Patents by Inventor Hisatsuna Nakagawa

Hisatsuna Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed-wiring board, method for identifying same, and method for manufacturing same
    Patent number: 6512180
    Abstract: A printed-wiring board to be mounted with a circuit element includes a plurality of pads which assist in an electric connection between the circuit element and a wiring pattern, at least one of said plurality of pads being used to serve as an identifier for identifying the printed-wiring board.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: January 28, 2003
    Assignee: Fujitsu Limited
    Inventor: Hisatsuna Nakagawa
  • PRINTED-WIRING BOARD, METHOD FOR IDENTIFYING SAME, AND METHOD FOR MANUFACTURING SAME
    Publication number: 20030000734
    Abstract: A printed-wiring board to be mounted with a circuit element includes a plurality of pads which assist in an electric connection between the circuit element and a wiring pattern, at least one of said plurality of pads being used to serve as an identifier for identifying the printed-wiring board.
    Type: Application
    Filed: December 7, 2001
    Publication date: January 2, 2003
    Applicant: FUJITSU LIMITED
    Inventor: Hisatsuna Nakagawa