Patents by Inventor Hisatoshi Narita

Hisatoshi Narita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection
    Patent number: 4751482
    Abstract: This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned above the chip, which comprises an internal transmission line having a predetermined characteristic impedance on a dielectric insulating plate. The internal transmission line forms a strip line or coplanar transmission line including a signal line an ground conductor film. The wiring board internconnects the outer lead and bonding pads on the chip. The wiring between the internal transmission lines can cross by using a multi-layered structure. As the result of the structure of the present invention, transmission loss is reduced, and it is possible to design the wiring board having an optimum performance for ultra high speed operation of the high density integrated circuit device.
    Type: Grant
    Filed: October 20, 1986
    Date of Patent: June 14, 1988
    Assignee: Fujitsu Limited
    Inventors: Masumi Fukuta, Hisatoshi Narita