Patents by Inventor Hisaya TAKAYAMA

Hisaya TAKAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527938
    Abstract: [Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: January 7, 2020
    Assignee: NISSHA CO., LTD.
    Inventors: Hideaki Nada, Hiroaki Uefuji, Hirotaka Shigeno, Yoshihiro Sakata, Yuki Matsui, Hisaya Takayama
  • Publication number: 20170307974
    Abstract: [Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.
    Type: Application
    Filed: October 22, 2015
    Publication date: October 26, 2017
    Inventors: Hideaki Nada, Hiroaki Uefuji, Hirotaka Shigeno, Yoshihiro Sakata, Yuki Matsui, Hisaya Takayama
  • Patent number: 9383846
    Abstract: In a flexible printed circuit (FPC) connection structure for a touch sensor, corrosion of an electrode terminal is prevented without reducing connection reliability. In a touch sensor, a tip of a first passivation layer and a tip of an FPC wiring are spaced apart from one another, and consequently an exposed portion, which is adjacent to a tipmost part and is not covered by the first passivation layer, is formed on a connection terminal. An FPC film includes a tip, which further extends from the FPC wiring and extends to a location at which it overlaps, in a plan view, the first passivation layer, and thereby a space is formed between the tip and the exposed portion. The touch sensor further includes an anti-rust material, which fills the space and thereby covers the exposed portion of the connection terminal.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: July 5, 2016
    Assignee: NISSHA PRINTING CO., LTD.
    Inventors: Itsuo Furukawa, Hisaya Takayama, Ikuko Mori
  • Publication number: 20160162062
    Abstract: In a flexible printed circuit (FPC) connection structure for a touch sensor, corrosion of an electrode terminal is prevented without reducing connection reliability. In a touch sensor, a tip of a first passivation layer and a tip of an FPC wiring are spaced apart from one another, and consequently an exposed portion, which is adjacent to a tipmost part and is not covered by the first passivation layer, is formed on a connection terminal. An FPC film includes a tip, which further extends from the FPC wiring and extends to a location at which it overlaps, in a plan view, the first passivation layer, and thereby a space is formed between the tip and the exposed portion. The touch sensor further includes an anti-rust material, which fills the space and thereby covers the exposed portion of the connection terminal.
    Type: Application
    Filed: April 23, 2014
    Publication date: June 9, 2016
    Inventors: Itsuo FURUKAWA, Hisaya TAKAYAMA, Ikuko MORI