Patents by Inventor Hisayoshi Muramatsu

Hisayoshi Muramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Press-contact type semiconductor devices
    Patent number: 5610439
    Abstract: A press-contact type semiconductor device having multiple semiconductor substrates, a periphery of which being enclosed by a chip frame of insulating resin a first electrode plate and a second electrode plate. The semiconductor substrates are arranged on a plane so as to abut against the chip frame. The semiconductor substrates are press-contacted from the upper and the lower sides by the first electrode plate and the second electrode plate.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: March 11, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Michiaki Hiyoshi, Hisayoshi Muramatsu, Takashi Fujiwara