Patents by Inventor Hisayoshi Motobayashi

Hisayoshi Motobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920752
    Abstract: There is provided a light source device, a headlight, a display apparatus, and an illumination apparatus having excellent heat dissipation. The light source device includes a substrate, a phosphor, a light emitting element, and a wavelength-selective reflecting member. The phosphor is disposed in contact with the substrate. The light emitting element emits excitation light for exciting the phosphor. The wavelength-selective reflecting member partially reflects the excitation light emitted from the light emitting element to be guided to the phosphor and transmits fluorescence emitted from the phosphor by excitation caused by incidence of the excitation light and the excitation light reflected by the phosphor.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 5, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Hisayoshi Motobayashi, Satoshi Wada, Kento Hayashi, Yuhki Kawamura
  • Publication number: 20230014812
    Abstract: [Object] To provide a light source device, a headlight, a display apparatus, and an illumination apparatus having excellent heat dissipation. [Solving Means] The light source device includes a substrate, a phosphor, a light emitting element, and a wavelength-selective reflecting member. The phosphor is disposed in contact with the substrate. The light emitting element emits excitation light for exciting the phosphor. The wavelength-selective reflecting member partially reflects the excitation light emitted from the light emitting element to be guided to the phosphor and transmits fluorescence emitted from the phosphor by excitation caused by incidence of the excitation light and the excitation light reflected by the phosphor.
    Type: Application
    Filed: December 16, 2020
    Publication date: January 19, 2023
    Inventors: HISAYOSHI MOTOBAYASHI, SATOSHI WADA, KENTO HAYASHI, YUHKI KAWAMURA
  • Publication number: 20220376156
    Abstract: A first semiconductor device according to an embodiment of the present disclosure includes: a semiconductor element; a first housing member and a second housing member that house the semiconductor element; a first base layer formed on a bonded surface of the first housing member to the second housing member; a second base layer formed on a bonded surface of the second housing member to the first housing member; a solder bonding section that bonds the first housing member and the second housing member with the first base layer and the second base layer interposed in between; and a solder adsorption layer provided on at least one of the bonded surface of the first housing member or the bonded surface of the second housing member to be apart from the first base layer and the second base layer.
    Type: Application
    Filed: October 8, 2020
    Publication date: November 24, 2022
    Inventors: Hiroyuki MIYAHARA, Hisayoshi MOTOBAYASHI, Yoshiro TAKIGUCHI, Takahiro KOYAMA, Hidekazu KAWANISHI
  • Publication number: 20220344549
    Abstract: There is provided a light-emitting device (1) including: a light-emitting element (20); a light-transmissive heat dissipation member (11) having a plate shape; a wavelength conversion member (12) that takes in, from a side of a light scattering layer (12a), light that is emitted from the light-emitting element (20) and passes through the light-transmissive heat dissipation member (11), and converts a wavelength in a fluorescent layer (12b); a lateral heat dissipation member that has a plate shape, includes a high-heat conduction member (13) in contact with a side surface of the wavelength conversion member (12) via a light reflection member (14), and is in contact with an upper surface of the light-transmissive heat dissipation member (11); and a package (21) that houses the light-emitting element (20) and supports a wavelength conversion unit (100) including the light-transmissive heat dissipation member (11), the wavelength conversion member (12), and the lateral heat dissipation member.
    Type: Application
    Filed: September 25, 2020
    Publication date: October 27, 2022
    Inventors: Satoshi WADA, Kento HAYASHI, Yuhki KAWAMURA, Masahiro MURAYAMA, Hisayoshi MOTOBAYASHI, Yoshiro TAKIGUCHI, Hidekazu KAWANISHI, Katsunori YANASHIMA
  • Publication number: 20220077649
    Abstract: There is provided a semiconductor light emitting device that allows the internal resistance to be improved. A semiconductor light emitting device according to an embodiment of the present disclosure includes: a light emitting element; a first housing member and a second housing member at least one of which has a wiring structure; and an electrically conductive bonding section. The first housing member and the second housing member house the light emitting element. The wiring structure electrically couples the light emitting element and an outside. The electrically conductive bonding section bonds the first housing member and the second housing member. The electrically conductive bonding section is electrically coupled to the wiring structure.
    Type: Application
    Filed: December 6, 2019
    Publication date: March 10, 2022
    Inventors: Yoshiro TAKIGUCHI, Hisayoshi MOTOBAYASHI, Hiroyuki MIYAHARA, Masahiro MURAYAMA, Hidekazu KAWANISHI
  • Patent number: 11106110
    Abstract: An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: August 31, 2021
    Assignee: Sony Corporation
    Inventors: Tomomasa Watanabe, Masayuki Tanaka, Hisayoshi Motobayashi, Shiro Uchida
  • Publication number: 20210181614
    Abstract: A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.
    Type: Application
    Filed: July 26, 2019
    Publication date: June 17, 2021
    Inventors: Hisayoshi MOTOBAYASHI, Hidekazu KAWANISHI, Yoshiro TAKIGUCHI, Masahiro MURAYAMA, Hiroyuki MIYAHARA, Hitoshi DOMON
  • Patent number: 10824060
    Abstract: A light source module according to an embodiment of the present disclosure includes: a radiator; a plurality of light-emitting elements disposed on the radiator; a plurality of lenses that each convert a light beam outputted from corresponding one of the plurality of light-emitting elements into a collimated light beam and output the collimated light beam; a plurality of first optical elements that each reflect the collimated light beam outputted from corresponding one of the plurality of lenses while adjusting an optical axis direction of the collimated light beam; and a second optical element that multiplexes respective light beams reflected from the plurality of first optical elements.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: November 3, 2020
    Assignee: SONY CORPORATION
    Inventors: Hisayoshi Motobayashi, Tomoki Ono
  • Publication number: 20190171091
    Abstract: A light source module according to an embodiment of the present disclosure includes: a radiator; a plurality of light-emitting elements disposed on the radiator; a plurality of lenses that each convert a light beam outputted from corresponding one of the plurality of light-emitting elements into a collimated light beam and output the collimated light beam; a plurality of first optical elements that each reflect the collimated light beam outputted from corresponding one of the plurality of lenses while adjusting an optical axis direction of the collimated light beam; and a second optical element that multiplexes respective light beams reflected from the plurality of first optical elements.
    Type: Application
    Filed: June 19, 2017
    Publication date: June 6, 2019
    Inventors: HISAYOSHI MOTOBAYASHI, TOMOKI ONO
  • Publication number: 20170232669
    Abstract: An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.
    Type: Application
    Filed: September 17, 2015
    Publication date: August 17, 2017
    Applicant: Sony Corporation
    Inventors: Tomomasa Watanabe, Masayuki Tanaka, Hisayoshi Motobayashi, Shiro Uchida