Patents by Inventor Hisayoshi YOSHII

Hisayoshi YOSHII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10160188
    Abstract: The present invention addresses the problem of increasing the bending strength of a board consisting of paper, the increased bending strength being obtained without largely increasing the thickness of the board. The present invention provides a board consisting of paper, the board comprising a board-shaped structure and a paperboard layer which is adhered to the board-shaped structure. The board-shaped structure includes a core, a first paper liner layer, and a second paper liner layer, the first and second paper liner layers being adhered to the core so that the core is sandwiched and held between the first and second paper liner layers. The paperboard layer is adhered to the first paper liner layer, the thickness of the board-shaped structure is in the range of approximately 15 mm to approximately 40 mm, the thickness of each of the first paper liner layer and the second paper liner layer is in the range of approximately 0.5 mm to approximately 1.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: December 25, 2018
    Assignees: HISAFUMI YOSHII, ECOBOARD CO., LTD.
    Inventor: Hisayoshi Yoshii
  • Publication number: 20180037015
    Abstract: The present invention addresses the problem of increasing the bending strength of a board consisting of paper, the increased bending strength being obtained without largely increasing the thickness of the board. The present invention provides a board consisting of paper, the board comprising a board-shaped structure and a paperboard layer which is adhered to the board-shaped structure. The board-shaped structure includes a core, a first paper liner layer, and a second paper liner layer, the first and second paper liner layers being adhered to the core so that the core is sandwiched and held between the first and second paper liner layers. The paperboard layer is adhered to the first paper liner layer, the thickness of the board-shaped structure is in the range of approximately 15 mm to approximately 40 mm, the thickness of each of the first paper liner layer and the second paper liner layer is in the range of approximately 0.5 mm to approximately 1.
    Type: Application
    Filed: March 4, 2016
    Publication date: February 8, 2018
    Inventor: Hisayoshi YOSHII