second chuck table holds a second workpiece. Other moving units move the second chuck table in the X direction and Y directions, and a second focusing unit focuses a second laser beam to the second workpiece. A laser oscillator produces an original laser beam, and an optical system branches the original laser beam into the first laser beam and the second laser beam, and leads the first and second laser beams to the first and second focusing units, respectively.