Abstract: A disclosed method of manufacturing an image display element structure includes a coating step of coating a substrate surface including a plurality of recessed portions arranged at predetermined intervals, with a coating material that is plastic-deformable, in such a manner as to maintain spaces in the recessed portions; and an expanding step of forming gaps in the coating material coating the substrate surface by expanding gas in the spaces, wherein the gaps correspond to the recessed portions; and a peeling step of peeling off the coating material in which the gaps have been formed, from the substrate surface.

Abstract: A display panel includes a sheet having first and second spaced apart surfaces defining a space therebetween and a plurality of partitions extending from the first surface to the second surface and dividing the space into a plurality of cells, wherein the thickness of each partition is in a range of 0.01 to 10 ?m.

Abstract: An apparatus maintaining adjusted positions of parts assembled by adhering includes a device coating plural sections between a part and an adhering target with light energy curable adhesives adhering the part to the adhering target, a light energy irradiating device for curing the adhesive, and a detecting device detecting a displacement of the part from the adhering target. A curing shrinkage force control device is also provided to control the light energy irradiating device to change the light and thus control curing shrinkage forces to offset undesirable stresses generated by the curing shrinkage forces when undesirable displacement is detected.

Abstract: A device for assembling and adjusting an optical unit of the present invention includes an adjusting device including a collimator lens, an object lens, a disk, and a signal sensing system. A light beam output from the optical unit is incident to the collimator lens. Parallel rays output from the collimator lens are incident to the object leans. Further, a spot converged by the object lens is incident to the disk. The signal sensing system receives a light beam reflected by the disk via the object lens to thereby determine a distance between the object lens and the disk and a positional relation between the spot on the disk and the groove of the disk. The device allows the position of a light emitting element to be accurately determined and therefore allows the angular deviation of the intensity distribution of the light emitting element from a designed value to be easily grasped.

Abstract: Provided is a fuel battery excellent in heat resistance and capable of facilitating assembling through the use of a less number of parts and of increasing the degree of freedom of configuration. An oxygen electrode 11 for reducing oxygen and a fuel electrode for oxidizing a fuel are formed in a porous ceramic substrate, with an ionic conduction part being formed between the oxygen electrode and the fuel electrode. In addition, in the ceramic substrate, gas barrier regions are formed to establish the isolation between the oxygen and the fuel. Still additionally, an oxygen supply region is formed in the ceramic substrate to exist on the opposite side to the ionic conduction part with respect to the oxygen electrode and a fuel supply region is formed in the ceramic substrate to exist on the opposite side to the ionic conduction part with respect to the fuel electrode.

Abstract: Before a semiconductor substrate and a base substrate is directly bonded to one another, in a protective film removing step, a contamination protective film formed on the semiconductor substrate to protect it from contamination during an ion implanting step is removed. Consequently, even when flatness of the contamination protective film is degraded during the ion implanting step or even when contaminants remain in a segregated state in the vicinity of the surface of the contamination protective film, the state of the bonding between the semiconductor substrate and the base substrate after the bonding step can be made uniform over the entire area of the bonding. As a result, a high-quality semiconductor substrate can be manufactured at low cost.

Abstract: A device for assembling and adjusting an optical unit of the present invention includes an adjusting device including a collimator lens, an object lens, a disk, and a signal sensing system. A light beam output from the optical unit is incident to the collimator lens. Parallel rays output from the collimator lens are incident to the object leans. Further, a spot converged by the object lens is incident to the disk. The signal sensing system receives a light beam reflected by the disk via the object lens to thereby determine a distance between the object lens and the disk and a positional relation between the spot on the disk and the groove of the disk. The device allows the position of a light emitting element to be accurately determined and therefore allows the angular deviation of the intensity distribution of the light emitting element from a designed value to be easily grasped.

Abstract: The invention provides a number of semiconductor substrate manufacturing methods with which, in manufacturing a semiconductor substrate having a semiconductor layer in an insulated state on a supporting substrate, it is possible to obtain a thick semiconductor layer with a simple process and cheaply while reducing impurity contamination of the semiconductor layer to a minimum.

Abstract: Methods for manufacturing semiconductor substrates in which a semiconductor layer for forming semiconductor device therein is formed on a supporting substrate with an insulating film interposed between, with which in forming the semiconductor layer on a substrate on which a buried pattern structure has been formed it is possible to greatly increase the film thickness uniformity of the semiconductor layer and the film thickness controllability, particularly when the semiconductor layer is being formed as an extremely thin film. As a result, it is possible to achieve improved quality and characteristics of the semiconductor substrates and make possible the deployment of such semiconductor substrates to various uses.

Abstract: In a method for producing a semiconductor substrate completed through a bonding process for joining a semiconductor wafer to a support substrate by performing heat treatment thereto in a state in which the semiconductor wafer is closely joined to the support substrate, the method according to the present invention includes the following steps, i.e., a depositing process for depositing a poly-crystal semiconductor which covers all areas of a surface to be bonded on the surface of the semiconductor wafer; a heat treatment process for performing the heat treatment to the semiconductor wafer provided after the depositing process, during a predetermined time under a temperature equal to or higher than the heat treatment temperature at the bonding process; and a polishing process for flattening the surface of the poly-crystal semiconductor provided after the heat treatment process. After the above processes were performed in order, the bonding process is performed after the polishing process.

Abstract: Methods and devices for evaluating solid-state surface properties use infrared absorption of lattice vibration. These methods and devices are characterized by reflection spectrometry by injecting infrared rays from the reverse of the solids, placing a light transmissible solid-state sample in ways that its surface faces the plane reflex mirror on the interaction region formed by reflected infrared rays, or by injecting infrared rays from the rear of a sample or from the front thereof after upright installation of the light transmissible solid-state sample through a slit created across the plane reflex mirror or on the surface of plane reflex mirror. These methods and devices enable simplified and accurate reflection spectrometry of solid-surface properties, featuring an economical system configuration that dispenses with expensive prism, unlike the conventional ATR method.