Patents by Inventor Hisaya SUGIURA

Hisaya SUGIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220009134
    Abstract: A method of producing a hard coating layer-laminated mold resin comprising a transfer material preparation step, a resin preparation step, a disposition step, and a transfer step. In the transfer material preparation step, a transfer material including a substrate sheet and a protective layer is prepared. The protective layer includes a cured and/or half-cured product of an active energy ray-curable resin and has a thermally reactive group and a polysiloxane chain. In the resin preparation step, mold resin in a thermally uncured and/or half-cured state is prepared. In the disposition step, the transfer material is disposed so that the protective layer is exposed. In the transfer step, the mold resin and the protective layer are brought into contact and heated to chemically bond them, and the mold layer is cured, and the protective layer is cured to form the hard coating layer.
    Type: Application
    Filed: November 26, 2019
    Publication date: January 13, 2022
    Applicants: Harima Chemicals, Incorporated, Hamamatsu Photonics K.K.
    Inventors: Ryouichi NAKAI, Yutaka KITAJIMA, Hisaya SUGIURA, Takayuki IKEYA