Patents by Inventor Hisayasu Mitsui

Hisayasu Mitsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6811923
    Abstract: Positive electrode active material for nonaqueous electrolytic solution secondary batteries is made of a metal oxide. A content of coarse particles, of which particles sizes are 600% or more with respect to an average particle size of the metal oxide, is 1% or less by volume, and a content of high density particles, of which densities are 150% or more with respect to an average density of the metal oxide, is 1000 ppm or less. By using the positive electrode active material, battery characteristics and a manufacturing yield may be improved.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: November 2, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ryo Sakai, Yasuhiro Shirakawa, Kotaro Iyasu, Nobukazu Suzuki, Hisayasu Mitsui
  • Patent number: 6153301
    Abstract: A mica tape formed by a paper-making process from a mixture of the mica particles and at least one selected from the group consisting of a short fiber made of a nitrogen-free organic material and a short fiber made of an inorganic material, and an insulated coil by winding the mica tape around a conductive coil and impregnating the mica tape with a solventless thermo-setting resin. The short fiber has an average diameter of 0.1 to 20 .mu.m and an average length of 0.5 to 10 mm.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: November 28, 2000
    Assignees: Kabushiki Kaisha Toshiba, Nippon Rika Kogyosho Co., Ltd.
    Inventors: Noriyuki Iwata, Hisayasu Mitsui, Hiroshi Hatano, Hideaki Nakatsu, Takuo Yoshida
  • Patent number: 5708405
    Abstract: A superconducting coil bas a winding wire portion which is formed by winding a superconducting wire covered with an insulating material around a winding frame composed of such a material that its modulus of longitudinal elasticity is 50 (GPa) or greater, and its thermal contraction rate between a room temperature and a temperature of 77 (K) is 0.35% or above while applying a tensile force thereto, and a bonding material impregnated between the superconducting wires and is then solidified by a heat treatment to reduce a contact surface pressure between the winding wire portion and the winding frame, preventing transition to a normal conductive state.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: January 13, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideshige Moriyama, Hiroki Sekiya, Tamiko Hirumachi, Hisayasu Mitsui, Susumu Mine, Takahiro Tsuchihashi, Akio Tanaka, Sei Murai, Takayuki Kobayashi, Hiroshi Hatano
  • Patent number: 4400676
    Abstract: An electrically insulated coil comprising a coil; and a mica tape wound around said coil and containing a resin composition; said resin composition including an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from the group consisting of a silane compound having a hydroxyl group and a polysiloxane compound having a hydroxyl group, said curing catalyst being added in an amount of 0.1 to 5% by weight based on said epoxy resin, said curing accelerator being added in an amount of 0.1 to 10% by weight based on said epoxy resin, and said resin composition being cured by heating after said mica tape is wound around said coil.
    Type: Grant
    Filed: December 2, 1980
    Date of Patent: August 23, 1983
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventor: Hisayasu Mitsui
  • Patent number: 4335367
    Abstract: An electrically insulated coil is composed of a coil and a mica tape containing a first resinous composition, wound upon the coil; the resinous composition containing a maleimide compound, an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from the group consisting of a silane compound having a hydroxyl group and a polysiloxane compound having a hydroxyl group; the curing catalyst and the curing accelerator each being in an amount of about 0.0001 to 5% by weight based on the total amount of the maleimide compound and the epoxy resin; and the resinous composition being cured by heating after the mica tape is wound around the coil.The electrically insulated coil may further contain a second resinous composition comprising an epoxy resin and an acid anhydride, the second resinous composition impregnating the mica tape after the mica tape is wound around the coil, and being heat-cured together with the first resinous composition.
    Type: Grant
    Filed: August 14, 1980
    Date of Patent: June 15, 1982
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Hisayasu Mitsui, Ryozi Kumazawa, Yoshiyuki Inoue, Shuichi Suzuki, Takeo Ito, Sinichi Sanada, Shuzi Hayase
  • Patent number: 4033805
    Abstract: A compound mica sheet is prepared by bonding a mica sheet to a woven fabric through a powdered epoxy resin with curing agent. The mica sheet holds a cured thermosetting resin composition impregnated therein and has an uncured epoxy resin composition including a curing agent impregnated therein. When thermosetting resin is forcedly impregnated, through vacuum/pressure impregnation, into a coil wound with the compound mica sheet which is adapted for use in medium and high voltage electric apparatus, and then cured, an excellent insulated coil is obtained.
    Type: Grant
    Filed: February 24, 1976
    Date of Patent: July 5, 1977
    Assignee: Tokyo Shibaura Electric Co., Ltd.
    Inventors: Hisayasu Mitsui, Jun-ichi Kamiuchi, Ryozi Kumazawa, Kimikazu Umemoto, Toshimitsu Yamada, Katsuhiko Yoshida, Taichi Takechi
  • Patent number: 3991232
    Abstract: A method of manufacturing an electrically insulated coil having excellent insulation characteristics and high reliability using a vacuum-pressure impregnation process comprises the step of selectively effectively combining epoxy resins, curing agents and curing accelerators employed as a mica bonding agent and an impregnant.
    Type: Grant
    Filed: March 11, 1975
    Date of Patent: November 9, 1976
    Assignee: Tokyo Shibaura Electric Co., Ltd.
    Inventors: Junichi Kamiuchi, Taichi Takechi, Hisayasu Mitsui, Ryozi Kumazawa, Kimikazu Umemoto, Toshimitsu Yamada