Patents by Inventor Hisayuki Abe
Hisayuki Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240074716Abstract: According to one embodiment, an X-ray diagnosis apparatus includes a table, an imaging unit, and processing circuitry. The table includes a table top on which a subject is placed. The imaging unit includes an X-ray tube which emits X-rays to the subject and an X-ray detector which detects the X-rays. The processing circuitry detects contact between an object and at least one of the imaging unit and the table. The processing circuitry executes control to display contact position information relating to a position in contact with the object based on a detection result.Type: ApplicationFiled: September 6, 2023Publication date: March 7, 2024Applicant: Canon Medical Systems CorporationInventors: Keisuke SUGAWARA, Saki HASHIMOTO, Masanori MATSUMOTO, Yoshiyuki SATO, Hisayuki UEHARA, Shingo ABE, Akio TETSUKA
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Patent number: 11869834Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: May 7, 2021Date of Patent: January 9, 2024Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20240008183Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1?dimension d2) is 10 ?m or less.Type: ApplicationFiled: November 15, 2021Publication date: January 4, 2024Applicant: TDK CORPORATIONInventors: Kiryu IKEBE, Tomohisa MITOSE, Akiko SEKI, Susumu TANIGUCHI, Hisayuki ABE
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Patent number: 11668008Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.Type: GrantFiled: December 3, 2020Date of Patent: June 6, 2023Assignee: TDK CORPORATIONInventors: Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe
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Patent number: 11466368Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.Type: GrantFiled: July 26, 2018Date of Patent: October 11, 2022Assignee: TDK CORPORATIONInventors: Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe, Hiroki Ashizawa, Miho Mori, Misaki Tamura
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Patent number: 11410855Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: GrantFiled: August 19, 2020Date of Patent: August 9, 2022Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20210265256Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: ApplicationFiled: May 7, 2021Publication date: August 26, 2021Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Patent number: 11031330Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: March 6, 2020Date of Patent: June 8, 2021Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Patent number: 10968519Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.Type: GrantFiled: July 26, 2018Date of Patent: April 6, 2021Assignee: TDK CORPORATIONInventors: Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe
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Publication number: 20210087692Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.Type: ApplicationFiled: December 3, 2020Publication date: March 25, 2021Applicant: TDK CORPORATIONInventors: Makoto ORIKASA, Yuhei HORIKAWA, Yoshihiro KANBAYASHI, Hisayuki ABE
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Patent number: 10867898Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: July 18, 2018Date of Patent: December 15, 2020Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20200381266Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: ApplicationFiled: August 19, 2020Publication date: December 3, 2020Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Patent number: 10784122Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: GrantFiled: July 18, 2018Date of Patent: September 22, 2020Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20200211951Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: ApplicationFiled: March 6, 2020Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Patent number: 10392704Abstract: A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.Type: GrantFiled: January 25, 2017Date of Patent: August 27, 2019Assignee: TDK CORPORATIONInventors: Kenichi Yoshida, Yuhei Horikawa, Atsushi Sato, Hisayuki Abe
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Patent number: 10374301Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.Type: GrantFiled: December 13, 2017Date of Patent: August 6, 2019Assignee: TDK CORPORATIONInventors: Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka
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Patent number: 10362686Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.Type: GrantFiled: September 23, 2015Date of Patent: July 23, 2019Assignee: TDK CORPORATIONInventors: Tsutomu Yasui, Hisayuki Abe, Kenichi Kawabata, Tomoko Kitamura
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Patent number: 10354796Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.Type: GrantFiled: December 13, 2017Date of Patent: July 16, 2019Assignee: TDK CORPORATIONInventors: Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka
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Patent number: 10354973Abstract: A method for producing a semiconductor chip is a method for producing a semiconductor chip that includes a substrate, a conductive portion formed on the substrate, and a microbump formed on the conductive portion, which includes a smooth surface formation process of forming a smooth surface on the microbump, and the smooth surface formation process includes a heating process of causing a reducing gas to flow in an inert atmosphere into a space where the semiconductor chips are arranged and heated at or higher than a temperature of a melting point of the microbump, and in the heating process, a pressure application member is mounted on the microbump and among principal surfaces of the pressure application member, a principal surface that contacts the microbump is a flat surface.Type: GrantFiled: July 17, 2018Date of Patent: July 16, 2019Assignee: TDK CORPORATIONInventors: Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe
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Patent number: 10304779Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.Type: GrantFiled: October 24, 2017Date of Patent: May 28, 2019Assignee: TDK CORPORATIONInventors: Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe, Yoshihiro Kanbayashi